JPH0463488A - Mounting method for electronic component - Google Patents
Mounting method for electronic componentInfo
- Publication number
- JPH0463488A JPH0463488A JP17711590A JP17711590A JPH0463488A JP H0463488 A JPH0463488 A JP H0463488A JP 17711590 A JP17711590 A JP 17711590A JP 17711590 A JP17711590 A JP 17711590A JP H0463488 A JPH0463488 A JP H0463488A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- paste
- electronic component
- wiring board
- ultraviolet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 27
- 239000000843 powder Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 239000011230 binding agent Substances 0.000 claims description 4
- 230000001603 reducing effect Effects 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 238000000859 sublimation Methods 0.000 claims 2
- 230000008022 sublimation Effects 0.000 claims 2
- 230000008646 thermal stress Effects 0.000 abstract description 9
- 239000002904 solvent Substances 0.000 abstract description 3
- 239000010409 thin film Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
各種電子機器の構成に広く使用されるプリント板の電子
部品実装方法に関し、
配線基板および電子部品に熱的ストレスを与えず、且つ
接合強度を確保して容易に端子接合が行える新しい電子
部品の実装方法の提供を目的とし、配線基板の端子パッ
ドに電子部品の端子を接合する方法であって、導電性を
有する粉末と紫外線硬化性樹脂を混合して有機バインダ
で溶いたペーストを上記配線基板の主面全体に塗布し、
当該配線基板の該端子パッドと上記電子部品の該端子と
を位置合わせした後に、当該端子パッドに紫外線レーザ
光を照射して上記ペーストを固化せしめ、該端子パッド
部以外の不要な当該ペーストを除去することにより接合
する。[Detailed Description of the Invention] [Summary] Regarding a method for mounting electronic components on a printed board, which is widely used in the configuration of various electronic devices, the present invention provides a method for mounting electronic components on printed circuit boards that does not apply thermal stress to wiring boards and electronic components, and that ensures bonding strength. The purpose of this method is to provide a new electronic component mounting method that allows for easy terminal bonding, and is a method for bonding electronic component terminals to terminal pads on wiring boards. Apply a paste dissolved with an organic binder to the entire main surface of the wiring board,
After aligning the terminal pad of the wiring board and the terminal of the electronic component, the terminal pad is irradiated with ultraviolet laser light to solidify the paste, and unnecessary paste other than the terminal pad portion is removed. Join by doing.
本発明は、各種電子機器の構成に広く使用されるプリン
ト板の電子部品実装方法に関する。The present invention relates to a method for mounting electronic components on a printed board, which is widely used in the construction of various electronic devices.
最近、各種電算機等の電子回路を構成するプリント板は
、高密度集積化されて多数本の入出力端子が側面よりフ
ラット状に配設された半導体パッケージ（以下電子部品
と略称する）を、プリント配線基板（以下配線基板と略
称する）の表面へ半田付けで高密度実装されているので
、熱に弱い配線基板や電子部品を熱による損傷から保護
する平文てが必要であった。そのため、熱的ストレスを
加えずに且つ接合強度を確保して容易に端子接合が行え
る新しい電子部品の実装方法が要求されている。Recently, the printed circuit boards that make up the electronic circuits of various computers, etc. are semiconductor packages (hereinafter referred to as electronic components) that are highly integrated and have a large number of input/output terminals arranged flat from the side. Since they are mounted at high density by soldering on the surface of printed wiring boards (hereinafter referred to as wiring boards), a plain text was needed to protect the heat-sensitive wiring boards and electronic components from damage caused by heat. Therefore, there is a need for a new electronic component mounting method that allows easy terminal bonding without applying thermal stress and ensuring bonding strength.
