JPH0456391A - Inspecting method for copper circuit of circuit board for inner layer - Google Patents
Inspecting method for copper circuit of circuit board for inner layerInfo
- Publication number
- JPH0456391A JPH0456391A JP16785890A JP16785890A JPH0456391A JP H0456391 A JPH0456391 A JP H0456391A JP 16785890 A JP16785890 A JP 16785890A JP 16785890 A JP16785890 A JP 16785890A JP H0456391 A JPH0456391 A JP H0456391A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- acid
- inner layer
- circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 86
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 72
- 239000010949 copper Substances 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims abstract description 29
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000002253 acid Substances 0.000 claims abstract description 29
- 239000005751 Copper oxide Substances 0.000 claims abstract description 27
- 229910000431 copper oxide Inorganic materials 0.000 claims abstract description 27
- 239000003513 alkali Substances 0.000 claims abstract description 14
- 230000001590 oxidative effect Effects 0.000 claims abstract description 5
- 239000003638 chemical reducing agent Substances 0.000 claims description 9
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 5
- 229910000085 borane Inorganic materials 0.000 claims description 4
- -1 borane compound Chemical class 0.000 claims description 4
- 229910001854 alkali hydroxide Inorganic materials 0.000 claims description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 2
- 239000000243 solution Substances 0.000 abstract description 21
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract description 6
- 239000012670 alkaline solution Substances 0.000 abstract description 4
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 abstract description 2
- 238000005507 spraying Methods 0.000 abstract description 2
- XTEGARKTQYYJKE-UHFFFAOYSA-N chloric acid Chemical compound OCl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-N 0.000 abstract 1
- 229940005991 chloric acid Drugs 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 abstract 1
- 229960004643 cupric oxide Drugs 0.000 description 25
- 239000007864 aqueous solution Substances 0.000 description 13
- 239000011889 copper foil Substances 0.000 description 13
- 238000010306 acid treatment Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 125000001475 halogen functional group Chemical group 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000006386 neutralization reaction Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 2
- 229960002218 sodium chlorite Drugs 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- FUSNOPLQVRUIIM-UHFFFAOYSA-N 4-amino-2-(4,4-dimethyl-2-oxoimidazolidin-1-yl)-n-[3-(trifluoromethyl)phenyl]pyrimidine-5-carboxamide Chemical compound O=C1NC(C)(C)CN1C(N=C1N)=NC=C1C(=O)NC1=CC=CC(C(F)(F)F)=C1 FUSNOPLQVRUIIM-UHFFFAOYSA-N 0.000 description 1
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- BIVUUOPIAYRCAP-UHFFFAOYSA-N aminoazanium;chloride Chemical compound Cl.NN BIVUUOPIAYRCAP-UHFFFAOYSA-N 0.000 description 1
- MOOAHMCRPCTRLV-UHFFFAOYSA-N boron sodium Chemical compound [B].[Na] MOOAHMCRPCTRLV-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
- 239000012493 hydrazine sulfate Substances 0.000 description 1
- 229910000377 hydrazine sulfate Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Abstract
Description
本発明は、多層プリント配線板の製造に用いる内層用回
路板の銅回路検査方法に関するものである。The present invention relates to a copper circuit inspection method for inner layer circuit boards used in the production of multilayer printed wiring boards.
