JPH0460506B2 - - Google Patents
Info
- Publication number
- JPH0460506B2 JPH0460506B2 JP60000116A JP11685A JPH0460506B2 JP H0460506 B2 JPH0460506 B2 JP H0460506B2 JP 60000116 A JP60000116 A JP 60000116A JP 11685 A JP11685 A JP 11685A JP H0460506 B2 JPH0460506 B2 JP H0460506B2
- Authority
- JP
- Japan
- Prior art keywords
- membered heterocyclic
- heterocyclic compound
- thermoplastic resin
- composite
- oxidizing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims description 16
- 239000007800 oxidant agent Substances 0.000 claims description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims description 12
- 239000000805 composite resin Substances 0.000 claims description 10
- 150000002391 heterocyclic compounds Chemical class 0.000 claims description 10
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 8
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 229930192474 thiophene Natural products 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 8
- 150000000565 5-membered heterocyclic compounds Chemical class 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 150000007522 mineralic acids Chemical class 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000128 polypyrrole Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical class C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- KEQGZUUPPQEDPF-UHFFFAOYSA-N 1,3-dichloro-5,5-dimethylimidazolidine-2,4-dione Chemical compound CC1(C)N(Cl)C(=O)N(Cl)C1=O KEQGZUUPPQEDPF-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- XTHPWXDJESJLNJ-UHFFFAOYSA-N chlorosulfonic acid Substances OS(Cl)(=O)=O XTHPWXDJESJLNJ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 150000003577 thiophenes Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は導電性複合体を製造する方法に関す
る。詳しくは、熱可塑性樹脂と複素五員環式化合
物重合体からなる導電性樹脂複合体の製造方法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of manufacturing an electrically conductive composite. Specifically, the present invention relates to a method for producing a conductive resin composite comprising a thermoplastic resin and a five-membered heterocyclic compound polymer.
複素五員環式化合物が酸化剤によつて不溶不融
の重合体を生成することは良く知られており、例
えばピロールが無機酸、塩化鉄、ベンゾキノン、
オゾンなどによつてピロール黒、ピロール赤など
の重合体になることがアドバンシズ、イン、ヘテ
ロサイクリツク、ケミストリー（Advances in
Heterocyclic Chemistry）15巻 67ページ
（1973年）に示されている。同様にフランスやチ
オフエンの誘導体も重合体となる。一方、適当な
電解質の存在下に電解重合することで膜状のピロ
ール、フラン、チオフエンの重合体が得られるこ
とも公知である（例えばケミカルコミニユケーシ
ヨン（J.C.S.Chemical Communication）1979
635ページ、Japan Joural of Applied Physics
21巻（1982年）L562、ibid.23巻（1984年）
L527）。
It is well known that five-membered heterocyclic compounds form insoluble and infusible polymers when exposed to oxidizing agents; for example, pyrrole is reacted with inorganic acids, iron chloride, benzoquinone,
Advances, In, Heterocyclics, Chemistry (Advances in
Heterocyclic Chemistry, Volume 15, Page 67 (1973). Similarly, French and thiophene derivatives also form polymers. On the other hand, it is also known that film-like polymers of pyrrole, furan, and thiophene can be obtained by electrolytic polymerization in the presence of an appropriate electrolyte (for example, Chemical Communication (JCSChemical Communication) 1979).
635 pages, Japan Journal of Applied Physics
Volume 21 (1982) L562, ibid.Volume 23 (1984)
L527).
しかしながら、従来の方法では得られる重合体
が不溶不融であり、所望の形の成形物とすること
ができないとか、電解重合では、特定のフイルム
状のものとすることができるものの、形状を所望
の形とすることはできず、しかも高価な設備を必
要とするという問題があつた。
However, with conventional methods, the resulting polymer is insoluble and infusible and cannot be molded into the desired shape, and with electrolytic polymerization, although it is possible to form a specific film, the desired shape cannot be obtained. However, there was a problem in that it could not be made into a shape similar to that of the previous one and required expensive equipment.
