JPH0461149A - Connecting method of terminal to printed wiring board - Google Patents
Connecting method of terminal to printed wiring boardInfo
- Publication number
- JPH0461149A JPH0461149A JP16539390A JP16539390A JPH0461149A JP H0461149 A JPH0461149 A JP H0461149A JP 16539390 A JP16539390 A JP 16539390A JP 16539390 A JP16539390 A JP 16539390A JP H0461149 A JPH0461149 A JP H0461149A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- terminal
- conductor circuit
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 30
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 238000009792 diffusion process Methods 0.000 claims abstract description 10
- 150000002739 metals Chemical class 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 2
- 229910000640 Fe alloy Inorganic materials 0.000 abstract description 2
- 239000011888 foil Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 230000006837 decompression Effects 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000004744 fabric Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- -1 4270I Inorganic materials 0.000 description 1
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229960001701 chloroform Drugs 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、プリント配線板に外部接続用の端子を取り
付ける接続方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a connection method for attaching terminals for external connection to a printed wiring board.
プリント配線板の導体回路に外部接続用の端子を取り付
ける方法の一つとして、実開平１−９３７４４号公報に
開示されたものがあり、第２図の断面図に示した。この
方法は、プリント配線板１のスルホール９に端子ビン５
を圧挿入し、この端子ビン５の露出部を半田浴に浸漬し
、半田ｌＯの表面張力を利用してスルホールメツキ９と
端子ビン５との半田付けが行われるのである。One of the methods for attaching terminals for external connection to the conductor circuit of a printed wiring board is disclosed in Japanese Utility Model Publication No. 1-93744, which is shown in the sectional view of FIG. In this method, a terminal pin 5 is inserted into a through hole 9 of a printed wiring board 1.
The exposed portion of the terminal pin 5 is immersed in a solder bath, and the through-hole plating 9 and the terminal pin 5 are soldered using the surface tension of the solder lO.
しかし、この場合プリント配線板が高温の半田液に曝さ
れるために、プリント配線板の機械的特性や電気的特性
が劣化する問題を生じる。However, in this case, the printed wiring board is exposed to the high-temperature solder solution, resulting in a problem that the mechanical properties and electrical properties of the printed wiring board deteriorate.
さらに、接続材として半田を用いるために、半田使用に
ともなう半田ブリッジや、半田ボールが生じる、また、
半田に含まれるフラックスが残存するなどの問題も有し
、接続導通の信鱈性を低下゛させていた。Furthermore, since solder is used as a connecting material, solder bridges and solder balls occur due to the use of solder.
Another problem was that flux contained in the solder remained, reducing the reliability of the connection.
プリント配線板を高温度雰囲気に曝すことなく、半田を
用いないでプリント配線板の導体回路と外部接続用の端
子を接続する方法を提供することにある。It is an object of the present invention to provide a method for connecting a conductive circuit of a printed wiring board and a terminal for external connection without exposing the printed wiring board to a high temperature atmosphere and without using solder.
Ｃａ２題を解決するための手段〕
本発明は、前記課題を解決するために接続用の端子をプ
リント配線板に取り付ける方法において、プリント配線
板の導体回路と端子とを密着し、１０−９Ｐａより真空
度の高い減圧下で処理して金属拡散接合することを特徴
とするプリント配線板への端子の接続法である。Means for Solving Ca2 Problems] In order to solve the above problems, the present invention provides a method for attaching connection terminals to a printed wiring board, in which the conductor circuit of the printed wiring board and the terminal are brought into close contact with each other, and This method of connecting terminals to printed wiring boards is characterized by metal diffusion bonding performed under reduced pressure with a high degree of vacuum.
