JPH0456459B2 - - Google Patents
Info
- Publication number
- JPH0456459B2 JPH0456459B2 JP10094882A JP10094882A JPH0456459B2 JP H0456459 B2 JPH0456459 B2 JP H0456459B2 JP 10094882 A JP10094882 A JP 10094882A JP 10094882 A JP10094882 A JP 10094882A JP H0456459 B2 JPH0456459 B2 JP H0456459B2
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- sintered body
- chip carrier
- leadless chip
- guide hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 description 11
- 238000005245 sintering Methods 0.000 description 8
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 4
- 238000005219 brazing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Furnace Charging Or Discharging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】
(a) 発明の技術分野
本発明は焼結体の位置決め方法に関するもので
あり、特に半導体集積回路装置である小型のリー
ドのないチツプキヤリア（Lead−less Chip
Carrier略してLCC）などの焼結体部品の位置決
め方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a method for positioning a sintered body, and in particular to a method for positioning a sintered body, particularly for a small lead-less chip carrier, which is a semiconductor integrated circuit device.
This relates to a method for positioning sintered parts such as carrier (LCC).
(b) 技術の背景
最近電子装置の小型化、あるいは取扱い上の便
利さから小型のLCCの需要が増加の傾向にあり、
かつ最近セラミツクパツケージの製作工数を削減
するために複数のセラミツクパツケージを同様に
一体化して作成し、焼結後、個々のセラミツクパ
ツケージに分割するセラミツクパツケージの製作
方法が用いられている。(b) Technology background Recently, demand for small LCCs has been increasing due to the miniaturization of electronic devices and convenience in handling.
Recently, in order to reduce the number of steps required for manufacturing ceramic packages, a method of manufacturing ceramic packages has been used in which a plurality of ceramic packages are similarly integrated, and after sintering, the ceramic packages are divided into individual ceramic packages.
(c) 従来技術と問題点
一般に半導体装置などに使用されるセラミツク
パツケージはアルミナ（Al2O3）と焼結助剤の二
酸化硅素（SiO2）、酸化マグネシウム（MgO）等
の紛末を有機溶剤に溶かし、軟い板状に成形した
グリーンシートに所要の電気的に接続する回路網
をメタライジングし複数枚重ね合せ焼結して作ら
れる。(c) Conventional technology and problems Ceramic packages used in semiconductor devices are generally made of organic powders such as alumina (Al 2 O 3 ) and sintering aids such as silicon dioxide (SiO 2 ) and magnesium oxide (MgO). It is made by melting green sheets in a solvent, forming them into a soft plate, metallizing them with the necessary electrical connection circuitry, stacking them together and sintering them.
従来例として焼結体の位置決め方法に使用され
る４個連続したリードレスチツプキヤリアの外形
図を第１図に示す。図においてａは平面図、ｂは
一部側断面図、ｃは第１図ａにおけるＡ−A′一
部断面図であつて、１はリードレスチツプキヤリ
ア、１１はグリーンシートを焼合して成る層、１
２はガイド穴、１３は破断用溝、１４は半導体素
子接着部、１５はワイヤボンデング部、１６はキ
ヤツプ封止部を示す。 FIG. 1 shows an external view of four consecutive leadless chip carriers used in a conventional method for positioning sintered bodies. In the figure, a is a plan view, b is a partial side sectional view, and c is a partial sectional view taken along line A-A' in FIG. layer consisting of 1
2 is a guide hole, 13 is a breaking groove, 14 is a semiconductor element bonding part, 15 is a wire bonding part, and 16 is a cap sealing part.
所要のガイド穴１２を用いてグリーンシート１
１を三層に重ね合せて、約1500℃の温度で焼結し
リードレスチツプキヤリア１が製作される。 Green sheet 1 using the required guide holes 12
Leadless chip carrier 1 is manufactured by stacking three layers of 1 and sintering at a temperature of about 1500°C.
しかしこのようなセラミツクパツケージに、焼
結後部品を付加する場合例えばリードレスチツプ
キヤリア１の裏面に放熱のためスタツド（Stud）
を取りつける場合、一般に穴を有する連続帯状体
の位置を決める方式として二つの穴を選んで位置
決め基準とすることが従来より行われている。 However, when adding parts to such a ceramic package after sintering, for example, studs are installed on the back side of the leadless chip carrier 1 for heat dissipation.
When attaching a belt, the conventional method for determining the position of a continuous strip having holes is to select two holes and use them as positioning references.