〔従来の技術］
従来広く使用されている電子部品の実装方法は、第３図
に示すように、
（ａ）は、実装される電子部品２を配線基板１の主面に
仮装置して、その電子部品２の側面より外側に突出した
各端子２−１の接合面と、前記配線基板１に形成したそ
れぞれ端子パッド１−１を顕微鏡または目視により位置
合わせを行った状態、（ｂ）は、図示していないベーパ
半田槽に挿入して配線基板１の端子パッド１−１表面に
施した半田薄膜１−１８をリフローすることにより接合
した状態、で示す工程順により、配線基板１の主面に電
子部品２が実装されている。[Prior Art] As shown in FIG. 3, the electronic component mounting method that has been widely used in the past is as follows: (a), the electronic component 2 to be mounted is temporarily mounted on the main surface of the wiring board 1; (b) shows a state in which the bonding surfaces of the terminals 2-1 protruding outward from the side surfaces of the electronic component 2 and the respective terminal pads 1-1 formed on the wiring board 1 are aligned using a microscope or visual inspection. , and a state in which the solder thin film 1-18 applied to the surface of the terminal pad 1-1 of the wiring board 1 is bonded by reflowing after being inserted into a vapor solder tank (not shown). Electronic components 2 are mounted on the surface.
また、図示していないが配線基板のそれぞれ端子パッド
表面に導電性を有する接着剤を塗布し、その接着剤を硬
化させることにより電子部品の端子と接合する方法もあ
る。Although not shown, there is also a method of applying a conductive adhesive to the surface of each terminal pad of a wiring board and curing the adhesive to join the terminals of the electronic component.
以上説明した従来の電子部品実装方法で問題となるのは
、ベーパ半田槽に挿入して加熱することにより配線基板
１の端子パッド１−１表面に施した半田薄膜をリフロー
し、その溶融半田で当該端子パッド１−１と電子部品２
の各端子２−１を接合しているので、熱に弱い配線基板
１および電子部品２に対して熱ストレスを与えるという
問題が住じている。The problem with the conventional electronic component mounting method described above is that the solder thin film applied to the surface of the terminal pad 1-1 of the wiring board 1 is reflowed by inserting it into a vapor solder bath and heating it, and the molten solder The terminal pad 1-1 and electronic component 2
Since each of the terminals 2-1 are bonded to each other, there is a problem in that thermal stress is applied to the wiring board 1 and the electronic components 2, which are sensitive to heat.
また、導電性を有する接着剤では一般に粘着性接合とな
るため、接合強度が低かったり或いは接合に多くの作業
時間を要するという問題も生じている。Furthermore, since conductive adhesives generally result in adhesive bonding, there are also problems in that the bonding strength is low or that bonding requires a lot of work time.
本発明は上記のような問題点に鑑み、配線基板および電
子部品に熱的ストレスを与えず、且つ接合強度を確保し
て容易に端子接合が行える新しい電子部品の実装方法の
提供を目的とする。In view of the above-mentioned problems, an object of the present invention is to provide a new electronic component mounting method that does not apply thermal stress to wiring boards and electronic components, secures bonding strength, and facilitates terminal bonding. .
本発明は、第１図および第２図に示すように配線基板１
の端子パッド１−１に電子部品２の端子２１を接合する
方法であって、導電性を有する粉末と紫外線硬化性樹脂
を混合して有機バインダで溶いたペース目３を上記配線
基板１の主面全体に塗布して、当該配線基板１の該端子
パッド１−１と上記電子部品２の該端子２−１とを位置
合わせした後に、当該端子パッド１−１に紫外線レーザ
光１４を照射して上記ペースト１３を固化せしめ、該端
子パッド１−１部以外の不要な当該ベース）１３の除去
することにより接合する。The present invention provides a wiring board 1 as shown in FIGS. 1 and 2.