本発明らは上記問題を解決する方法について鋭
意検討した結果、特定の重合法で熱可塑性樹脂と
複素五員環式化合物重合体の複合樹脂とすること
で安価に、成形可能で、しかも導電性の樹脂複合
体が得られることを見い出し、本発明を完成し
た。 The present inventors have conducted intensive studies on methods to solve the above problems, and have found that by using a specific polymerization method to create a composite resin of a thermoplastic resin and a five-membered heterocyclic compound polymer, it is possible to form a composite resin at low cost, which is moldable, and which is also electrically conductive. The present invention was completed based on the discovery that a resin composite of the following can be obtained.
即ち、本発明は、ピロール、チオフエン、フラ
ンおよびそれらの誘導体から選ばれた複素５員環
式化合物を含浸させた熱可塑性樹脂を、該複素５
員環式化合物及び熱可塑性樹脂を実質的に溶解し
ない溶媒に酸化剤を溶解した液状媒体中で接触処
理することを特徴とする導電性樹脂複合体の製造
方法である。
That is, the present invention provides a thermoplastic resin impregnated with a 5-membered heterocyclic compound selected from pyrrole, thiophene, furan, and their derivatives.
This is a method for producing a conductive resin composite, which is characterized by carrying out a contact treatment in a liquid medium in which an oxidizing agent is dissolved in a solvent that does not substantially dissolve the membered cyclic compound and the thermoplastic resin.
本発明において用いられる熱可塑性樹脂として
は特に制限はなく、市販の多くのポリマーが使用
可能であり、例えばポリエチレン、ポリプロピレ
ン、ポリ塩化ビニル、スチレン−アクリロニトリ
ル共重合体、ポリカーボネート、ポリエステル、
ポリイソプロピレンなど工業的規模で製造されて
いるものが利用できる。 The thermoplastic resin used in the present invention is not particularly limited, and many commercially available polymers can be used, such as polyethylene, polypropylene, polyvinyl chloride, styrene-acrylonitrile copolymer, polycarbonate, polyester,
Polyisopropylene and other materials manufactured on an industrial scale can be used.
本発明において使用される複素５員環式化合物
としては、ピロール、チオフエン、フラン及びそ
れらの誘導体が挙げられ、なかでも反応速度が早
く、しかも得られる複合体の電気伝導度が大きい
ピロール及びそれらの誘導体が好ましく用いられ
る。 Examples of the 5-membered heterocyclic compound used in the present invention include pyrrole, thiophene, furan, and derivatives thereof. Among them, pyrrole and its derivatives have a fast reaction rate and a high electrical conductivity of the resulting composite. Derivatives are preferably used.
本発明において複素５員環式化合物を熱可塑性
樹脂に含浸させる方法としては、例えば、上記両
者を共粉砕する方法、複素５員環式化合物と混合
可熱する方法、或いは複素５員環式化合物と熱可
塑性樹脂を溶融混合し次いで所望の形状に成形す
る方法などが挙げられ、特に制限はない。又、酸
化剤を溶解した接触処理する際の形状についても
特に制限はなく、最終製品の形状としたものであ
つてもペレツト状或いはパウダー状であつても良
い。 In the present invention, the method of impregnating the thermoplastic resin with the 5-membered heterocyclic compound includes, for example, a method of co-pulverizing the above-mentioned two, a method of mixing and heating the 5-membered heterocyclic compound, or a method of heating the 5-membered heterocyclic compound. Examples include a method of melt-mixing and a thermoplastic resin and then molding into a desired shape, and there are no particular limitations. Further, there is no particular restriction on the shape of the dissolved oxidizing agent during the contact treatment, and it may be in the form of a final product, pellet form, or powder form.
本発明において使用する酸化剤としては無機
酸、金属化合物が有効に用いられる。例えば無機
酸としては硫酸、塩酸、硝酸、クロルスルホン酸
などが挙げられ、金属化合物としては、ルイス酸
として知られる種々の化合物即ちアルミニウム、
錫、チクン、ジルコニウム、クロム、マンガン、
鉄、銅、モリブテン、タングステン、ルテニウ
ム、パラジウム、白金などの塩化物、硫酸塩、硝
酸塩、アセチルアセトナート化合物などが具体例
として挙げられる。又、ベンゾキノン、ジアゾニ
ウム塩などの有機化合物も利用可能である。これ
らの酸化剤は１種あるいは２種以上混合して用い
ることも可能である。 As the oxidizing agent used in the present invention, inorganic acids and metal compounds are effectively used. For example, inorganic acids include sulfuric acid, hydrochloric acid, nitric acid, chlorosulfonic acid, etc., and metal compounds include various compounds known as Lewis acids, such as aluminum,
tin, tin, zirconium, chromium, manganese,
Specific examples include chlorides, sulfates, nitrates, and acetylacetonate compounds of iron, copper, molybdenum, tungsten, ruthenium, palladium, platinum, and the like. Furthermore, organic compounds such as benzoquinone and diazonium salts can also be used. These oxidizing agents may be used alone or in combination of two or more.
