JPH0463110B2 - - Google Patents
Info
- Publication number
- JPH0463110B2 JPH0463110B2 JP60049897A JP4989785A JPH0463110B2 JP H0463110 B2 JPH0463110 B2 JP H0463110B2 JP 60049897 A JP60049897 A JP 60049897A JP 4989785 A JP4989785 A JP 4989785A JP H0463110 B2 JPH0463110 B2 JP H0463110B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- adhesive
- radiation
- ultraviolet absorber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 15
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 15
- 239000000178 monomer Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 claims description 4
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 claims description 2
- 229960000969 phenyl salicylate Drugs 0.000 claims description 2
- ZCILGMFPJBRCNO-UHFFFAOYSA-N 4-phenyl-2H-benzotriazol-5-ol Chemical compound OC1=CC=C2NN=NC2=C1C1=CC=CC=C1 ZCILGMFPJBRCNO-UHFFFAOYSA-N 0.000 claims 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 239000012986 chain transfer agent Substances 0.000 claims 1
- 229920006395 saturated elastomer Polymers 0.000 claims 1
- 239000002313 adhesive film Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000006096 absorbing agent Substances 0.000 description 5
- -1 polyol acrylates Chemical class 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- RKYJPYDJNQXILT-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxycarbonyl)benzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OCCOC(=O)C=C RKYJPYDJNQXILT-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- WQAQPCDUOCURKW-UHFFFAOYSA-N butanethiol Chemical compound CCCCS WQAQPCDUOCURKW-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000005865 ionizing radiation Effects 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 2
- 229960001860 salicylate Drugs 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- HJUGFYREWKUQJT-UHFFFAOYSA-N tetrabromomethane Chemical compound BrC(Br)(Br)Br HJUGFYREWKUQJT-UHFFFAOYSA-N 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- YHCGGLXPGFJNCO-UHFFFAOYSA-N 2-(2H-benzotriazol-4-yl)phenol Chemical compound OC1=CC=CC=C1C1=CC=CC2=C1N=NN2 YHCGGLXPGFJNCO-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- 229920000536 2-Acrylamido-2-methylpropane sulfonic acid Polymers 0.000 description 1
- XHZPRMZZQOIPDS-UHFFFAOYSA-N 2-Methyl-2-[(1-oxo-2-propenyl)amino]-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(C)(C)NC(=O)C=C XHZPRMZZQOIPDS-UHFFFAOYSA-N 0.000 description 1