A method of bonding a terminal 21 of an electronic component 2 to a terminal pad 1-1 of a wiring board 1, in which a paste 3 made by mixing a conductive powder and an ultraviolet curable resin and melting the mixture with an organic binder is used as the main component of the wiring board 1. After coating the entire surface and aligning the terminal pad 1-1 of the wiring board 1 and the terminal 2-1 of the electronic component 2, the terminal pad 1-1 is irradiated with ultraviolet laser light 14. The paste 13 is solidified, and the unnecessary portions of the base 13 other than the terminal pad 1-1 are removed to perform bonding.
本発明では、第１図に示す如く配線基板１の主面全体に
導電性を有する粉末と紫外線硬化性樹脂を含むペースト
１３を塗布して、その配線基板１の端子パッド１−１と
電子部品２の端子２−１とを位置合わせした後、第２図
（ａ）の斜交線で示す範囲のみ紫外線レーザ光１４を照
射して固化し、第１図に示すようにそれ以外のペースト
１３を溶剤で除去することにより、第２図（ハ）の断面
図に示すように配線基板１の端子パッド１−１ と電子
部品２の端子２−１とが導電性を有する粉末と紫外線硬
化性樹脂で接合されるので、配線基板１と電子部品２に
熱的なストレスを与えずに容易に接合できるとともに、
導電性接着剤による接合に比較して強固な端子接合を得
ることが可能となる。In the present invention, as shown in FIG. 1, a paste 13 containing conductive powder and an ultraviolet curable resin is applied to the entire main surface of the wiring board 1, and the terminal pads 1-1 of the wiring board 1 and the electronic components are coated. After aligning the paste 13 with the terminal 2-1 of 2, only the area indicated by the diagonal lines in FIG. As shown in the cross-sectional view of FIG. 2(c), the terminal pad 1-1 of the wiring board 1 and the terminal 2-1 of the electronic component 2 are made of conductive powder and ultraviolet curable powder. Since they are bonded using resin, they can be easily bonded without applying thermal stress to the wiring board 1 and electronic components 2, and
It becomes possible to obtain stronger terminal bonding compared to bonding using a conductive adhesive.
〔実 施 例］
以下第１図および第２図について本発明の詳細な説明す
る。[Example] The present invention will be described in detail below with reference to FIGS. 1 and 2.
第１図は本発明の一実施例による電子部品の実装方法を
示す工程順斜視図、第２図は本実施例の接合部詳細の拡
大図を示し、図中において、第３図と同一部材には同一
記号が付しであるが、その他の１３は配線基板の端子パ
ッドと電子部品の端子を接合する導電性を備えたペース
ト、１４は電子部品の端子接合部へ照射して前記ペース
トを固化するレーザ光である。FIG. 1 is a perspective view of the process order showing a method for mounting electronic components according to an embodiment of the present invention, and FIG. 2 is an enlarged view of the details of the joint of this embodiment. are given the same symbols, the other 13 is a paste with conductivity that joins the terminal pad of the wiring board and the terminal of the electronic component, and 14 is a paste that is applied by irradiating the terminal joint part of the electronic component. It is a laser beam that solidifies.
ペースト１３は、一定の混合率となるように導電性を有
する粉末２例えば銅粉末と、紫外線硬化性樹脂２例えば
感光性エポキシ樹脂を有機バインダで熔いて４００〜６
０００ ＣＰＳの粘度に形成したものである
また、ペースト固化時に端子接合部間に存在する樹脂を
一部除去されて、ペースト１３内の導電性粉末の接触が
容易となって導体抵抗を改善できるように紫外線硬化性
樹脂に紫外線昇華性樹脂を混入しても良（、更に、ペー
ス目３中の金属粉末は銅粉に限らず選択は可能であるが
、当該金属粉末の酸化を防止する目的でガラス粉末等の
酸化物を含ませて還元作用を持たせても良い。The paste 13 is made by melting a conductive powder 2 such as copper powder and an ultraviolet curable resin 2 such as a photosensitive epoxy resin with an organic binder so as to have a constant mixing ratio.
