JPH0459131U - - Google Patents
Info
- Publication number
- JPH0459131U JPH0459131U JP10038390U JP10038390U JPH0459131U JP H0459131 U JPH0459131 U JP H0459131U JP 10038390 U JP10038390 U JP 10038390U JP 10038390 U JP10038390 U JP 10038390U JP H0459131 U JPH0459131 U JP H0459131U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- plate
- pins
- heating device
- adjustment mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 8
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10038390U JPH0459131U (cg-RX-API-DMAC7.html) | 1990-09-25 | 1990-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10038390U JPH0459131U (cg-RX-API-DMAC7.html) | 1990-09-25 | 1990-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459131U true JPH0459131U (cg-RX-API-DMAC7.html) | 1992-05-21 |
Family
ID=31842992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10038390U Pending JPH0459131U (cg-RX-API-DMAC7.html) | 1990-09-25 | 1990-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459131U (cg-RX-API-DMAC7.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05326532A (ja) * | 1992-05-15 | 1993-12-10 | Tokyo Ohka Kogyo Co Ltd | ベーク装置 |
| WO1997020340A1 (en) * | 1995-11-28 | 1997-06-05 | Tokyo Electron Limited | Method and device for treating semiconductor with treating gas while substrate is heated |
| JP2014216498A (ja) * | 2013-04-25 | 2014-11-17 | 東レエンジニアリング株式会社 | 基板熱処理装置 |
-
1990
- 1990-09-25 JP JP10038390U patent/JPH0459131U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05326532A (ja) * | 1992-05-15 | 1993-12-10 | Tokyo Ohka Kogyo Co Ltd | ベーク装置 |
| WO1997020340A1 (en) * | 1995-11-28 | 1997-06-05 | Tokyo Electron Limited | Method and device for treating semiconductor with treating gas while substrate is heated |
| JP2014216498A (ja) * | 2013-04-25 | 2014-11-17 | 東レエンジニアリング株式会社 | 基板熱処理装置 |
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