- WAJJFPMYKWCDNI-UHFFFAOYSA-N 2-[hydroxy(2-prop-2-enoyloxyethoxy)phosphoryl]oxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOP(=O)(O)OCCOC(=O)C=C WAJJFPMYKWCDNI-UHFFFAOYSA-N 0.000 description 1
- NXBXJOWBDCQIHF-UHFFFAOYSA-N 2-[hydroxy-[2-(2-methylprop-2-enoyloxy)ethoxy]phosphoryl]oxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOP(O)(=O)OCCOC(=O)C(C)=C NXBXJOWBDCQIHF-UHFFFAOYSA-N 0.000 description 1
- UDXXYUDJOHIIDZ-UHFFFAOYSA-N 2-phosphonooxyethyl prop-2-enoate Chemical compound OP(O)(=O)OCCOC(=O)C=C UDXXYUDJOHIIDZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- HFBMWMNUJJDEQZ-UHFFFAOYSA-N acryloyl chloride Chemical compound ClC(=O)C=C HFBMWMNUJJDEQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000007718 adhesive strength test Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- WXNRYSGJLQFHBR-UHFFFAOYSA-N bis(2,4-dihydroxyphenyl)methanone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O WXNRYSGJLQFHBR-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 150000002019 disulfides Chemical class 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- DNPFOADIPJWGQH-UHFFFAOYSA-N octan-3-yl prop-2-enoate Chemical compound CCCCCC(CC)OC(=O)C=C DNPFOADIPJWGQH-UHFFFAOYSA-N 0.000 description 1
- MADOXCFISYCULS-UHFFFAOYSA-N octyl 2-sulfanylacetate Chemical compound CCCCCCCCOC(=O)CS MADOXCFISYCULS-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Chemical group 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
〔産業上の利用分野〕
本発明は放射線硬化型粘着剤組成物に関する。
〔従来の技術〕
従来、粘着フイルムは、天然ゴムや合成ゴムな
どの高分子重合体を有機溶剤に溶解した粘着剤
を、プラスチツクフイルムなどのウエブ上に塗
布・乾燥することによつて製造されている。しか
し近年、省資源・省エネルギ及び無公害化の点か
ら粘着剤無溶剤化が検討されている。
その際に用いられる重合体成分は、粘度上の制
約から低分子量であるため、単独ではポリマ固有
のゴム弾性が損われ、粘着剤として必要な接着力
などの特性を出せない。そこで連鎖移動剤や極性
基を有するモノマなどを配合して、これらの特性
を補なうなどの工夫がされてきた。
しかしながら、ここで用いる重合体成分が耐候
性に優れていても、上記のような低分子量物を配
合し、放射線硬化させることによつて得られた粘
着フイルムは著しく耐候性が阻害される傾向にあ
つた。
すなわち、この粘着フイルムを被着体に貼付け
太陽光のもとに晒すと粘着剤が被着体に転着し、
この程度の大きいものはフイルムが剥離不能にな
る。さらに劣化するとフイルムが被着体から自然
に剥離するなどの事態が生ずる。
〔発明が解決しようとする問題点〕
そこで耐候性向上策として、従来から行われて
いる方法があるが、紫外線吸収剤の添加を試み
た。しかし通常添加量である0.1部以下ではその
向上にほとんど効果がなく、また従来の紫外線吸
収剤では、放射線硬化型オリゴマとの相溶性が悪
いため、0.1部以上添加し、放射線硬化して得ら
れた粘着フイルムを被着体に貼付けるとそれらが
被着体にブリードアウトするなどの問題があつ
た。
本発明はかゝる状況に鑑みなされたものであつ
て、紫外線吸収剤のプリードアウトがなく、粘着
特性、耐候性などにすぐれた粘着フイルム用放射
線硬化型粘着剤を提供せんとするものである。
〔問題点を解決するための手段〕
すなわち本発明は不飽和二重結合を分子内に有
する液状オリゴマを主成分とする粘着剤組成物
に、放射線により重合する不飽和二重結合を付与
した紫外線吸収剤を配合することを特徴とする。
本発明において用いられる放射線重合を行う不
飽和二重結合を付与した紫外線吸収剤としては、
分子骨格がフエニルサリチレート、2−(または