上記酸化剤を溶解するのに使用する溶媒として
は酸化剤を溶解し、しかも実質的に複素５員環式
化合物及び熱可塑性樹脂を溶解しないものであれ
ば良い。 The solvent used to dissolve the oxidizing agent may be any solvent as long as it dissolves the oxidizing agent and does not substantially dissolve the five-membered heterocyclic compound and the thermoplastic resin.
本発明において、接触方法については特に制限
はなく、単に酸化剤を溶解した液中に複素５員環
式化合物を含浸させた熱可塑性樹脂を入れ、必要
に応じ撹拌混合するだけで充分である。又、接触
処理の温度および時間についても特に制限はない
が、通常室温で数分〜数十時間接触処理を行なえ
ば充分である。熱可塑性樹脂１重量部に対する複
素５員環式化合物及び酸化剤の使用量としてはそ
れぞれ0.01〜0.5重量部、0.001〜0.5重量部用いる
のが一般的である。 In the present invention, there are no particular restrictions on the contact method, and it is sufficient to simply add a thermoplastic resin impregnated with a five-membered heterocyclic compound to a solution containing an oxidizing agent and stir and mix as necessary. Further, there are no particular restrictions on the temperature and time of the contact treatment, but it is usually sufficient to carry out the contact treatment at room temperature for several minutes to several tens of hours. The five-membered heterocyclic compound and the oxidizing agent are generally used in amounts of 0.01 to 0.5 parts by weight and 0.001 to 0.5 parts by weight, respectively, per 1 part by weight of the thermoplastic resin.
こうして得られた導電性樹脂複合体はろ過、或
いは静置分離によつて不要の酸化剤を除去し必要
に応じ加熱、或いは減圧乾燥することで未反応の
複素５員環式化合物が除去される。 The conductive resin composite thus obtained is filtered or statically separated to remove unnecessary oxidizing agents, and if necessary, heated or dried under reduced pressure to remove unreacted 5-membered heterocyclic compounds. .
得られた、導電性樹脂複合体は、必要に応じ
て、加熱溶融成形、圧縮成形によつて所望の形状
の成形物とでき、又、酸化剤溶液と接触する前に
成形物としたものでは、単に上記、過剰の酸化剤
及び複素５員環式化合物を除去するだけで所望の
成形物となる。 The obtained conductive resin composite can be molded into a desired shape by heat-melting molding or compression molding, if necessary, or can be molded before contacting with the oxidizing agent solution. The desired molded product can be obtained by simply removing the excess oxidizing agent and the five-membered heterocyclic compound.
本発明の方法を実施することによつて比較的多
量の複素五員環式化合物重合体を均一に分散せし
めた複合体を得ることが可能になるため、成形可
能でしかも高い導電性を有する導電性複合体が得
られると考えられる。
By carrying out the method of the present invention, it is possible to obtain a composite in which a comparatively large amount of a five-membered heterocyclic compound polymer is uniformly dispersed, so that it is moldable and has high conductivity. It is believed that a sexual complex is obtained.
本発明の方法を実施することによつて成形可能
な導電性樹脂複合体を簡便に得ることができ工業
的に価値が高い。
By implementing the method of the present invention, a moldable conductive resin composite can be easily obtained and is of high industrial value.
以下、実施例により本発明を説明する。 The present invention will be explained below with reference to Examples.