000 CPS. Also, when the paste solidifies, a portion of the resin present between the terminal joints is removed, making it easier for the conductive powder in the paste 13 to come into contact with each other, thereby improving conductor resistance. (Additionally, the metal powder in paste number 3 can be selected other than copper powder, but for the purpose of preventing oxidation of the metal powder.) An oxide such as glass powder may be included to provide a reducing effect.
レーザ光１４は、ＸｅＣ１またはＫｒＦのガス組み合わ
せによって得られるエキシマ（ｅｘｃｉｍｅｒ）レーザ
ー装置から出射して、紫外線硬化性樹脂を固化する３
０８ ｎｍまたは２４８ｎｍの紫外線である。Laser light 14 is emitted from an excimer laser device obtained by a gas combination of XeCl or KrF to solidify the ultraviolet curable resin 3
08 nm or 248 nm ultraviolet light.
上記ペーストとレーザ光を使用した電子部品の実装方法
は、第１図の工程順斜視図に示すように、（ａ）は、配
線基板１の実装主面側にペースト１３を滴下し、そのペ
ースト１３を例えばスピンコードして配線基板１の実装
側全面に一定厚みの薄膜を形成した状態、
（ｂ）は、ペースト１３薄膜の上面に実装する電子部品
２を載置し、その電子部品２の各端子２−１と前記配線
基板１に形成した図示していないそれぞれ端子パッドと
を位置合わせを行い、その前記ペース目３薄膜に含まれ
る揮発性溶剤を乾燥させた状態、
（Ｃ）は、前記ペースト１３の薄膜上面に載置された電
子部品２のそれぞれ端子２−１に対して、エキシマレー
ザ−からの紫外線出射とガルバノ式スキャナーの駆動同
期により紫外線レーザ光１４を、第２図（ａ）に示すよ
うに配線基板１の端子パッド１−１の斜交線で示す範囲
のみに必要量照射してペースト１３を固化した状態、
（ｄ）は、上記配線基板１を溶剤洗浄することにより紫
外線の照射で固化した部分以外の不要なペースト１３を
除去した状態、
の工程順により、第２図（ｂ）に示すように配線基板ｌ
の主面に電子部品２を接合している。The electronic component mounting method using the above paste and laser beam is as shown in the perspective view of the process order in FIG. 13 is spin-coded to form a thin film of a constant thickness on the entire surface of the mounting side of the wiring board 1. (b) shows the state in which the electronic component 2 to be mounted is placed on the top surface of the thin film of the paste 13, and the electronic component 2 is (C) is a state in which each terminal 2-1 and each terminal pad (not shown) formed on the wiring board 1 are aligned, and the volatile solvent contained in the paste 3 thin film is dried; The ultraviolet laser beam 14 is applied to each terminal 2-1 of the electronic component 2 placed on the upper surface of the thin film of the paste 13 by synchronizing the ultraviolet emission from the excimer laser and the drive of the galvano scanner as shown in FIG. 2(a). ), the paste 13 is solidified by irradiating the necessary amount only to the area indicated by the diagonal lines of the terminal pad 1-1 of the wiring board 1, and (d) shows the state in which the paste 13 is solidified by cleaning the wiring board 1 with a solvent. After removing the unnecessary paste 13 other than the part solidified by ultraviolet irradiation, the wiring board 1 is made as shown in FIG. 2(b) according to the process order.
An electronic component 2 is bonded to the main surface.
その結果、配線基板１と電子部品２に熱的なストレスを
与えずに容易に接合できるとともに強固な端子接合を得
ることができる。As a result, wiring board 1 and electronic component 2 can be easily bonded without applying thermal stress, and strong terminal bonding can be obtained.
〔発明の効果］
以上の説明から明らかなように本発明によれば極めて簡
単な方法で、配線基板と電子部品に熱的なストレスを与
えずに容易に接合できるとともに強固な端子接合を得る
ことができる等の利点があり、著しい経済的及び、信輔
性向上の効果が期待できる電子部品の実装方法を提供す
ることができる。[Effects of the Invention] As is clear from the above description, according to the present invention, it is possible to easily bond the wiring board and electronic components without applying thermal stress and to obtain strong terminal bonding by an extremely simple method. It is possible to provide an electronic component mounting method that can be expected to have significant economic and reliability effects.