4−)ヒドロキシベンゾフエノン、2(2′−ヒド
ロキシフエニル)ベンゾトリアゾールなどのよう
に光エネギを吸収して熱エネルギに変換できる分
子構造を持つたもので、かつ不飽和二重結合を1
分子あたり1個以上有する必要がある。不飽和二
重結合としては、ビニル、ビニルエーテル、ビニ
ルエステル、アクリル、メタクリル基などを含む
が、本発明において特に良好な結果が得られるの
は、反応性が高くかつ特に耐候性の優れたアクリ
ル、メタクリル基を付与した紫外線吸収剤であ
る。これらは単独で用いてもよいし、また2種以
上混合して用いてもよいが、その添加総量はオリ
ゴマ100重量に対し0.1〜30重量部の範囲で選ばれ
る。この量が0.1重量部以下では耐候性向上に効
果が不十分であるし、30重量部以上添加すると粘
着特性(接着力、放射線硬化性)が悪化する。さ
らに好ましい添加量の範囲は1〜15重量部であ
る。
本発明で用いられる不飽和二重結合を分子内に
有するオリゴマとしては、主鎖がアクリル酸アル
キルエステルあるいはメタクリル酸アルキルエス
テルをはじめ、ポリオールアクリレート、ポリエ
ステルアルキレート、ウレタンアクリレート、エ
ポキシアクレートなど不飽和二重結合を1分子あ
たり分子内に1個以上、末端あるいは側鎖にもつ
アクリル系オリゴマ、ポリブタジエン、ポリクロ
ロプレン、ポリイソプレン等のプレポリマであ
る。またそのオリゴマは通常液状であつて、その
粘度としては常温で102〜5×105cpsの範囲であ
る。なお本発明において特に良好な結果が得られ
るのは反応性の高いアクリル系の2重結合を付与
したオリゴマである。
またオリゴマ以外の粘着剤組成物としての連鎖
移動剤としてはブチルメルカプタン、ラウリルメ
ルカプタン、チオグリコール酸オクチル、エチレ
ングリコールジチオグリコート、ペンタエリスト
リトールテトラキス―(β−チオプロピオネート)
などのチオール化合物、ジフエニルジスルフイド
などの二硫化物、あるいは四塩化炭素、四臭化炭
素、クロホルム、ジクロロベンゼンなどのハロゲ
ン化物が挙げられる。これらは単独で用いてもよ
いし、また2種以上混合して用いてもよい。これ
らの連鎖移動剤は、放射線硬化時の過剰に架橋す
るのを抑制するために添加される。その目的のた
めにはその添加量を0.2〜20重量%、好ましくは、
2〜15重量%の範囲で選択する必要がある。この
量が0.2重量%未満では架橋抑制の効果が不十分
であるし、20重量%を越えると硬化不十分で凝集
力不足で接着特性に悪影響を与える。
他方、本発明で用いられる極性基を有するモノ
マーとしては、アクリル酸、メタクリル酸、イタ
コン酸、マレイン酸、クロトン酸、フタル酸水素
アクリロイルオキシエチル、2−アクリルアミド
−2−メチルプロパン−スルホン酸、3−クロロ
−2−アシツドホスホキシプロピルメタクリレー
ト、2−アシツドホスホオキシエチルアクリレー
ト、2−アシツドホスホオキシプロピルメタクリ
レート、リン酸ジ(2−メタクリロイルオキシエ
チル)、リン酸ジ(2−アクリロイルオキシエチ
ル)などを挙げることができる。特に有利なの
は、解離定数の大きいリン酸根を付与したモノマ
ーである。
これらの酸性基を有するモノマの添加量は0.5
〜30重量部の範囲で選ばれる。この量が0.5重量
%未満では、界面力の効果が不十分であるし、30
重量%を越えると、放射線効果性、効果塗膜の物
性が低下するので好ましくない。なお本発明の実
施においては、以上述べたような組成物の他に、
希釈用モノマ、粘着付与剤等の添加剤を加えても
よく、少量の溶剤を加えることも自由である。
本発明でいる放射線とは活性エネルギー線で、
α線、β線、γ線、中性子線、加速電子線のよう
な電離性放射線並びに紫外線という。電離性放射
線の場合の線量は0.5〜50Mradの範囲で使用でき
るが、1〜10Mrad程度が望ましい。また紫外線
の場合約180尾460nmの波長範囲で、発生源とし
ては高圧の水銀ランプ等が適している。また照射
する場合注意を要するのは照射雰囲気である。つ
まり発生したラジカルが空気中の酸素によつて阻
害されるので、場合によつては窒素などの不活性
ガスを用いて適当な酸素濃度にする必要がある。
〔作用〕
本発明で得られる粘着テープは良好なゴム弾
性、接着性にすぐれしかも耐候性にすぐれてい
る。耐候性向上の理由は通常の紫外線吸収剤に不
飽和二重結合を付与させた結果、オリゴマなどの
粘着剤組成物との相溶性が向上し、大量添加が可
能になつた事である。また添加したうちの大半は
放射線硬化し、共有結合で系内に組み込まれてい
るため、凝集力に優れ簡単にプリードアウトしな
いためである。
さらに紫外線吸収剤に不飽和二重結合を導入す
ることで、紫外線吸収剤の光←→熱交換機能に悪影
響は及ぼさない。
以下実施例により、更に本発明を説明する。
(1) 放射線硬化型オリゴマの合成
(1‐a) アクリル酸エチル10部、アクリル酸ブチル
70部、アクリル酸メタグリシジル20部を30%
の溶液中で溶液重合を行い、脱溶剤して粘度
が50℃−1×104cpsの無溶剤の共重合体を合
成した。次にこの共重合プレオリゴマにアク
リル酸5部を付加反応させ、側鎖に二重結合
を付与された。
(1‐b) α−エチルヘキシルアクリレート75部、メ
チルメタクリレート15部、アクリル酸メタグ
リシジル10部を上記(1−a)と同様の方法
で共重合し、側鎖に二重結合を付与させた。
(2) 不飽和二重結合付与紫外線吸収剤の合成
(2‐a) 2,2′,4,4′−テトラヒドロキシベンゾ
フエノン1molに対し、水酸化ナトリウム2
