JPH0463673U - - Google Patents
Info
- Publication number
- JPH0463673U JPH0463673U JP10731390U JP10731390U JPH0463673U JP H0463673 U JPH0463673 U JP H0463673U JP 10731390 U JP10731390 U JP 10731390U JP 10731390 U JP10731390 U JP 10731390U JP H0463673 U JPH0463673 U JP H0463673U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- periphery
- flexible printed
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10731390U JPH0463673U (en18) | 1990-10-12 | 1990-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10731390U JPH0463673U (en18) | 1990-10-12 | 1990-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463673U true JPH0463673U (en18) | 1992-05-29 |
Family
ID=31853765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10731390U Pending JPH0463673U (en18) | 1990-10-12 | 1990-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463673U (en18) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001320158A (ja) * | 2000-05-11 | 2001-11-16 | Sharp Corp | フレキシブル基板へのリードレス部品の実装方法および光ピックアップ装置の製造方法 |
| JP2013175727A (ja) * | 2012-02-23 | 2013-09-05 | Semikron Elektronik Gmbh & Co Kg | 半導体モジュール |
-
1990
- 1990-10-12 JP JP10731390U patent/JPH0463673U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001320158A (ja) * | 2000-05-11 | 2001-11-16 | Sharp Corp | フレキシブル基板へのリードレス部品の実装方法および光ピックアップ装置の製造方法 |
| JP2013175727A (ja) * | 2012-02-23 | 2013-09-05 | Semikron Elektronik Gmbh & Co Kg | 半導体モジュール |