多層プリント配線板は、片面乃至両面に銅箔等で回路を
形成した内層用回路板にプリプレグを介して外層用回路
板もしくは銅箔を重ね、これを加熱加圧成形して内層用
回路板と外層用回路板もしくは銅箔とをＭＩＭすること
によって製造されるのが一般的である。
そして、内層用回路板に形成した銅の回路と外層用回路
板もしくは銅箔を積層させるプリプレグの樹脂との接着
性を確保することが必要である。
特に内層用回路板の回路を電解銅箔によって形成する場
合、銅箔の片面は粗面に形成されるが他の片面は平滑面
に形成されており、内層用回路板の製造に際しては粗面
で銅箔を接着させているために、内層用回路板の銅回路
の表面は銅箔の平滑面となり、銅回路とプリプレグの樹
脂との接着性は非常に低くなるものであって、接着性を
高める工夫が必要となる。
そこで、従来から種々の方法で銅の回路と樹脂との接着
性を高めることが検討されており、銅回路の表面に銅酸
化物を形成して接着性を高めることが一般になされてい
る。銅を酸化させると表面に微細な凹凸が生じるために
銅回路の表面を粗面化して、銅の回路と樹脂との接着性
を高めることができるのである。この銅回路の表面に銅
酸化物を形成する方法としては、過硫酸カリウムを含む
アルカリ水溶液、あるいは亜塩素酸ナトリウムを含むア
ルカリ水溶液を用いて処理することによっておこなうこ
とが一般的である。しかしながら、特開昭５６−１５３
７９７号公報や特開昭６１−１７６１９２号公報におい
ても報告されているように、酸化銅は酸に溶解し易いた
めに、スルーホールをドリル加工したあとスルーホール
メツキをする際に化学メツキ液に浸漬すると、スルーホ
ールの内周に露出する銅回路の断面部分の銅酸化物がメ
ツキ液の酸（塩＊＊＞に溶解し、スルーホールの内周か
ら銅回路と樹脂との界面を酸が浸入する溶解侵食が発生
するいわゆるハロー現象が起こり易（なり、多層プリン
ト配線板の信頼性が低下することになる。
このために、銅回路の表面を酸化処理して銅酸化物を形
成させた後に、銅回路の表面の銅酸化物を還元処理する
ことによって、銅回路の表面を酸に溶解しない状態にし
、ハロー現象が起こることを防止することがなされてい
る。
酸化銅を還元する方法としては、幾つかの方法が知られ
ている。その−は、銅回路を酸化処理した後に銅回路の
表面に亜鉛等の金属粉末をコーティングし、酸溶液にこ
れを浸漬して金属粉末を溶解させる際に発生する発生期
の水素で銅回路の表面の銅酸化物を還元させる方法であ
る。また他の方法として、特開昭５６−１５３７９７号
公報に記載されているような、アルカリ性還元剤溶液を
用いて酸化銅を還元させる方法や、特開昭６１−１７６
１９２号公報に記載されて暫するような、ポラン類溶液
を用いて＃！酸化物を還元させる方法がある。A multilayer printed wiring board is made by layering an outer layer circuit board or copper foil via prepreg on an inner layer circuit board with a circuit formed on one or both sides using copper foil, etc., and forming this under heat and pressure to form an inner layer circuit board. It is generally manufactured by MIMing an outer layer circuit board or copper foil. It is also necessary to ensure adhesion between the copper circuit formed on the inner layer circuit board and the resin of the prepreg on which the outer layer circuit board or copper foil is laminated. In particular, when forming circuits on inner layer circuit boards using electrolytic copper foil, one side of the copper foil is formed with a rough surface, while the other side is formed with a smooth surface. Because the copper foil is bonded to the inner layer circuit board, the surface of the copper circuit on the inner layer circuit board becomes a smooth surface of the copper foil, and the adhesion between the copper circuit and the prepreg resin is extremely low. Efforts are needed to increase this. Therefore, various methods have been studied to improve the adhesion between copper circuits and resins, and it is common practice to form copper oxide on the surface of copper circuits to improve the adhesion. When copper is oxidized, fine irregularities are generated on the surface, which makes it possible to roughen the surface of the copper circuit and improve the adhesion between the copper circuit and the resin. The copper oxide is generally formed on the surface of the copper circuit by treatment with an alkaline aqueous solution containing potassium persulfate or an alkaline aqueous solution containing sodium chlorite. However, JP-A-56-153
As reported in Publication No. 797 and Japanese Unexamined Patent Publication No. 176192/1982, copper oxide is easily dissolved in acid, so when plating through holes after drilling through holes, it is difficult to use chemical plating solution. When immersed, the copper oxide in the cross section of the copper circuit exposed on the inner periphery of the through-hole dissolves in the acid (salt**) of the plating solution, and the acid flows from the inner periphery of the through-hole to the interface between the copper circuit and the resin. The so-called halo phenomenon, in which penetrating dissolution erosion occurs, is likely to occur (and reduces the reliability of multilayer printed wiring boards. For this reason, the surface of copper circuits is oxidized to form copper oxides. Later, by reducing the copper oxide on the surface of the copper circuit, the surface of the copper circuit was made insoluble in acid, and the halo phenomenon was prevented from occurring.As a method for reducing copper oxide Several methods are known.One method is to oxidize the copper circuit, then coat the surface of the copper circuit with metal powder such as zinc, and then immerse it in an acid solution to dissolve the metal powder. This is a method of reducing copper oxide on the surface of a copper circuit with nascent hydrogen generated during the process.Another method is to use an alkaline reducing agent solution as described in JP-A-56-153797. A method of reducing copper oxide using
#! Using a poran solution as described in Publication No. 192 for a while. There is a method to reduce oxides.