molをメタノール300ml中50℃で反応させ、
水分を完全に除去した後、10wt%MEK中10
℃で2molのアクリル酸クロライドで反応さ
せ、反応物を蒸留精製した。
(2‐b) 2′,4′−ジヒドロキシフエニルサリチレー
トについて、(2−a)と同様にして合成を
行つた。
実施例 1
(1−a)で合成したオリゴマ100重量部に対
し、ペンタエリスリトールテトラキス―(βチオプ
ロピオネート)10重量部、リン酸ジ(2−アクリ
ロイルオキシエチル)10重量部、および(2−
a)で合成した紫外線吸収剤0.1重量部を加え粘
着剤組成とした。
実施例 2
紫外線吸収剤の量を10重量部とした以外は実施
例1に倣つて粘着剤組成物とした。
比較例 1、2、3
実施例1の配合より紫外線吸収剤を除いたもの
を比較例1、紫外線吸収剤として2,2′,4,
4′−テトラヒドロキシベンゾフエノン0.05重量部
を添加したものを比較例2、0.1重量部添加した
ものを比較例3とした。
実施例 3
(1−b)で合成したオリゴマ100重量部、ブ
チルメチルカプタン5重量部、フタル酸水素アク
ロイルオキシエチル15重量部、および(2−b)
で合成した紫外線吸収剤5重量部を加え粘着剤組
成物とした。
実施例 4
紫外線吸収剤の量を15重量部とした以外は実施
例3に倣つて粘着剤組成物とした。
比較例 4、5、6
実施例3の配合より紫外線吸収剤を除いたもの
を比較例4、紫外線吸収剤として2′,4′−ジヒド
ロキシフエニルサリチレートを0.05重量部添加し
たものを比較例5、0.1重量部添加したものを比
較例6とした。
これら組成物をポリエチレンフイルム(厚さ
60μm)に塗布厚みが10μmになるように塗布し、
加速電圧200kV、ビーム電流10mAの電子線照射
装置(リニアフイラメント型、Energy Science
Inc 製、商品名エレクトロカーテン)で、窒素
ガス雰囲気(O2濃度500ppm)下で6Mrad照射
し、粘着フイルムを作成した。この粘着フイルム
をテンシロン型引張試験機で接着力試験を行つ
た。引張速度は20mm/min(20℃)である。
またSUS−430BA板に貼付け2時間後剥離し、
板面に粘着剤が纒着しているかどうかを目視によ
つて観察して硬化製試験を行つた。硬化製試験で
異常のない粘着フイルムについて、サンシヤイン
ウエザメータで耐候性の促進試験を行つた。
(ATLAS CDMC型、密閉カーボンアーク式)結
果を表1に示す。
[Industrial Field of Application] The present invention relates to a radiation-curable adhesive composition. [Prior Art] Conventionally, adhesive films have been manufactured by applying an adhesive prepared by dissolving a high molecular weight polymer such as natural rubber or synthetic rubber in an organic solvent onto a web such as a plastic film and drying it. There is. However, in recent years, consideration has been given to making adhesives solvent-free from the viewpoint of resource saving, energy saving, and pollution-free production. The polymer component used in this case has a low molecular weight due to viscosity constraints, so if used alone, the rubber elasticity inherent to the polymer will be impaired and the adhesive force and other properties necessary for the adhesive cannot be achieved. Therefore, efforts have been made to compensate for these characteristics by adding chain transfer agents and monomers with polar groups. However, even if the polymer component used here has excellent weather resistance, the weather resistance of the adhesive film obtained by incorporating the above-mentioned low molecular weight substances and curing with radiation tends to be significantly impaired. It was hot. In other words, when this adhesive film is attached to an adherend and exposed to sunlight, the adhesive transfers to the adherend.