実施例 １
ピロール１重量部に対してポリプロピレン４重
量部を共粉砕して得られるピロール含浸ポリプロ
ピレン２ｇを、水10ml中に塩化鉄0.1ｇ溶解した
液に分散し、撹拌しながら５時間接触処理した。
接触処理後ろ過してポリピロール複合体を得た。
乾燥秤量したところ1.8ｇであり、ポリプロピレ
ンに対して、12.5wt％のポリピロールが得られて
いると推定される。ホツトプレスしたシートの比
抵抗は5.1×103Ω・cmであつた。Example 1 2 g of pyrrole-impregnated polypropylene obtained by co-pulverizing 1 part by weight of pyrrole and 4 parts by weight of polypropylene was dispersed in a solution of 0.1 g of iron chloride in 10 ml of water, and contact treatment was carried out for 5 hours while stirring. .
After contact treatment and filtration, a polypyrrole composite was obtained.
The dry weight was 1.8 g, and it is estimated that 12.5 wt% polypyrrole was obtained based on polypropylene. The specific resistance of the hot-pressed sheet was 5.1×10 3 Ω·cm.
実施例 ２
ポリプロピレンに代えてポリカーボネート（帝
人化成(株)製商品名パンライトＬ−1250）を用いた
他は実施例１と同様に処理した。ホツトプレスし
たシートの比抵抗は2.8×103Ω・cmであつた。Example 2 The same process as in Example 1 was carried out except that polycarbonate (trade name: Panlite L-1250, manufactured by Teijin Kasei Ltd.) was used instead of polypropylene. The specific resistance of the hot-pressed sheet was 2.8×10 3 Ω·cm.
実施例 ３
ピロール１重量部に対してポリ塩化ビニル（三
井東圧化学(株)製商品名ビニクロン4000M）３重量
部とα−メチルスチレンオリゴマー１重量部を加
え、ロールで混練して厚さ１mmのシートとした。
得られたシートをK2S2O4 10ｇ／を溶解した水
溶中で20時間接触処理し、次いでシートを分離乾
燥した後比抵抗を測定したところ4.5×103Ω・cm
であつた。Example 3 To 1 part by weight of pyrrole, 3 parts by weight of polyvinyl chloride (trade name Vinicron 4000M, manufactured by Mitsui Toatsu Chemical Co., Ltd.) and 1 part by weight of α-methylstyrene oligomer were added and kneaded with a roll to a thickness of 1 mm. It was made into a sheet.
The obtained sheet was subjected to a contact treatment for 20 hours in an aqueous solution containing 10 g of K 2 S 2 O 4 dissolved therein, and then the sheet was separated and dried. The specific resistance was measured to be 4.5×10 3 Ω・cm.
It was hot.
Claims (1)
の誘導体から選ばれた複素５員環式化合物を含浸
させた熱可塑性樹脂を、該複素５員環式化合物及
び熱可塑性樹脂を実質的に溶解しない溶媒に酸化
剤を溶解した液状媒体中で接触処理することを特
徴とする導電性樹脂複合体の製造方法。1. A thermoplastic resin impregnated with a five-membered heterocyclic compound selected from pyrrole, thiophene, furan, and their derivatives is mixed with an oxidizing agent in a solvent that does not substantially dissolve the five-membered heterocyclic compound and the thermoplastic resin. 1. A method for producing a conductive resin composite, which comprises contact treatment in a liquid medium in which a conductive resin composite is dissolved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60000116A JPS61159455A (en) | 1985-01-07 | 1985-01-07 | Production of electrically conductive resin composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60000116A JPS61159455A (en) | 1985-01-07 | 1985-01-07 | Production of electrically conductive resin composite material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61159455A JPS61159455A (en) | 1986-07-19 |
| JPH0460506B2 true JPH0460506B2 (en) | 1992-09-28 |
Family
ID=11465078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60000116A Granted JPS61159455A (en) | 1985-01-07 | 1985-01-07 | Production of electrically conductive resin composite material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61159455A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59168010A (en) * | 1983-03-07 | 1984-09-21 | バスフ アクチエンゲゼルシヤフト | Manufacture of electroconductive powdery pyrrole polymer |
-
1985
- 1985-01-07 JP JP60000116A patent/JPS61159455A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59168010A (en) * | 1983-03-07 | 1984-09-21 | バスフ アクチエンゲゼルシヤフト | Manufacture of electroconductive powdery pyrrole polymer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61159455A (en) | 1986-07-19 |
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