本発明に係る内層用回路板の銅回路の検渣方法は、内層
用回路板に設けた銅の回路を酸化処理して回路の表面に
銅酸化物を形成すると共にこの銅酸化物を還元処理する
ことによって、銅の回路の表面を粗面化した内層用回路
板において、還元処理後に銅の回路の表面を酸又はアル
カリで処理して未還元部分を溶解させることを特徴とす
るものである。
以下本発明の詳細な説明する。
内層用回路板としては、銅箔を張った銅張〃ラスエポキ
シ樹脂積層板、銅張〃ラスポリイミド樹脂積層板などを
用いて銅箔をエツチング処理等することによって、片面
もしくは両面に銅の回路を設けて形成したものを用いる
ことができるが、さらに積層板に化学メツキや電気メツ
キで銅の回路を片面もしくは両面に形成したものを用い
ることもできる。そしてこの内層用回路板の銅回路の表
面を処理するにあたっては、まず物理的あるいは化学的
手段で内層用回路板の表面を粗面化処理しておくのが好
ましい、粗面化処理は、バフ研摩、ソフトエツチング等
による化学処理、電解処理、液体ホーニング等によって
おこなうことができる。
銅箔として両面が粗面に予め形成されたものを用いる場
合には、このような粗面化処理は省略することができる
。
次に、この内層用回路板の銅回路の表面を酸化処理する
。酸化処理は、過硫酸カリウムを含むアルカリ水溶液や
、亜塩素酸ナトリウムを含むアルカリ水溶液など、酸化
剤を含むアルカリ水溶液を用いて処理することによって
おこなうことができる。このように酸化処理することに
よって銅回路の表面に黒色の銅酸化物を形成することが
できる。
銅酸化物は酸化第一銅あるいは酸化第二銅によって形成
されるものであり、銅回路の表面には銅酸化物の針状物
による微細な凹凸が形成されて粗面化される。
このように内層用回路板の銅回路の表面に銅酸化物を形
成させた後に、銅回路の表面を還元処理して銅酸化物を
還元させる。既述の特開昭５６−１５３７９７号公報や
特開昭６１−１７６１９２号公報においても報告されて
いるように、銅酸化物を還元させることによって酸に溶
解しない状態にすることができるものである。還元処理
は特開昭５６−１５３７９７号公報に記載されているよ
うなアルカリ性還元剤溶液を用いておこなうことができ
る。アルカリ性還元剤溶液としては、ｐＨ７〜１３の水
溶液に還元剤としてホルマリン、次亜リン酸、次亜リン
酸ナトリフム、抱水ヒＰラジン、塩酸ヒドラジン、硫酸
ヒドラジン、水素化ホウ素ナトリウム、Ｎ、Ｎ’−）リ
メチルボフザン、Ｎ、Ｎ’−ノメチルボラゼンなどの一
種又は二種以上を溶解したものを使用することができる
。またアルカリ性還元剤溶液に代えて、特開昭６１−１
７６１９２号公報に記載されているようなボラン化合物
溶液を用いて還元処理をおこなうこともできる。ボラン
化合物としては、ジメチルアミンボラン（（ＣＨ３）２
・ＨＮ−ＢＨ，）や、ナトリッムボラン（ＮａＢＨ，）
などを使用することができる。
上記のようにして内層回路板の銅回路の表面を還元処理
した後に、酸溶液あるいはアルカリ溶液で銅回路の表面
を処理する。この処理は酸溶液あるいはアルカリ溶液中
に内層用回路板を浸漬したり、内層用回路板の表面にこ
れらの溶液をスプレーしたりしておこなうことができる
。＊た酸としては硫酸や塩酸、スル７７ミン酸などの酸
化力の低い酸を用いるのが好ましく、アルカリとしては
水酸化ナトリウムなど６Ｎ以上の水酸化アルカリを用い
るのが好ましい。このように酸あるいはアルカリで銅回
路の表面を処理すると、銅回路の表面のうち還元が十分
になされている部分は酸やアルカリに溶解しないが、還
元不足で酸化銅のまま残っている部分があるとこの酸化
銅は酸やアルカリに溶解するために、銅回路の銅の部分
が露出して銅回路の表面の黒色が銅色に変色する。従っ
て、酸あるいはアルカリで銅回路の表面を処理して銅色
への変色が発生するか否か検壺することによって、還元
が十分におこなわれているか還元不足があるかを目視で
容易にチエツクすることができるものである。
そしてあとは上記のように銅回路の表面を粗面化処理さ
れた内層用回路板を用いて、通常の工程で多層プリント
配線板を製造することができる。
すなわち、この内層用回路板にプリプレグを介して外層
用回路板（あるいは他の内層用回路板）やもしくは銅箔
を重ね、これを加熱加圧して積層成形すること１こよっ
てプリプレグをボンディング層として多層に積層し、さ
らにスルーホールをドリル加工して設けると共に化学メ
ツキ等によってスル−ホールメツキを施し、さらにエツ
チング等の処理をして外層回路を形成することによって
、多層プリント配線板を製造することができる。The method for detecting a copper circuit on an inner layer circuit board according to the present invention includes oxidizing a copper circuit provided on an inner layer circuit board to form copper oxide on the surface of the circuit, and reducing the copper oxide. In the inner layer circuit board in which the surface of the copper circuit is roughened by doing this, the surface of the copper circuit is treated with acid or alkali after the reduction treatment to dissolve the unreduced portion. . The present invention will be explained in detail below. For the inner layer circuit board, a copper-clad lath epoxy resin laminate, a copper-clad lath polyimide resin laminate, etc., covered with copper foil can be used, and by etching the copper foil, a copper circuit can be formed on one or both sides. It is also possible to use a laminated board with a copper circuit formed on one or both sides by chemical plating or electroplating. When treating the surface of the copper circuit on the inner layer circuit board, it is preferable to first roughen the surface of the inner layer circuit board by physical or chemical means. This can be done by chemical treatment such as polishing, soft etching, electrolytic treatment, liquid honing, etc. In the case of using a copper foil with rough surfaces on both sides, such a