If the size is this large, the film cannot be peeled off. Further deterioration may result in the film spontaneously peeling off from the adherend. [Problems to be Solved by the Invention] Therefore, as a measure to improve weather resistance, there is a conventional method, but an attempt was made to add an ultraviolet absorber. However, if it is added in an amount of less than 0.1 part, which is the usual amount, it has little effect on improving the UV absorber, and conventional ultraviolet absorbers have poor compatibility with radiation-curable oligomers. When the adhesive film was attached to an adherend, there were problems such as bleed-out of the adhesive film onto the adherend. The present invention was made in view of the above situation, and it is an object of the present invention to provide a radiation-curable adhesive for adhesive films that does not cause the UV absorber to bleed out and has excellent adhesive properties, weather resistance, etc. . [Means for Solving the Problems] That is, the present invention provides an adhesive composition mainly composed of a liquid oligomer having unsaturated double bonds in the molecule, which is provided with unsaturated double bonds that polymerize when exposed to ultraviolet rays. It is characterized by containing an absorbent. The ultraviolet absorber with an unsaturated double bond that undergoes radiation polymerization used in the present invention includes:
A molecular structure whose molecular skeleton can absorb light energy and convert it into thermal energy, such as phenyl salicylate, 2-(or 4-)hydroxybenzophenone, and 2(2'-hydroxyphenyl)benzotriazole, etc. with one unsaturated double bond
It is necessary to have one or more per molecule. Examples of unsaturated double bonds include vinyl, vinyl ether, vinyl ester, acrylic, and methacrylic groups, but particularly good results can be obtained in the present invention with acrylic, which has high reactivity and particularly excellent weather resistance. It is an ultraviolet absorber with a methacrylic group added. These may be used alone or in combination of two or more, and the total amount added is selected within the range of 0.1 to 30 parts by weight based on 100 parts by weight of the oligomer. If the amount is less than 0.1 parts by weight, the effect of improving weather resistance will be insufficient, and if it is added more than 30 parts by weight, the adhesive properties (adhesive strength, radiation curability) will deteriorate. A more preferable range of addition amount is 1 to 15 parts by weight. The oligomers having an unsaturated double bond in the molecule used in the present invention include those with unsaturated main chains such as acrylic acid alkyl esters or methacrylic acid alkyl esters, polyol acrylates, polyester alkylates, urethane acrylates, and epoxy acrylates. These are prepolymers such as acrylic oligomers, polybutadiene, polychloroprene, and polyisoprene that have one or more double bonds per molecule at the terminal or side chain. Further, the oligomer is usually in a liquid state, and its viscosity is in the range of 10 2 to 5×10 5 cps at room temperature. In the present invention, particularly good results can be obtained with a highly reactive acrylic double bond-attached oligomer. Chain transfer agents used in adhesive compositions other than oligomers include butyl mercaptan, lauryl mercaptan, octyl thioglycolate, ethylene glycol dithioglycote, and pentaerythritol tetrakis (β-thiopropionate).