従来の焼結体位置決め機構の断面図を第２図に
示す。図において前図と同等の部分については同
一符号を付している。２１は下型位置合せ治具、
２２は上型位置合せ治具用嵌合ピン、２３はリー
ドレスチツプキヤリア位置決め用嵌合ピン、２４
は上型位置合せ治具、２４１はスタツド位置決め
用穴、２５はスタツド、２６はロウ付用銀銅合金
を示す。なお、ロウ付用銀銅合金が当接するリー
ドレスチツプキヤリア１の表面には予め図示しな
いメタライズパターンが形成されているものとす
る。 A cross-sectional view of a conventional sintered body positioning mechanism is shown in FIG. In the figure, parts that are equivalent to those in the previous figure are given the same reference numerals. 21 is a lower die positioning jig;
22 is a fitting pin for the upper mold positioning jig, 23 is a fitting pin for leadless chip carrier positioning, 24
241 is a stud positioning hole, 25 is a stud, and 26 is a silver-copper alloy for brazing. It is assumed that a metallized pattern (not shown) has been formed in advance on the surface of the leadless chip carrier 1 that the silver-copper alloy for brazing comes into contact with.
下型位置合せ治具２１に設けられたリードレス
チツプキヤリア位置決め用嵌合ピン２３にリード
レスチツプキヤリア１の積層用ガイド穴１２を利
用してはめ込む。この場合半導体素子部を下側に
向けてはめ込むのは当然であるが最適のガイド穴
２個を利用してリードレスチツプキヤリア１の位
置決め基準とする。次いで上型位置合せ治具２４
を下型の上型位置合せ治具用嵌合ピン２２にはめ
込み、前記位置合せ治具２４に設けられたスタツ
ド位置決め用穴２４１に放熱用のスタツド２５を
挿入してロウ付け用銀銅合金２６を用いてリード
レスチツプキヤリア１の裏面の所定の位置にロウ
付けされる。 The leadless chip carrier 1 is fitted into the leadless chip carrier positioning fitting pin 23 provided on the lower mold positioning jig 21 using the stacking guide hole 12 of the leadless chip carrier 1. In this case, it is natural to fit the semiconductor element portion downward, but the two optimum guide holes are used as a reference for positioning the leadless chip carrier 1. Next, the upper mold positioning jig 24
into the fitting pin 22 for the upper mold positioning jig of the lower mold, insert the stud 25 for heat dissipation into the stud positioning hole 241 provided in the positioning jig 24, and attach the silver-copper alloy 26 for brazing. It is brazed to a predetermined position on the back surface of the leadless chip carrier 1 using a .
しかしながら上述したリードレスチツプキヤリ
ア１は製造工程において約1500℃の焼結温度で加
熱されるため約20％の収縮が起り変形し、寸法精
度が必ずしも良くない。したがつてリードレスチ
ツプキヤリア１のように益々小型化され寸法精度
が要求される場合、従来の焼結体の位置決め方法
で正確な位置決めは困難であり製作上大きな障害
となつていた。 However, since the leadless chip carrier 1 described above is heated at a sintering temperature of about 1500° C. during the manufacturing process, it shrinks by about 20% and becomes deformed, and its dimensional accuracy is not necessarily good. Therefore, in cases such as the leadless chip carrier 1, which is becoming increasingly smaller and requires dimensional accuracy, it is difficult to accurately position the sintered body using the conventional positioning method of the sintered body, which poses a major obstacle in manufacturing.
(d) 発明の目的
本発明の目的は焼結体の位置決め方法におい
て、焼結体のガイド穴の位置と形状を収縮現象に
対して最も影響の受けない位置を選定し、かつ影
響を受けても精密に位置決め可能な形状に加工
し、それに対応した位置合せ治具を用いて精密に
位置決めすることが可能な焼結体の位置決め方法
の提供にある。(d) Purpose of the Invention The purpose of the present invention is to provide a method for positioning a sintered body, in which the position and shape of a guide hole in a sintered body are selected to be the least affected by shrinkage phenomena, and to Another object of the present invention is to provide a method for positioning a sintered body which can be processed into a shape that allows precise positioning and can be precisely positioned using a corresponding positioning jig.
(e) 発明の構成
本発明は嵌合ピンを具備する位置合わせ治具を
用いて焼結体の位置を規定するに際し、該焼結体
の中心に円形のガイド穴を設けると共に、該焼結
体の周辺部に前記ガイド穴の中心部を通る複数の
直線と同一方向にそれぞれ長径方向を有する長円
形のガイド穴を配設し、前記円形ガイド穴と所要
の前記長円ガイド穴とを前記嵌合ピンとはめ合わ
せることより焼結体の位置を規定することを特徴
としている。(e) Structure of the Invention The present invention provides a circular guide hole in the center of the sintered body when defining the position of the sintered body using a positioning jig equipped with a fitting pin. Oval guide holes each having a major diameter direction in the same direction as a plurality of straight lines passing through the center of the guide holes are provided in the peripheral part of the body, and the circular guide holes and the required oval guide holes are connected to the It is characterized by defining the position of the sintered body by fitting it with a fitting pin.