roughening treatment can be omitted. Next, the surface of the copper circuit of this inner layer circuit board is oxidized. The oxidation treatment can be performed using an alkaline aqueous solution containing an oxidizing agent, such as an alkaline aqueous solution containing potassium persulfate or an alkaline aqueous solution containing sodium chlorite. By performing the oxidation treatment in this manner, black copper oxide can be formed on the surface of the copper circuit. Copper oxide is formed by cuprous oxide or cupric oxide, and the surface of the copper circuit is roughened by forming fine irregularities due to the needle-like particles of copper oxide. After forming copper oxide on the surface of the copper circuit of the inner layer circuit board in this manner, the surface of the copper circuit is subjected to a reduction treatment to reduce the copper oxide. As reported in the previously mentioned JP-A-56-153797 and JP-A-61-176192, copper oxide can be made insoluble in acids by reducing it. . The reduction treatment can be carried out using an alkaline reducing agent solution as described in JP-A-56-153797. The alkaline reducing agent solution includes formalin, hypophosphorous acid, sodium hypophosphite, hydrazine hydrate, hydrazine hydrochloride, hydrazine sulfate, sodium borohydride, N, N' as a reducing agent in an aqueous solution with a pH of 7 to 13. -) A solution containing one or more of lymethylbofuzan, N,N'-nomethylborazene, etc. can be used. Also, instead of using an alkaline reducing agent solution, JP-A-61-1
The reduction treatment can also be carried out using a borane compound solution as described in Japanese Patent No. 76192. As a borane compound, dimethylamine borane ((CH3)2
・HN-BH,) and sodium borane (NaBH,)
etc. can be used. After the surface of the copper circuit of the inner layer circuit board is subjected to the reduction treatment as described above, the surface of the copper circuit is treated with an acid solution or an alkaline solution. This treatment can be carried out by immersing the inner layer circuit board in an acid solution or alkaline solution, or by spraying these solutions onto the surface of the inner layer circuit board. *As the acid, it is preferable to use an acid with low oxidizing power such as sulfuric acid, hydrochloric acid, or sulfuric acid, and as the alkali, it is preferable to use an alkali hydroxide of 6N or more such as sodium hydroxide. When the surface of a copper circuit is treated with acid or alkali in this way, the part of the surface of the copper circuit that has been sufficiently reduced will not dissolve in the acid or alkali, but the part that is insufficiently reduced and remains as copper oxide will dissolve. In some cases, this copper oxide dissolves in acid or alkali, which exposes the copper portion of the copper circuit, causing the black surface of the copper circuit to turn copper-colored. Therefore, by treating the surface of the copper circuit with acid or alkali and inspecting the jar to see if discoloration to copper occurs, it is easy to visually check whether sufficient reduction is occurring or whether there is insufficient reduction. It is something that can be done. After that, a multilayer printed wiring board can be manufactured by normal processes using the inner layer circuit board whose surface of the copper circuit has been roughened as described above. That is, the outer layer circuit board (or other inner layer circuit board) or copper foil is layered on this inner layer circuit board via prepreg, and this is heated and pressed to form a laminated layer.1Thus, the prepreg is used as a bonding layer. A multilayer printed wiring board can be manufactured by laminating multiple layers, drilling through holes, applying through hole plating by chemical plating, etc., and then forming an outer layer circuit by etching or other processing. can.
次に本発明を実施例によって説明する。
叉１性１
■ 両面に７０μ論厚の銅箔を張って形成した厚み１．
〇−瞭の〃ラス布基材エポキシ樹脂積層板を用いて内層
用回路板を作成し、内層用回路板の銅回路の表面をバフ
研摩して粗面化処理した。
■ 次に、
Ｋ ２８２０ ｇ ・・・１３ｇ／＆ＮａＯ
Ｈ−５５ｇ／ｌ
の組成の過硫酸カリウム浴を６０℃に調整し、この酸化
処理浴に内層用回路板を３分間浸漬して銅回路の表面を
酸化処理した後、水洗して乾燥した。
■ 次に、銅回路の表面の銅酸化物に１０１２程度の面
積で未還元部分を形成させるために、ポリエチレングリ
フールを加熱して銅回路の一部の表面に塗布すると共に
冷却して固化させた。
■ 次に、ジメチルアミンポラン２０ｇ／ｌの組成の洛
中に内層用回路板を浸漬し、３０℃でＨ２の発生がなく
なるまで銅回路の表面の銅酸化物を還元処理した。
■ 次に湯洗して■で塗布したポリエチレングリコール
を除去した。
■ この後に、上記処理をおこなった内層用回路板を２
０％Ｈ２ＳＯ，水溶液に２０分間浸漬し、酸処理をおこ
なった。
■ 最後に、内層用回路板をＮ １２００３水溶液で中
和した後に乾燥し、そして内層用回路板を目視検査して
、未還元部分の存在を発見できる牢をチエツクした。
Ｘ１１［ζ
実施例１の■の酸処理を２０％Ｈ２Ｓ ０４水溶液から
５％ＨＣＩ水溶液に変えておこなった他は、実施例１と
同様にした。
犬１１」一
実施例１の■の酸処理を２０％Ｈ２Ｓｏ、水溶液から１
０％スルファミン酸水溶液に変えておこなった他は、実
施例１と同様にした。
割ｌ性１
実施例１の■の処理を２０％Ｈ２ＳＯ，水溶液による酸
処理から６Ｎ ＮａＯＨ水溶液によるアルカリ処理に
変えておこなった他は、実施例１と同様にした。
実施例１の■の還元処理をジメチルアミンボラン１こ変
えて、
ＨＣＨＯ・・・３０＠１／１
ＮａＯＨ−−−５ｇ／ｌ
の組成のアルカリ性還元剤洛中に４０℃でＨ２の発生が
な（なるまで内層用回路板を浸漬することによっておこ
なった他は、実施例１と同様にした。
Ｋ１九支
実施例１の■の工程を除き、■の還元処理中にＨ７が発
生している間に内層用回路板を取り出すようにした他は
、実施例１と同様にした。
埼剪１１ユ
実施例１においで■の酸処理をおこなわないと共に■の
中和の処理をおこなわない他は、実施例１と同様にした
。
凰氷遣」ユ
実施例５において■の酸処理をおこなわないと共に■の
中和の処理をおこなわない他は、実施例５と同様にした
。
ル豊渭」一
実施例６において■の酸処理をおこなわないと共に■の
中和の処理をおこなわない他は、実施例６と同様にした
。
上記実施例１〜６及び比較例１〜３においてチエツクし
た未還元の発見率を次表に示す。
画表にみちれるように、比較例１〜３のものでは内層用
回路板の銅回路の還元が十分におこなわれた表面も還元
不足の表面もともに黒色であるために、未還元の発見率
が低いが、実施例１〜５のものでは未還元の部分が銅色
に変色するためにいずれも１００％の率で未還元が発見
できるものであった。
【発明の効果１
上述のように本発明にあっては、内層用回路板に設けた
銅の回路を酸化処理して回路の表面に銅酸化物を形成す
ると共にこの銅酸化物を還元処理することによって、銅
の回路の表面を粗面化した内層用回路板において、還元
処理後の銅の回路の表面を酸又はアルカリで処理して未
還元部分を溶解させるようにしたので、銅回路の表面の
銅酸化物のうち還元が十分になされている部分は酸やア
ルカリに溶解しないが、還元不足で酸化銅のまま残って
いる部分があるとこの部分は酸やアルカリに溶解し、銅
回路の銅が露出して銅回路の表面の黒色が銅色に変色す
ることになり、還元処理が十分であるか不足であるかを
目視で容易に検査することがで終るものである。Next, the present invention will be explained by examples. 1. Thickness 1. Formed by applying 70μ thick copper foil on both sides.
A circuit board for the inner layer was prepared using a lath cloth-based epoxy resin laminate of 〇-Ryo, and the surface of the copper circuit of the circuit board for the inner layer was roughened by buffing. ■ Next, K 2820 g...13g/&NaO
A potassium persulfate bath having a composition of H-55 g/l was adjusted to 60°C, and the inner layer circuit board was immersed in this oxidation treatment bath for 3 minutes to oxidize the surface of the copper circuit, followed by washing with water and drying. ■Next, in order to form an unreduced part with an area of about 1012 on the copper oxide on the surface of the copper circuit, polyethylene glyfur is heated and applied to a part of the surface of the copper circuit, and then cooled and solidified. Ta. (2) Next, the inner layer circuit board was immersed in dimethylamineporan having a composition of 20 g/l, and the copper oxide on the surface of the copper circuit was reduced at 30° C. until no H2 was generated. ■ Next, the polyethylene glycol applied in step (■) was removed by washing with hot water. ■ After this, attach the inner layer circuit board that has undergone the above treatment to 2
An acid treatment was performed by immersing it in a 0% H2SO aqueous solution for 20 minutes. ■ Finally, the inner layer circuit board was neutralized with an aqueous N 12003 solution and then dried, and the inner layer circuit board was visually inspected to check for the presence of unreduced parts. X11[ζ The same procedure as in Example 1 was carried out, except that the acid treatment in Example 1 was changed from 20% H2S04 aqueous solution to 5% HCI aqueous solution. Dog 11'' Acid treatment in Example 1 (1) from 20% H2So, aqueous solution
The same procedure as in Example 1 was carried out except that 0% sulfamic acid aqueous solution was used. Breakability 1 The same procedure as in Example 1 was carried out, except that the treatment in Example 1 was changed from acid treatment with 20% H2SO and aqueous solution to alkali treatment with 6N NaOH aqueous solution. By changing the reduction treatment in Example 1 by one dimethylamine borane, no H2 was generated at 40°C in an alkaline reducing agent with a composition of HCHO...30@1/1 NaOH--5g/l. The procedure was the same as in Example 1, except that the inner layer circuit board was immersed until the temperature was reduced. The procedure was the same as in Example 1, except that the inner layer circuit board was taken out at the time. In Example 1, the acid treatment (2) was not performed and the neutralization treatment (2) was not performed. The same procedure as in Example 1 was carried out. The same procedure as in Example 5 was carried out except that the acid treatment (■) and the neutralization treatment (2) were not performed in Example 5. Example 6 was carried out in the same manner as in Example 6, except that the acid treatment (①) and the neutralization treatment (①) were not carried out. The detection rate is shown in the table below. As shown in the table, in Comparative Examples 1 to 3, both the surface where the copper circuits of the inner layer circuit boards were sufficiently reduced and the surface where the reduction was insufficient were black. Therefore, the rate of discovery of unreduced substances is low, but in Examples 1 to 5, unreduced areas were found at a rate of 100% because the unreduced portions turned copper-colored. Effect of the invention 1 As described above, in the present invention, the copper circuit provided on the inner layer circuit board is oxidized to form copper oxide on the surface of the circuit, and the copper oxide is reduced. In an inner layer circuit board with a roughened copper circuit surface, the surface of the copper circuit after reduction treatment was treated with acid or alkali to dissolve the unreduced portion, so the surface of the copper circuit was roughened. The part of the copper oxide that has been sufficiently reduced will not dissolve in acids or alkalis, but if there is a part that remains as copper oxide due to insufficient reduction, this part will dissolve in acids or alkalis, and the copper circuit will not dissolve. The copper is exposed and the black surface of the copper circuit changes to a copper color, making it easy to visually inspect whether the reduction treatment is sufficient or insufficient.
