JPH0463154U - - Google Patents
Info
- Publication number
- JPH0463154U JPH0463154U JP10436090U JP10436090U JPH0463154U JP H0463154 U JPH0463154 U JP H0463154U JP 10436090 U JP10436090 U JP 10436090U JP 10436090 U JP10436090 U JP 10436090U JP H0463154 U JPH0463154 U JP H0463154U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- strip
- metal foil
- pin
- strips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims 5
- 238000010030 laminating Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案の多ピンリードフレームの平
面図である。第２図は第１図の線−の断面図
である。第３図は、外部リードとインナーリード
の接合部分を示す拡大斜視図である。第４図は、
インナーリードの拡大平面図である。第５図は、
インナーリードを作成する積層体の斜視図である
。
１……リードフレーム、２……アイランド部、
３……外部リード、４……インナーリード、５…
…金属部、６……絶縁シート。
FIG. 1 is a plan view of the multi-pin lead frame of the present invention. FIG. 2 is a sectional view taken along the line - in FIG. 1. FIG. 3 is an enlarged perspective view showing the joint portion between the outer lead and the inner lead. Figure 4 shows
FIG. 3 is an enlarged plan view of the inner lead. Figure 5 shows
FIG. 3 is a perspective view of a laminate for making an inner lead. 1...Lead frame, 2...Island part,
3...External lead, 4...Inner lead, 5...
...Metal part, 6...Insulating sheet.
Claims (1)
端部に接合されたインナーリードを有し、該イン
ナーリードが１方向に集束するように並べられた
複数の金属箔のストリツプと、各々が隣接する該
金属箔のストリツプ間に配置されて該金属箔のス
トリツプを所定の間隔で支持する複数の絶縁性シ
ートのストリツプとから成る、ことを特徴とする
多ピンリードフレーム。 (2) 請求項１記載の多ピンリードフレームにお
いて、前記インナーリードが金属箔と絶縁性シー
トとを交互に積層して得た積層体を積層方向に対
して平行に切断して得た薄膜である、ことを特徴
とする多ピンリードフレーム。 (3) 請求項１記載の多ピンリードフレームにお
いて、前記絶縁性シートのストリツプが前記金属
箔のストリツプの少なくとも両端に配置されてい
る、ことを特徴とする多ピンリードフレーム。[Claims for Utility Model Registration] (1) The lead portion has an outer lead and an inner lead joined to the tip of the outer lead, and a plurality of metals arranged so that the inner leads are converged in one direction. A multi-pin lead comprising a strip of foil and a plurality of strips of insulating sheets, each strip of insulating sheet being disposed between adjacent strips of the metal foil and supporting the strips of metal foil at predetermined intervals. flame. (2) In the multi-pin lead frame according to claim 1, the inner lead is a thin film obtained by cutting a laminate obtained by alternately laminating metal foil and insulating sheets in parallel to the lamination direction. A multi-pin lead frame characterized by: (3) The multi-pin lead frame according to claim 1, wherein the strip of the insulating sheet is arranged at least at both ends of the strip of metal foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990104360U JP2500561Y2 (en) | 1990-10-03 | 1990-10-03 | Multi-pin lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990104360U JP2500561Y2 (en) | 1990-10-03 | 1990-10-03 | Multi-pin lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0463154U true JPH0463154U (en) | 1992-05-29 |
| JP2500561Y2 JP2500561Y2 (en) | 1996-06-05 |
Family
ID=31849603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990104360U Expired - Fee Related JP2500561Y2 (en) | 1990-10-03 | 1990-10-03 | Multi-pin lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2500561Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5895657U (en) * | 1981-12-23 | 1983-06-29 | 日本電気株式会社 | Lead frame for integrated circuits |
-
1990
- 1990-10-03 JP JP1990104360U patent/JP2500561Y2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5895657U (en) * | 1981-12-23 | 1983-06-29 | 日本電気株式会社 | Lead frame for integrated circuits |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2500561Y2 (en) | 1996-06-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |