JPH0459131U - - Google Patents

Info

Publication number
JPH0459131U
JPH0459131U JP10038390U JP10038390U JPH0459131U JP H0459131 U JPH0459131 U JP H0459131U JP 10038390 U JP10038390 U JP 10038390U JP 10038390 U JP10038390 U JP 10038390U JP H0459131 U JPH0459131 U JP H0459131U
Authority
JP
Japan
Prior art keywords
wafer
plate
pins
heating device
adjustment mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10038390U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10038390U priority Critical patent/JPH0459131U/ja
Publication of JPH0459131U publication Critical patent/JPH0459131U/ja
Pending legal-status Critical Current

Links

JP10038390U 1990-09-25 1990-09-25 Pending JPH0459131U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10038390U JPH0459131U (enrdf_load_stackoverflow) 1990-09-25 1990-09-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10038390U JPH0459131U (enrdf_load_stackoverflow) 1990-09-25 1990-09-25

Publications (1)

Publication Number Publication Date
JPH0459131U true JPH0459131U (enrdf_load_stackoverflow) 1992-05-21

Family

ID=31842992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10038390U Pending JPH0459131U (enrdf_load_stackoverflow) 1990-09-25 1990-09-25

Country Status (1)

Country Link
JP (1) JPH0459131U (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326532A (ja) * 1992-05-15 1993-12-10 Tokyo Ohka Kogyo Co Ltd ベーク装置
WO1997020340A1 (fr) * 1995-11-28 1997-06-05 Tokyo Electron Limited Procede et dispositif pour traiter un semi-conducteur au moyen d'un gaz de traitement, pendant que le substrat est chauffe
JP2014216498A (ja) * 2013-04-25 2014-11-17 東レエンジニアリング株式会社 基板熱処理装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326532A (ja) * 1992-05-15 1993-12-10 Tokyo Ohka Kogyo Co Ltd ベーク装置
WO1997020340A1 (fr) * 1995-11-28 1997-06-05 Tokyo Electron Limited Procede et dispositif pour traiter un semi-conducteur au moyen d'un gaz de traitement, pendant que le substrat est chauffe
JP2014216498A (ja) * 2013-04-25 2014-11-17 東レエンジニアリング株式会社 基板熱処理装置

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