Claims (5)
路の表面に銅酸化物を形成すると共にこの銅酸化物を還
元処理することによって、銅の回路の表面を粗面化した
内層用回路板において、還元処理後に銅の回路の表面を
酸又はアルカリで処理して未還元部分を溶解させること
を特徴とする内層用回路板の銅回路の検査方法。(1) The surface of the copper circuit was roughened by oxidizing the copper circuit provided on the inner layer circuit board to form copper oxide on the surface of the circuit, and then reducing the copper oxide. A method for inspecting a copper circuit on an inner layer circuit board, which comprises treating the surface of the copper circuit with acid or alkali to dissolve unreduced portions after reduction treatment.
とを特徴とする請求項１に記載の内層用回路板の銅回路
の検査方法。(2) The method for inspecting a copper circuit of an inner layer circuit board according to claim 1, characterized in that the reduction treatment is performed using an alkaline reducing agent.
特徴とする請求項１に記載の内層用回路板の銅回路の検
査方法。(3) The method for inspecting a copper circuit of an inner layer circuit board according to claim 1, wherein the reduction treatment is performed using a borane compound.
する請求項１乃至３のいずれかに記載の内層用回路板の
銅回路の検査方法。(4) The method for inspecting a copper circuit of an inner layer circuit board according to any one of claims 1 to 3, characterized in that an acid with low oxidizing power is used as the acid.
ることを特徴とする請求項１乃至３のいずれかに記載の
内層用回路板の銅回路の検査方法。(5) The method for inspecting a copper circuit of an inner layer circuit board according to any one of claims 1 to 3, characterized in that an alkali hydroxide of 6N or more is used as the alkali.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16785890A JPH0456391A (en) | 1990-06-26 | 1990-06-26 | Inspecting method for copper circuit of circuit board for inner layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16785890A JPH0456391A (en) | 1990-06-26 | 1990-06-26 | Inspecting method for copper circuit of circuit board for inner layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0456391A true JPH0456391A (en) | 1992-02-24 |
| JPH0568118B2 JPH0568118B2 (en) | 1993-09-28 |
Family
ID=15857399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16785890A Granted JPH0456391A (en) | 1990-06-26 | 1990-06-26 | Inspecting method for copper circuit of circuit board for inner layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456391A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5969918A (en) * | 1996-12-26 | 1999-10-19 | Matsushita Electric Industrial Co., Ltd. | Cassette adaptor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61176192A (en) * | 1985-01-31 | 1986-08-07 | 株式会社日立製作所 | Adhesion between copper and resin |
-
1990
- 1990-06-26 JP JP16785890A patent/JPH0456391A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61176192A (en) * | 1985-01-31 | 1986-08-07 | 株式会社日立製作所 | Adhesion between copper and resin |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5969918A (en) * | 1996-12-26 | 1999-10-19 | Matsushita Electric Industrial Co., Ltd. | Cassette adaptor |
| US6104580A (en) * | 1996-12-26 | 2000-08-15 | Matsushita Electric Industrial Co., Ltd. | Cassette adaptor |
| US6141186A (en) * | 1996-12-26 | 2000-10-31 | Matsushita Electric Industrial Co., Ltd. | Cassette adaptor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0568118B2 (en) | 1993-09-28 |
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