JPH0460360U - - Google Patents
Info
- Publication number
- JPH0460360U JPH0460360U JP10372690U JP10372690U JPH0460360U JP H0460360 U JPH0460360 U JP H0460360U JP 10372690 U JP10372690 U JP 10372690U JP 10372690 U JP10372690 U JP 10372690U JP H0460360 U JPH0460360 U JP H0460360U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- optical part
- scanning
- laser soldering
- injection optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims 2
- 239000007924 injection Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示すレーザ半田付
装置の略図、第２図は本考案の半田付装置でＱＦ
Ｐのリフロー半田付を行つている斜視図、第３図
は本考案の半田付装置で照射した場合のエネルギ
分布図、第４図は従来の半田付装置で照射した場
合のエネルギ分布図である。
１……射出光学部、２……光軸、３……楕円レ
ーザースポツト、４……ＱＦＰ、５……リード。
Fig. 1 is a schematic diagram of a laser soldering device showing an embodiment of the present invention, and Fig. 2 shows a QF soldering device of the present invention.
Fig. 3 is an energy distribution diagram when irradiating with the soldering device of the present invention, and Fig. 4 is an energy distribution diagram when irradiating with a conventional soldering device. . 1...Ejection optical section, 2...Optical axis, 3...Elliptical laser spot, 4...QFP, 5...Lead.
Claims (1)
ト板のリード上を走査してリフロー半田付するレ
ーザ半田付装置において、前記射出光学部の光軸
が前記プリント板の垂直軸に対し走査方向とは逆
方向に傾むけられることを特徴とするレーザ半田
付装置。 In a laser soldering apparatus that performs reflow soldering by scanning the leads of a printed board with an injection optical part that emits a circular irradiation spot, the optical axis of the injection optical part is in a direction opposite to the scanning direction with respect to the vertical axis of the printed board. A laser soldering device characterized in that it can be tilted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10372690U JPH0460360U (en) | 1990-10-02 | 1990-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10372690U JPH0460360U (en) | 1990-10-02 | 1990-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0460360U true JPH0460360U (en) | 1992-05-25 |
Family
ID=31848716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10372690U Pending JPH0460360U (en) | 1990-10-02 | 1990-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0460360U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006346725A (en) * | 2005-06-17 | 2006-12-28 | Toyota Motor Corp | Apparatus and method for brazing galvanized steel plates with laser beam, and method for manufacturing brazed galvanized steel plate |
-
1990
- 1990-10-02 JP JP10372690U patent/JPH0460360U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006346725A (en) * | 2005-06-17 | 2006-12-28 | Toyota Motor Corp | Apparatus and method for brazing galvanized steel plates with laser beam, and method for manufacturing brazed galvanized steel plate |
| JP4506575B2 (en) * | 2005-06-17 | 2010-07-21 | トヨタ自動車株式会社 | Galvanized steel sheet laser brazing device, galvanized steel sheet laser brazing method, brazed galvanized steel sheet manufacturing method. |
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