Examples include thiol compounds such as, disulfides such as diphenyl disulfide, and halides such as carbon tetrachloride, carbon tetrabromide, chloroform, and dichlorobenzene. These may be used alone or in combination of two or more. These chain transfer agents are added to suppress excessive crosslinking during radiation curing. For that purpose, the amount added should be 0.2 to 20% by weight, preferably
It is necessary to select it in the range of 2 to 15% by weight. If this amount is less than 0.2% by weight, the effect of suppressing crosslinking will be insufficient, and if it exceeds 20% by weight, curing will be insufficient and cohesive force will be insufficient, which will adversely affect adhesive properties. On the other hand, monomers having polar groups used in the present invention include acrylic acid, methacrylic acid, itaconic acid, maleic acid, crotonic acid, acryloyloxyethyl hydrogen phthalate, 2-acrylamido-2-methylpropane-sulfonic acid, 3 -Chloro-2-acryloyloxypropyl methacrylate, 2-acrydophosphooxyethyl acrylate, 2-acrydophosphooxypropyl methacrylate, di(2-methacryloyloxyethyl) phosphate, di(2-acryloyloxyethyl phosphate) ), etc. Particularly advantageous are monomers endowed with phosphate radicals with high dissociation constants. The amount of these monomers with acidic groups added is 0.5
~30 parts by weight. If this amount is less than 0.5% by weight, the effect of interfacial force will be insufficient, and 30
If the amount exceeds % by weight, the radiation effectiveness and the physical properties of the effect coating will deteriorate, which is not preferable. In carrying out the present invention, in addition to the compositions described above,
Additives such as diluting monomers and tackifiers may be added, and a small amount of solvent may also be added. The radiation used in the present invention refers to active energy rays,
Ionizing radiation such as alpha rays, beta rays, gamma rays, neutron beams, accelerated electron beams, and ultraviolet rays. The dose of ionizing radiation can range from 0.5 to 50 Mrad, but is preferably about 1 to 10 Mrad. In the case of ultraviolet rays, the wavelength range is approximately 180 nm and 460 nm, and a high-pressure mercury lamp or the like is suitable as the source. Also, when irradiating, care must be taken in the irradiation atmosphere. That is, since the generated radicals are inhibited by oxygen in the air, it may be necessary to use an inert gas such as nitrogen to maintain an appropriate oxygen concentration. [Function] The adhesive tape obtained by the present invention has good rubber elasticity, excellent adhesive properties, and excellent weather resistance. The reason for the improved weather resistance is that as a result of adding unsaturated double bonds to ordinary ultraviolet absorbers, their compatibility with adhesive compositions such as oligomers has improved, making it possible to add them in large quantities. Also, most of the added material is radiation-cured and incorporated into the system through covalent bonds, so it has excellent cohesive strength and does not easily bleed out. Furthermore, by introducing an unsaturated double bond into the ultraviolet absorber, the light←→heat exchange function of the ultraviolet absorber is not adversely affected. The present invention will be further explained below with reference to Examples. (1) Synthesis of radiation-curable oligomer (1-a) 10 parts of ethyl acrylate, butyl acrylate
70 parts, 30% metaglycidyl acrylate 20 parts
Solution polymerization was carried out in a solution of , and the solvent was removed to synthesize a solvent-free copolymer with a viscosity of 50° C.-1×10 4 cps. Next, this copolymerized pre-oligomer was subjected to an addition reaction with 5 parts of acrylic acid to impart double bonds to the side chains. (1-b) 75 parts of α-ethylhexyl acrylate, 15 parts of methyl methacrylate, and 10 parts of metaglycidyl acrylate were copolymerized in the same manner as in (1-a) above to add a double bond to the side chain. (2) Synthesis of unsaturated double bond-added ultraviolet absorber (2-a) For 1 mol of 2,2',4,4'-tetrahydroxybenzophenone, add 2 sodium hydroxide.
mol in 300 ml of methanol at 50°C,
10 in 10wt% MEK after complete removal of moisture
The reaction was carried out with 2 mol of acrylic acid chloride at ℃, and the reaction product was purified by distillation. (2-b) 2',4'-dihydroxyphenyl salicylate was synthesized in the same manner as in (2-a). Example 1 To 100 parts by weight of the oligomer synthesized in (1-a), 10 parts by weight of pentaerythritol tetrakis-(βthiopropionate), 10 parts by weight of di(2-acryloyloxyethyl) phosphate, and (2) −
0.1 part by weight of the ultraviolet absorber synthesized in a) was added to prepare an adhesive composition. Example 2 An adhesive composition was prepared in the same manner as in Example 1, except that the amount of the ultraviolet absorber was changed to 10 parts by weight. Comparative Examples 1, 2, 3 Comparative Example 1 was obtained by removing the UV absorber from the formulation of Example 1, and 2, 2', 4,
Comparative Example 2 was prepared by adding 0.05 part by weight of 4'-tetrahydroxybenzophenone, and Comparative Example 3 was prepared by adding 0.1 part by weight of 4'-tetrahydroxybenzophenone. Example 3 100 parts by weight of the oligomer synthesized in (1-b), 5 parts by weight of butylmethylcaptan, 15 parts by weight of acroyloxyethyl hydrogen phthalate, and (2-b)
5 parts by weight of the ultraviolet absorber synthesized in step 1 was added to prepare an adhesive composition. Example 4 An adhesive composition was prepared in the same manner as in Example 3, except that the amount of the ultraviolet absorber was changed to 15 parts by weight. Comparative Examples 4, 5, 6 Comparative Example 4 was obtained by removing the ultraviolet absorber from the formulation of Example 3, and comparison was made by adding 0.05 parts by weight of 2',4'-dihydroxyphenyl salicylate as an ultraviolet absorber. Comparative Example 6 was prepared by adding 0.1 part by weight of Example 5. These compositions are applied to a polyethylene film (thickness
60μm) so that the coating thickness is 10μm,
Electron beam irradiation device (linear filament type, Energy Science
Inc. (trade name: Electrocurtain) under a nitrogen gas atmosphere (O 2 concentration 500 ppm) and irradiated with 6 Mrad to create an adhesive film. This adhesive film was subjected to an adhesive strength test using a Tensilon type tensile tester. The tensile speed was 20 mm/min (20°C). It was also attached to a SUS-430BA board and peeled off after 2 hours.
A curing test was conducted by visually observing whether the adhesive adhered to the board surface. For adhesive films that showed no abnormalities in the curing test, accelerated weather resistance tests were conducted using a sunshine weather meter.
(ATLAS CDMC type, closed carbon arc type) The results are shown in Table 1.
【表】【table】
上記実施例の結果からも明らかなように、本発
明によれば不飽和二重結合を付与した紫外線吸収
剤を配合したので接着力・凝集力に優れ、また多
量の添加が可能なため優れた耐候性を有する放射
線硬化型粘着剤の提供が可能になつた。
As is clear from the results of the above examples, according to the present invention, since the ultraviolet absorber with unsaturated double bonds is blended, it has excellent adhesive strength and cohesive force, and can be added in a large amount. It has become possible to provide a radiation-curable adhesive with weather resistance.
