JPH045656U - - Google Patents
Info
- Publication number
- JPH045656U JPH045656U JP4550190U JP4550190U JPH045656U JP H045656 U JPH045656 U JP H045656U JP 4550190 U JP4550190 U JP 4550190U JP 4550190 U JP4550190 U JP 4550190U JP H045656 U JPH045656 U JP H045656U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- semiconductor device
- leads
- lead
- auxiliary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
- 230000003321 amplification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4550190U JPH045656U (it) | 1990-04-28 | 1990-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4550190U JPH045656U (it) | 1990-04-28 | 1990-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH045656U true JPH045656U (it) | 1992-01-20 |
Family
ID=31559736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4550190U Pending JPH045656U (it) | 1990-04-28 | 1990-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH045656U (it) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07193182A (ja) * | 1993-12-24 | 1995-07-28 | Nec Corp | 半導体装置 |
| CN101944522A (zh) * | 2009-07-03 | 2011-01-12 | 瑞萨电子株式会社 | 引线框架及使用引线框架的电子部件 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298166A (ja) * | 1988-10-04 | 1990-04-10 | Nec Corp | 半導体用パッケージ |
-
1990
- 1990-04-28 JP JP4550190U patent/JPH045656U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298166A (ja) * | 1988-10-04 | 1990-04-10 | Nec Corp | 半導体用パッケージ |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07193182A (ja) * | 1993-12-24 | 1995-07-28 | Nec Corp | 半導体装置 |
| CN101944522A (zh) * | 2009-07-03 | 2011-01-12 | 瑞萨电子株式会社 | 引线框架及使用引线框架的电子部件 |
| JP2011014758A (ja) * | 2009-07-03 | 2011-01-20 | Renesas Electronics Corp | リードフレーム及びこれを用いた電子部品 |