JPH0463148U - - Google Patents

Info

Publication number
JPH0463148U
JPH0463148U JP10371490U JP10371490U JPH0463148U JP H0463148 U JPH0463148 U JP H0463148U JP 10371490 U JP10371490 U JP 10371490U JP 10371490 U JP10371490 U JP 10371490U JP H0463148 U JPH0463148 U JP H0463148U
Authority
JP
Japan
Prior art keywords
resin
conductor circuit
sealed
encapsulation
metal cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10371490U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10371490U priority Critical patent/JPH0463148U/ja
Publication of JPH0463148U publication Critical patent/JPH0463148U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP10371490U 1990-10-02 1990-10-02 Pending JPH0463148U (US07122547-20061017-C00224.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10371490U JPH0463148U (US07122547-20061017-C00224.png) 1990-10-02 1990-10-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10371490U JPH0463148U (US07122547-20061017-C00224.png) 1990-10-02 1990-10-02

Publications (1)

Publication Number Publication Date
JPH0463148U true JPH0463148U (US07122547-20061017-C00224.png) 1992-05-29

Family

ID=31848692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10371490U Pending JPH0463148U (US07122547-20061017-C00224.png) 1990-10-02 1990-10-02

Country Status (1)

Country Link
JP (1) JPH0463148U (US07122547-20061017-C00224.png)

Similar Documents

Publication Publication Date Title
JPH0463148U (US07122547-20061017-C00224.png)
JPS5858352U (ja) 樹脂封止型半導体装置
JPS6448051U (US07122547-20061017-C00224.png)
JPS63195743U (US07122547-20061017-C00224.png)
JPH0328756U (US07122547-20061017-C00224.png)
JPS6138944U (ja) 半導体装置
JPS6389254U (US07122547-20061017-C00224.png)
JPH0231149U (US07122547-20061017-C00224.png)
JPS6416640U (US07122547-20061017-C00224.png)
JPH0226261U (US07122547-20061017-C00224.png)
JPS62160468U (US07122547-20061017-C00224.png)
JPH0221745U (US07122547-20061017-C00224.png)
JPH0317636U (US07122547-20061017-C00224.png)
JPS6420738U (US07122547-20061017-C00224.png)
JPH02122436U (US07122547-20061017-C00224.png)
JPH0336141U (US07122547-20061017-C00224.png)
JPH0463147U (US07122547-20061017-C00224.png)
JPH0254240U (US07122547-20061017-C00224.png)
JPS63165854U (US07122547-20061017-C00224.png)
JPH01116460U (US07122547-20061017-C00224.png)
JPS5827971U (ja) 樹脂封止型電子機器
JPS61125054U (US07122547-20061017-C00224.png)
JPS63164239U (US07122547-20061017-C00224.png)
JPH02108363U (US07122547-20061017-C00224.png)
JPS6336072U (US07122547-20061017-C00224.png)