Claims (1)
マと、連鎖移動剤および極性基を有する反応性モ
ノマからなる粘着剤組成物において、前記液状オ
リゴマ100重量部に対し、不飽和二重結合を付与
した紫外線吸収剤を0.1〜30重量部配合したこと
を特徴とする放射線硬化型粘着剤組成物。 2 不飽和二重結合を付与した紫外線吸収剤がフ
エニルサリシレート、ヒドロキシベンゾフエノン
またはヒドロキシフエニルベンゾトリアゾールを
その分子骨格に有するものである特許請求の範囲
第1項記載の放射線硬化型粘着剤組成物。[Scope of Claims] 1. In an adhesive composition comprising a liquid oligomer having an unsaturated double bond in the molecule, a chain transfer agent and a reactive monomer having a polar group, an unsaturated oligomer is added to 100 parts by weight of the liquid oligomer. 1. A radiation-curable pressure-sensitive adhesive composition comprising 0.1 to 30 parts by weight of an ultraviolet absorber imparted with saturated double bonds. 2. The radiation-curable adhesive according to claim 1, wherein the ultraviolet absorber having an unsaturated double bond has phenyl salicylate, hydroxybenzophenone, or hydroxyphenylbenzotriazole in its molecular skeleton. Composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4989785A JPS61209281A (en) | 1985-03-13 | 1985-03-13 | Radiation-curable pressure-sensitive adhesive composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4989785A JPS61209281A (en) | 1985-03-13 | 1985-03-13 | Radiation-curable pressure-sensitive adhesive composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61209281A JPS61209281A (en) | 1986-09-17 |
JPH0463110B2 true JPH0463110B2 (en) | 1992-10-08 |
Family
ID=12843807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4989785A Granted JPS61209281A (en) | 1985-03-13 | 1985-03-13 | Radiation-curable pressure-sensitive adhesive composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61209281A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6153719A (en) * | 1998-02-04 | 2000-11-28 | Lord Corporation | Thiol-cured epoxy composition |
JP2010530060A (en) * | 2007-05-29 | 2010-09-02 | ヘンケル コーポレイション | Adhesive detection method |
JP5740828B2 (en) * | 2010-03-31 | 2015-07-01 | 大日本印刷株式会社 | Decorative sheet and decorative board using the same |
JP5989381B2 (en) | 2012-04-05 | 2016-09-07 | スリーエム イノベイティブ プロパティズ カンパニー | Radiation curable adhesive composition and laminate using the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50136366A (en) * | 1974-04-18 | 1975-10-29 | ||
JPS5159939A (en) * | 1974-11-22 | 1976-05-25 | Modern Plastic Kogyo Kk |
-
1985
- 1985-03-13 JP JP4989785A patent/JPS61209281A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50136366A (en) * | 1974-04-18 | 1975-10-29 | ||
JPS5159939A (en) * | 1974-11-22 | 1976-05-25 | Modern Plastic Kogyo Kk |
Also Published As
Publication number | Publication date |
---|---|
JPS61209281A (en) | 1986-09-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4665106A (en) | Radiation curable pressure-sensitive adhesive composition | |
JPS63260971A (en) | Radiation-curable pressure-sensitive adhesive composition | |
US4587313A (en) | Radiation curable pressure-sensitive adhesive composition | |
JP7076448B2 (en) | Liquid Adhesive Compositions, Adhesive Sheets and Adhesive Methods | |
JPS6116970A (en) | Coating composition curable with active energy rays | |
JPH0236610B2 (en) | ||
JPH0436192B2 (en) | ||
JPH0463110B2 (en) | ||
JP2621457B2 (en) | Radiation-curable pressure-sensitive adhesive composition | |
JPS63260977A (en) | Radiation-curable pressure sensitive adhesive composition | |
US4554174A (en) | Process for producing radiation curable adhesive tape | |
EP0210309B1 (en) | Radiation curable pressure-sensitive adhesive composition | |
JPS6020428B2 (en) | Radiation-curable pressure-sensitive adhesive composition | |
JPS6025070B2 (en) | Radiation-curable pressure-sensitive adhesive composition | |
JPH0819382B2 (en) | Radiation-curable pressure-sensitive adhesive composition | |
JP3870981B2 (en) | Adhesive for metallized paper and method for producing metallized paper | |
JPH0236611B2 (en) | HYOMENHOGOFUIRUMUYOHOSHASENKOKAGATANENCHAKUZAI | |
JPH01156385A (en) | Radiation-curable, pressure-sensitive adhesive composition | |
JPS6049671B2 (en) | Radiation-curable pressure-sensitive adhesive composition | |
JPS63178184A (en) | Radiation-curable pressure-sensitive adhesive compostion | |
JPH0153985B2 (en) | ||
JPS6020427B2 (en) | Radiation-curable pressure-sensitive adhesive composition | |
JPS6028318B2 (en) | Photocurable pressure-sensitive adhesive composition | |
JPH0463111B2 (en) | ||
JPH0798924B2 (en) | Radiation curable pressure sensitive adhesive composition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |