JPH0456385A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH0456385A JPH0456385A JP16733390A JP16733390A JPH0456385A JP H0456385 A JPH0456385 A JP H0456385A JP 16733390 A JP16733390 A JP 16733390A JP 16733390 A JP16733390 A JP 16733390A JP H0456385 A JPH0456385 A JP H0456385A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- copper
- activating
- solution
- nickel plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 42
- 238000007747 plating Methods 0.000 claims abstract description 39
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 238000011282 treatment Methods 0.000 claims description 28
- 230000004913 activation Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010531 catalytic reduction reaction Methods 0.000 claims 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 8
- 239000003054 catalyst Substances 0.000 abstract description 7
- 238000001556 precipitation Methods 0.000 abstract description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052763 palladium Inorganic materials 0.000 abstract description 4
- 150000001879 copper Chemical class 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000654 additive Substances 0.000 abstract description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 abstract description 2
- 230000003213 activating effect Effects 0.000 abstract 4
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 abstract 1
- 238000000151 deposition Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012190 activator Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は無電解ニッケルめっきを析出するプリント配線
板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method for manufacturing a printed wiring board by depositing electroless nickel plating.
（従来の技術）
絶縁基板に印刷された銅箔の回路表面に無電解ニッケル
めっき処理を行なう場合、めっき処理前に予め、パラジ
ウム触媒を回路の表面に付着して活性化し−その後、め
っき処理を行なっている。(Prior art) When performing electroless nickel plating on the surface of a copper foil circuit printed on an insulating substrate, a palladium catalyst is attached to the surface of the circuit in advance and activated before plating. I am doing it.
（発明が解決しようとする課題）
しかし、従来の方法では、パラジウムの一部がイオン化
したまま銅箔の表面に吸着していると思われ、部分的に
ニッケルめっきが析出しない欠点がある。(Problems to be Solved by the Invention) However, in the conventional method, it seems that some of the palladium is adsorbed to the surface of the copper foil while being ionized, and there is a drawback that nickel plating is not partially deposited.
本発明の目的は、以上の欠点を改良し、ニッケルめっき
の析出を向上し、信頼性の高いプリント配線板の製造方
法を提供するものである。The object of the present invention is to improve the above-mentioned drawbacks, improve the precipitation of nickel plating, and provide a highly reliable method for manufacturing printed wiring boards.
（課題を解決するための手段）
本発明は上記の目的を達成するために、絶縁基板の表面
に銅金属の回路を形成し、次いで無電解ニッケルめっき
を行なうプリント配線板の製造方法において、銅金属の
回路形成後、無電解ニッケルめっき処理前に、活性化処
理とめっき触媒の還元処理を２回以上行なうことを特徴
とするプリント配線板の製造方法を提供するものである
。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a method for manufacturing a printed wiring board in which a copper metal circuit is formed on the surface of an insulating substrate, and then electroless nickel plating is performed. The present invention provides a method for manufacturing a printed wiring board, characterized in that after metal circuit formation and before electroless nickel plating, activation treatment and plating catalyst reduction treatment are performed two or more times.
（作用）
銅金属の回路形成後、この銅回路の表面を活性化する処
理を行ないめっき触媒を付着し、次いでこのめっき触媒
を還元処理することによって活性剤を析出できその活性
を高めることができる。そしてす専これらの活性化処理
と還元処理を繰り返すことによって、より効果的に、無
電解ニッケルめっきの初期反応を均一かつ迅速に行なう
ことができる。(Function) After the copper metal circuit is formed, the surface of this copper circuit is treated to activate and a plating catalyst is attached to it, and then this plating catalyst is subjected to a reduction treatment to precipitate an activator and increase its activity. . By repeating these activation treatments and reduction treatments, the initial reaction of electroless nickel plating can be performed uniformly and quickly more effectively.
（実施例） 以下、本発明を実施例に基づいて説明する。(Example) Hereinafter, the present invention will be explained based on examples.
先ず、絶縁基板の表面にフルアデイティブ法により無電
解銅めっきを所定のパターンに析出し銅回路を形成する
。First, electroless copper plating is deposited in a predetermined pattern on the surface of an insulating substrate by a fully additive method to form a copper circuit.
次に、この銅回路に塩化パラジウムや塩酸の混合液等の
活性化処理液（日本カニゼン株式会社製レッドシューマ
ー）を用いて１分間活性化処理を行なう、活性化処理後
、ジメチルアミンボラン５〜１０ｇ／ｌ、ＥＤＴＡ・２
Ｎａ１００〜１５０ｔ ／ Ｊの混合液からなる還元液
によって１〜５分間還元処理を行ない、パラジウム等を
析出する。Next, this copper circuit is activated for 1 minute using an activation treatment solution such as a mixture of palladium chloride and hydrochloric acid (Red Schumer, manufactured by Nippon Kanigen Co., Ltd.). 10g/l, EDTA・2
Reduction treatment is performed for 1 to 5 minutes using a reducing solution consisting of a mixed solution of 100 to 150 t/J of Na to precipitate palladium and the like.