(f) 発明の実施例
以下本発明の一実施例を図面を参照して具体的
に説明する。(f) Embodiment of the Invention An embodiment of the present invention will be specifically described below with reference to the drawings.
第３図は本発明による焼結体の位置決め方法に
使用されるリードレスチツプキヤリアの外形図を
示し、図においてａは平面図、ｂは第３図ａにお
けるＢ−B′一部断面を示す正面図であつて、前
図と同等の部分については同一符号を付してい
る。３はリードレスチツプキヤリア、３１は円形
ガイド穴、３２は長円ガイド穴を示す。 FIG. 3 shows an external view of a leadless chip carrier used in the method for positioning a sintered body according to the present invention, in which a is a plan view and b is a partial cross section taken along line B-B' in FIG. 3a. It is a front view, and the same parts as in the previous figure are given the same reference numerals. 3 represents a leadless chip carrier, 31 represents a circular guide hole, and 32 represents an oblong guide hole.
焼結工程において最も収縮現象の影響を受けな
い焼結体即ちリードレスチツプキヤリア３の中心
に円形のガイド穴３１を設け、周辺部に円形ガイ
ド穴３１の中心を通る直線上、即ち収縮方向にそ
つてＸ軸上に２個、Ｙ軸上に２個の長円形ガイド
穴３２が設けられている。 A circular guide hole 31 is provided at the center of the sintered body that is least affected by the shrinkage phenomenon in the sintering process, that is, the leadless chip carrier 3, and a circular guide hole 31 is provided at the periphery on a straight line passing through the center of the circular guide hole 31, that is, in the shrinkage direction. Two oval guide holes 32 are provided on the X-axis and two oval guide holes 32 on the Y-axis.
次に本発明による焼結体の位置決め機構の断面
図を第４図に示すが前図と同等の部分については
同一符号を付している。図において４１は下型位
置合せ治具、４２は上型位置合せ治具用嵌合ピ
ン、４３および４３′はリードレスチツプキヤリ
ア位置決め用嵌合ピン、４４は上型位置合せ治
具、４４１はスタツド位置決め用穴を示す。 Next, a sectional view of the sintered body positioning mechanism according to the present invention is shown in FIG. 4, in which the same parts as in the previous figure are given the same reference numerals. In the figure, 41 is a lower mold positioning jig, 42 is a fitting pin for the upper mold positioning jig, 43 and 43' are fitting pins for positioning the leadless chip carrier, 44 is an upper mold positioning jig, and 441 is a fitting pin for positioning the leadless chip carrier. Stud positioning holes are shown.
下型位置合せ治具４１に設けられたリードレス
チツプキヤリア位置決め用嵌合ピン４３にリード
レスチツプキヤリア３の中心に設けられた円形ガ
イド穴３１を回転自在にはめ合せることにより、
リードレスチツプキヤリア３のセンター位置を規
定する。 By rotatably fitting the circular guide hole 31 provided at the center of the leadless chip carrier 3 to the leadless chip carrier positioning fitting pin 43 provided on the lower mold positioning jig 41,
The center position of the leadless chip carrier 3 is defined.
さらに周辺部に設けられた長円ガイド穴３２の
４個の中から前もつて光学的に素子（図示してい
ない）との相関を調べて最適位置にある長円ガイ
ド穴３２を選定してリードレスチツプキヤリア位
置決め用嵌合ピン４３′にはめ合せることにより
角度を規定する。 Furthermore, from among the four oval guide holes 32 provided in the peripheral area, the oval guide hole 32 at the optimum position is selected by optically examining the correlation with the element (not shown). The angle is defined by fitting into the leadless chip carrier positioning fitting pin 43'.
次いで、上型位置合せ治具４４を下型の上型位
置合せ治具用嵌合ピン４２にはめ込み、前記位置
合せ治具４４に設けられたスタツド位置決め用穴
４４１に放熱用のスタツド２５を挿入して、ロウ
付用銀銅合金２６を用いてリードレスチツプキヤ
リア３の裏面の所定の位置にロウ付けされる。 Next, the upper mold positioning jig 44 is fitted into the upper mold positioning jig fitting pin 42 of the lower mold, and the stud 25 for heat radiation is inserted into the stud positioning hole 441 provided in the positioning jig 44. Then, it is brazed to a predetermined position on the back surface of the leadless chip carrier 3 using a silver-copper alloy 26 for brazing.
以上第３図及び第４図で説明した本発明の焼結
体の位置決め方法においては、焼結体の焼結工程
における収縮現象の最も影響を受けない中心部に
回転自在の円形ガイド穴及び中心を通る直線上の
周辺部に長円形ガイド穴を設け、それに対応した
位置合せ治具を用いることによつて極めて精密に
位置決めすることが可能となる。 In the method for positioning a sintered body according to the present invention as explained above with reference to FIGS. By providing an oval guide hole in the periphery of a straight line passing through the hole and using a corresponding alignment jig, extremely precise positioning is possible.
(g) 発明の効果
以上はセラミツクパツケージにスタツドを取り
つける実施例で説明したがこのように焼結後に付
属部品を取りつける場合、本発明にかかる位置決
め方法を用いると、所要の位置合せ治具への嵌め
込みも問題がなく、かつ精度よく取りつけること
ができる。(g) Effects of the Invention The above was explained using an example of attaching a stud to a ceramic package, but when attaching an accessory part after sintering, using the positioning method according to the present invention, it is possible to attach a stud to a required alignment jig. There is no problem with fitting, and it can be installed with high accuracy.
したがつて本発明によれば、高精度のセラミツ
クパツケージを作業性よく形成することができる
ものである。 Therefore, according to the present invention, a highly precise ceramic package can be formed with good workability.
尚本発明の位置決め方法は部品取りつけのみな
らず、個々のセラミツクパツケージに分割する場
合にも利用でき、同様に精度よく作製できるもの
である。 The positioning method of the present invention can be used not only for attaching parts but also for dividing ceramic packages into individual ceramic packages, and can similarly be manufactured with high precision.
第１図は従来のリードレスチツプキヤリアの外
形図であつて、ａは平面図、ｂは一部側断面図、
ｃは第１図ａにおけるＡ−A′一部断面正面図、
第２図は従来の焼結体の位置決め機構の断面図、
第３図は本発明のリードレスチツプキヤリアの外
形図であつて、ａは平面図、ｂは第３図ａにおけ
るＢ−B′一部断面正面図、第４図は本発明によ
る焼結体の位置決め機構の断面図である。
図において、１，３はリードレスチツプキヤリ
ア、１２はガイド穴、２１，４１は下型位置合せ
治具、２２，４２は上型位置合せ治具用嵌合ピ
ン、４３，４３′はリードレスチツプキヤリア位
置決め用嵌合ピン、２３，４４は上型位置合せ治
具、３１は円形ガイド穴、３２は長円ガイド穴。
FIG. 1 is an external view of a conventional leadless chip carrier, in which a is a plan view, b is a partial side sectional view,
c is a partially sectional front view taken along line A-A' in Fig. 1a;
Figure 2 is a cross-sectional view of a conventional sintered body positioning mechanism.
FIG. 3 is an external view of the leadless chip carrier of the present invention, in which a is a plan view, b is a partially sectional front view taken along line B-B' in FIG. 3a, and FIG. 4 is a sintered body according to the present invention. FIG. 3 is a cross-sectional view of the positioning mechanism of FIG. In the figure, 1 and 3 are leadless chip carriers, 12 is a guide hole, 21 and 41 are lower mold positioning jig, 22 and 42 are fitting pins for the upper mold positioning jig, and 43 and 43' are leadless chip carriers. A fitting pin for positioning the chip carrier, 23 and 44 are upper mold positioning jigs, 31 is a circular guide hole, and 32 is an oblong guide hole.
Claims (1)
焼結体の位置を規定するに際し、該焼結体の中心
に円形のガイド穴を設けると共に、該焼結体の周
辺部に前記ガイド穴の中心を通る複数の直線と同
一方向にそれぞれ長径方向を有する長円形のガイ
ド穴を配設し、前記円形ガイド穴と所要の前記長
円ガイド穴とを、前記嵌合ピンとはめ合わせるこ
とにより焼結体の位置を規定することを特徴とす
る焼結体の位置決め方法。1. When defining the position of a sintered body using a positioning jig equipped with a fitting pin, a circular guide hole is provided in the center of the sintered body, and the guide hole is provided at the periphery of the sintered body. By arranging oval guide holes each having a long diameter direction in the same direction as a plurality of straight lines passing through the center of A method for positioning a sintered body, characterized by defining the position of the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10094882A JPS58218145A (en) | 1982-06-11 | 1982-06-11 | Positioning method of sintered body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10094882A JPS58218145A (en) | 1982-06-11 | 1982-06-11 | Positioning method of sintered body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58218145A JPS58218145A (en) | 1983-12-19 |
| JPH0456459B2 true JPH0456459B2 (en) | 1992-09-08 |
Family
ID=14287567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10094882A Granted JPS58218145A (en) | 1982-06-11 | 1982-06-11 | Positioning method of sintered body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58218145A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60207788A (en) * | 1984-03-29 | 1985-10-19 | 三菱電機株式会社 | Positioning device for industrial robot |
| US7266868B2 (en) | 2003-06-30 | 2007-09-11 | Brother Kogyo Kabushiki Kaisha | Method of manufacturing liquid delivery apparatus |
-
1982
- 1982-06-11 JP JP10094882A patent/JPS58218145A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58218145A (en) | 1983-12-19 |
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