第１図は本発明の一実施例による電子部品の実装方法を
示す工程順斜視図、
第２図は本実施例の接合部詳細を示す拡大図、第３図は
従来の電子部品の実装方法を示す工程順斜視図である。
図において、
１は配線基板、
は端子パン
２は電子部品、
は端子、
１３はペースト、
１４はレーザ光、
ド、
を示す。FIG. 1 is a perspective view of the process order showing a method for mounting electronic components according to an embodiment of the present invention, FIG. 2 is an enlarged view showing details of the joint of this embodiment, and FIG. 3 is a conventional mounting method for electronic components. It is a process order perspective view which shows. In the figure, 1 is a wiring board, 2 is a terminal pan 2 is an electronic component, 1 is a terminal, 13 is a paste, 14 is a laser beam, and .
Claims (4)
品（２）の端子（２−１）を接合する方法であって、導
電性を有する粉末と紫外線硬化性樹脂を混合して有機バ
インダで溶いたペースト（１３）を上記配線基板（１）
の主面全体に塗布し、当該配線基板（１）の該端子パッ
ド（１−１）と上記電子部品（２）の該端子（２−１）
とを位置合わせした後に、当該端子パッド（１−１）に
紫外線レーザ光（１４）を照射して上記ペースト（１３
）を固化せしめ、該端子パッド（１−１）部以外の不要
な当該ペースト（１３）の除去することにより接合して
なることを特徴とする電子部品の実装方法。(1) A method of bonding the terminal (2-1) of an electronic component (2) to the terminal pad (1-1) of a wiring board (1), which involves mixing conductive powder and ultraviolet curable resin. The paste (13) dissolved with organic binder is applied to the above wiring board (1).
The terminal pad (1-1) of the wiring board (1) and the terminal (2-1) of the electronic component (2) are coated on the entire main surface of the wiring board (1).
After aligning the terminal pads (1-1) with ultraviolet laser light (14), the paste (13)
) is solidified, and the unnecessary paste (13) other than the terminal pad (1-1) is removed to join the parts.
よび紫外線硬化性樹脂と紫外線昇華性樹脂を混合したこ
とを特徴とする請求項１記載の電子部品の実装方法。(2) The electronic component mounting method according to claim 1, wherein the paste (13) is a mixture of conductive powder, an ultraviolet curable resin, and an ultraviolet sublimation resin.
外線硬化性樹脂と、当該導電性粉末の還元用酸化物粉末
を混入したことを特徴とする請求項１記載の電子部品の
実装方法。(3) The electronic component mounting method according to claim 1, wherein the paste (13) contains a conductive powder, an ultraviolet curable resin, and an oxide powder for reducing the conductive powder.
外線硬化性樹脂と紫外線昇華性樹脂と、当該導電性粉末
の還元用酸化物粉末を混入したことを特徴とする請求項
１記載の電子部品の実装方法。(4) The electronic device according to claim 1, wherein the paste (13) contains a conductive powder, an ultraviolet curable resin, an ultraviolet sublimation resin, and an oxide powder for reducing the conductive powder. How to mount parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17711590A JPH0463488A (en) | 1990-07-03 | 1990-07-03 | Mounting method for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17711590A JPH0463488A (en) | 1990-07-03 | 1990-07-03 | Mounting method for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463488A true JPH0463488A (en) | 1992-02-28 |
Family
ID=16025426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17711590A Pending JPH0463488A (en) | 1990-07-03 | 1990-07-03 | Mounting method for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463488A (en) |
-
1990
- 1990-07-03 JP JP17711590A patent/JPH0463488A/en active Pending
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