以下、図面にしたがって本発明の実施例について説明す
る。Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明の一実施例の断面図で、プリント配線板
の片面表面から接続用の端子が突出したピングリッドア
レイである。プリント配線板１０表面の導体回路２は、
スルホール３を経由し、スルホールランド４となっても
う一方の表面に形成されている。このスルホールランド
４と端子５との接続部品を密着させた状態で１０−９Ｐ
ａより真空度の高いに減圧度にして、導体回路３のスル
ホールランド４部分の金属と端子５の金属による拡散現
象にもとずく接合によって端子をプリント配線板に一体
化したものである。１０−”Ｐａより真空度の高いに減
圧度に限定するのは、金属原子がこの真空度より高い真
空下でないと、金属の拡散現象が生じないからである。FIG. 1 is a sectional view of one embodiment of the present invention, which is a pin grid array with connection terminals protruding from one surface of a printed wiring board. The conductor circuit 2 on the surface of the printed wiring board 10 is
Through the through hole 3, the through hole land 4 is formed on the other surface. 10-9P with the connection parts between this through hole land 4 and terminal 5 in close contact.
The terminal is integrated into the printed wiring board by bonding the metal of the through-hole land 4 portion of the conductor circuit 3 and the metal of the terminal 5 based on a diffusion phenomenon at a reduced pressure higher than that of a. The reason why the degree of vacuum is limited to a degree of vacuum higher than 10-''Pa is because the metal diffusion phenomenon does not occur unless the metal atoms are under a vacuum higher than this degree of vacuum.
また、２つの金属の密着距離は真空下で、金属原子が行
き交う距離より小さい距離の密着でなければ、金属拡散
が相互に起こらないので接合しないのである。In addition, unless the two metals are in close contact with each other at a distance smaller than the distance that metal atoms can travel in a vacuum, they will not be bonded because mutual metal diffusion will not occur.
なお、スルホールランド４と端子５との接続箇所を密着
させる前にそれぞれ、塩酸、硫酸などの無機酸、トリク
ロロメタン、メチルエチルケトン、アセトンなどの有機
溶削で表面の酸化物や汚れを除去処理し、活性化すると
前記の金属原子の動きを阻害する異物がなくなるため、
十分な拡散が生じることになり、また、金属拡散層中に
不純物の存在が少なくなり密着性、接続導通の信顧性が
向上する。In addition, before the connection points between the through-hole lands 4 and the terminals 5 are brought into close contact, oxides and dirt on the surfaces are removed by inorganic acids such as hydrochloric acid and sulfuric acid, and organic abrasions such as trichloromethane, methyl ethyl ketone, and acetone. When activated, there are no foreign substances that inhibit the movement of the metal atoms, so
Sufficient diffusion occurs, and the presence of impurities in the metal diffusion layer decreases, improving adhesion and connection continuity reliability.
この半導体チップキャリアは、プリント配線板ｌの中央
部に半導体チップ６を搭載し、半導体チップ６と導体回
路２とをワイヤー７で接続して用いられる。This semiconductor chip carrier is used by mounting a semiconductor chip 6 in the center of a printed wiring board 1, and connecting the semiconductor chip 6 and a conductor circuit 2 with wires 7.
第２図に他の実施例を示した。このものは、プリント配
線板１の表面の周縁部にまで展設された導体回路２を有
し、この導体回路２に帯状の金属板を加工したリードフ
レームから作られた端子５を密着させた状態で、前記実
施例と同様に金属拡散接合させてプリント配線板１への
端子５の接続を行ったものである。このものは前記と同
様に半導体チップを搭載することができる。なお、この
リードフレームに代えてキャリアフィルムに端子ｔなる
導電パターンを有するものを用いることもできる。Another embodiment is shown in FIG. This device has a conductor circuit 2 extending to the periphery of the surface of a printed wiring board 1, and a terminal 5 made from a lead frame made from a strip-shaped metal plate is tightly attached to the conductor circuit 2. In this state, the terminals 5 were connected to the printed wiring board 1 by metal diffusion bonding as in the previous embodiment. This device can be equipped with a semiconductor chip in the same manner as described above. Note that instead of this lead frame, a carrier film having a conductive pattern called the terminal t can also be used.
プリント配線板Ｉの導体回路２は、銅、アルミニウムの
金属箔などから形成されたものを、さらに、その表面に
金、銀、半田のメツキをしたものを用いることもできる
。The conductor circuit 2 of the printed wiring board I may be formed from a metal foil such as copper or aluminum, and may also be plated with gold, silver, or solder on its surface.
端子５は、銅、銅合金、４２７０イ、鉄、鉄合金、アル
ミニウムなどの金属の線材や、帯状材を適当な形、大き
さに加工して用いることができ、さらに、その表面に金
、銀、半田のメツキをしたものを用いることもできる。The terminal 5 can be made of a metal wire or strip made of copper, copper alloy, 4270I, iron, iron alloy, aluminum, etc., processed into an appropriate shape and size, and may also be coated with gold, gold or other metal on its surface. It is also possible to use silver or solder plated material.
導体回路２と端子５の金属は同種金属、異種金属いずれ
の組合せでもよく、特に限定するものではないが、同種
金属の組合が接合強度の点、局部電池を形成しない点な
どで好ましい。The metals of the conductor circuit 2 and the terminals 5 may be a combination of the same kind of metal or different kinds of metals, and although there is no particular limitation, a combination of the same kind of metals is preferable in terms of bonding strength and not forming a local battery.
また、端子５の接続部分の形状の例として、第２図の端
子５の曲げ加工前の第３図、および、第４図、第５図で
示した。第４図、第５図は第３図の円Ａの拡大図で示し
た。第３図では、リードフレーム端部の上部に切り欠け
のあるものを、第４図はリードフレーム端部の下部に切
り欠けのあるものを、第５図は、切り欠けのないもので
あり、これらの形状は、全体厚み、用途などによって適
宜用いることができる。Further, examples of the shape of the connecting portion of the terminal 5 are shown in FIG. 3, FIG. 4, and FIG. 5 before the terminal 5 in FIG. 2 is bent. 4 and 5 are enlarged views of circle A in FIG. 3. 3 shows a lead frame with a notch at the top of the end, FIG. 4 shows a lead frame with a notch at the bottom, and FIG. 5 shows a lead frame without a notch. These shapes can be used as appropriate depending on the overall thickness, purpose, etc.
プリント配線板１としてはガラス布基材エポキシ樹脂銅
張り積層板、ガラス布基材ポリイミド樹脂銅張り積層板
、ガラス布基材フッ素樹脂銅張り積層板、ガラス布基材
ポリフェニレンオキサイド樹脂銅張り積層板又はこれら
の変性樹脂銅張り積層板、または、耐熱性に優れた有機
繊維布基材の銅張り積層板などの銅張積層板に、通常の
サブトラクティブ法などの回路形成法によって導体回路
を形成したものや前記の各樹脂積層板や成形材料で得ら
れる成形品にアディティブ法の回路形成法によって導体
回路を形成したものなどを用いることができる。The printed wiring board 1 includes a glass cloth-based epoxy resin copper-clad laminate, a glass cloth-based polyimide resin copper-clad laminate, a glass cloth-based fluororesin copper-clad laminate, and a glass cloth-based polyphenylene oxide resin copper-clad laminate. Or forming a conductor circuit on a copper-clad laminate such as a modified resin copper-clad laminate or a copper-clad laminate with an organic fiber cloth base material having excellent heat resistance by a circuit forming method such as a normal subtractive method. It is also possible to use molded products obtained from the resin laminates and molding materials described above with conductor circuits formed thereon by an additive circuit formation method.
金属原子が行き交うことのできる距離より小さな密着距
離に２つの金属同士を密着させた状態で、Ｎｏ−９Ｐａ
より高度の真空下で処理を行うと、酸化反応が進行せず
、金属原子が密着した金属間を自由に行き交うようにな
る。このことにより、特に高温度雰囲気に曝すことなく
金属同士を接合し。No-9Pa with two metals in close contact with each other at a distance smaller than the distance that metal atoms can travel.
When the process is carried out under a higher degree of vacuum, the oxidation reaction does not proceed, and metal atoms can move freely between the metals that are in close contact with each other. This allows metals to be joined without exposing them to a particularly high temperature atmosphere.
て接続することができるものである。It is possible to connect the
本発明のプリント配線板の導体回路と端子とを密着し、
１０−９Ｐａより真空度の高い減圧下で処理して金属拡
散接合するプリント配線板への端子の接続法によって、
プリント配線板が高温度雰囲気に曝されることがないの
で高温暴露によるプリント配線板の特性の低下が生じる
ことがなく、半田を用いないでプリント配線板の導体回
路と接続用の端子を接続することができるので、半田使
用に”よる問題が生じないのである。The conductor circuit and terminal of the printed wiring board of the present invention are brought into close contact,
By connecting the terminals to the printed wiring board, which is processed under reduced pressure with a degree of vacuum higher than 10-9 Pa and metal diffusion bonded,
Since the printed wiring board is not exposed to a high temperature atmosphere, the characteristics of the printed wiring board will not deteriorate due to high temperature exposure, and the conductor circuit of the printed wiring board and the connection terminal can be connected without using solder. Therefore, there are no problems caused by the use of solder.
第１図は本発明の一実施例の断面図、
第２回は本発明の他の一実施例の断面図、第３図も本発
明の他の 実施例の断面図、第４図、第５図は接続部分
の異なる他の実施例の部分拡大断面図、
第６図は一従来例の断面図をそれぞれ示す。
】・・・プリント配線板
２・・・導体回路
３・・・スルホ ル
４・・・スルホールランド
５・・・端子
６・・・半導体チップ
７・・・ワイヤー
８・・・切り欠は部
９・・・スルホールメツキ
１０・・・半田
特許出願人 松下電工株式会社
代理人弁理士 佐藤成示 （ほか１名）第１５ｉ！
第５因
第４弱Fig. 1 is a sectional view of one embodiment of the present invention, Part 2 is a sectional view of another embodiment of the invention, Fig. 3 is also a sectional view of another embodiment of the invention, Figs. FIG. 5 is a partially enlarged cross-sectional view of another embodiment with different connection parts, and FIG. 6 is a cross-sectional view of a conventional example. ]...Printed wiring board 2...Conductor circuit 3...Through hole 4...Through hole land 5...Terminal 6...Semiconductor chip 7...Wire 8...Notch is part 9 ... Through Hole Metsuki 10 ... Handa Patent Applicant Matsushita Electric Works Co., Ltd. Representative Patent Attorney Shigeji Sato (and 1 other person) No. 15i! 5th cause 4th weak
Claims (1)
において、プリント配線板の導体回路と端子とを密着し
、１０＾−＾９Ｐａより真空度の高い減圧下で処理して
金属拡散接合することを特徴とするプリント配線板への
端子の接続法。(1) In the method of attaching connection terminals to a printed wiring board, the conductor circuit of the printed wiring board and the terminal are brought into close contact, and metal diffusion bonding is performed by processing under reduced pressure with a degree of vacuum higher than 10^-^9Pa. A method for connecting terminals to a printed wiring board, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16539390A JPH0461149A (en) | 1990-06-22 | 1990-06-22 | Connecting method of terminal to printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16539390A JPH0461149A (en) | 1990-06-22 | 1990-06-22 | Connecting method of terminal to printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0461149A true JPH0461149A (en) | 1992-02-27 |
Family
ID=15811550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16539390A Pending JPH0461149A (en) | 1990-06-22 | 1990-06-22 | Connecting method of terminal to printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0461149A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6396140B1 (en) * | 1999-06-24 | 2002-05-28 | Lsi Logic Corporation | Single reference plane plastic ball grid array package |
| JP2005017684A (en) * | 2003-06-26 | 2005-01-20 | Nec Corp | Optical module and method for manufacturing the same |
| JP2012148342A (en) * | 2004-11-04 | 2012-08-09 | Microchips Inc | Compression and cold weld sealing method and device |
-
1990
- 1990-06-22 JP JP16539390A patent/JPH0461149A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6396140B1 (en) * | 1999-06-24 | 2002-05-28 | Lsi Logic Corporation | Single reference plane plastic ball grid array package |
| JP2005017684A (en) * | 2003-06-26 | 2005-01-20 | Nec Corp | Optical module and method for manufacturing the same |
| JP2012148342A (en) * | 2004-11-04 | 2012-08-09 | Microchips Inc | Compression and cold weld sealing method and device |
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