還元処理後、上記の活性化処理と還元処理を再び繰り返
す、これらの処理を２回繰り返した後、無電解ニッケル
めっき液（日本カニゼン株式会社製５Ｂ−５５−１）を
用いて、銅回路の表面にニッケルめっきを析出する。After the reduction treatment, the above activation treatment and reduction treatment are repeated again. After repeating these treatments twice, the copper circuit is plated using an electroless nickel plating solution (manufactured by Nippon Kanigen Co., Ltd., 5B-55-1). Deposit nickel plating on the surface.
上記の実施例について、無電解ニッケルめっきのめっき
析出性を調べたところ、めっき開始から５分後に全部の
箇所でニッケルめっきが析出していた。Regarding the above examples, when the electroless nickel plating was examined for plating precipitation, it was found that nickel plating was deposited at all locations 5 minutes after the start of plating.
また、他の実施例として、活性化処理と還元処理を３回
繰り返すこと以外は、上記実施例と同じ条件で製造した
場合、そのめっき析出性を調べたところ、５分後には同
様に全部の箇所でニッケルめっきが析出しな。In addition, as another example, when manufacturing under the same conditions as in the above example except that the activation treatment and reduction treatment were repeated three times, the plating precipitation property was investigated, and it was found that after 5 minutes, all of the Nickel plating is deposited in some places.
さらに比較例と従来例とについてもめっき析出性を調べ
た。Furthermore, the plating precipitation properties of the comparative example and the conventional example were also investigated.
比較例は、上記実施例において、活性化処理と還元処理
を１回行なったものであり、めっき開始から５分後では
９４％の箇所でめっきが析出しただけである。In the comparative example, the activation treatment and reduction treatment were performed once in the above example, and the plating was deposited in only 94% of the places 5 minutes after the start of plating.
従って、実施例の通り、活性化処理と還元処理は２回以
上がよいことが明らかである。Therefore, as in the examples, it is clear that the activation treatment and the reduction treatment should be performed two or more times.
従来例は、実施例と同様の絶縁基板に同様の無電解銅め
っき処理を行なった後、活性化処理液（日本カニゼン株
式会社製レッドシューマー）を用いて１分間活性化処理
を行なった後、実施例と同様の無電解ニッケルめっき処
理を行なって製造した。そしてこの従来例のめっき析出
性を調べたところ、無電解ニッケルめっき開始５分後で
はまだ９０％の箇所でしかニッケルめっきが析出してい
なかった。In the conventional example, after performing the same electroless copper plating treatment on the same insulating substrate as in the example, after performing the activation treatment for 1 minute using an activation treatment solution (Red Schumer manufactured by Nippon Kanigen Co., Ltd.), It was manufactured by performing the same electroless nickel plating treatment as in the example. When the plating deposition properties of this conventional example were investigated, it was found that nickel plating was still deposited on only 90% of the areas 5 minutes after the start of electroless nickel plating.
なお、上記各実施例では、活性化処理とめっき触媒還元
処理とを３回まで繰り返し行なっているが、４回以上繰
り返し行なってもよく、より効果的である。In each of the above embodiments, the activation treatment and the plating catalyst reduction treatment are repeated up to three times, but they may be repeated four or more times, which is more effective.
（発明の効果）
以上の通り、本発明によれば、活性化処理とめつき触媒
還元処理とを２回以上行なうことにより、無電解ニッケ
ルめっきの析出性を改良でき、めっきの析出不良を防止
しうるプリント配線板が得られる。(Effects of the Invention) As described above, according to the present invention, by performing the activation treatment and the plating catalyst reduction treatment two or more times, the deposition properties of electroless nickel plating can be improved and poor deposition of plating can be prevented. A wet printed wiring board is obtained.
特許出願人 日立コンデンサ株式会社Patent applicant: Hitachi Capacitor Co., Ltd.
Claims (1)
無電解ニッケルめっきを析出するプリント配線板の製造
方法において、銅金属の回路形成後、無電解ニッケルめ
っき処理前に、活性化処理とめっき触媒還元処理を２回
以上行なうことを特徴とするプリント配線板の製造方法
。(1) In a printed wiring board manufacturing method in which a copper metal circuit is formed on the surface of an insulating substrate and then electroless nickel plating is deposited, activation treatment is performed after the copper metal circuit is formed and before electroless nickel plating treatment. A method for manufacturing a printed wiring board, which comprises performing a plating catalytic reduction treatment two or more times.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16733390A JPH0456385A (en) | 1990-06-26 | 1990-06-26 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16733390A JPH0456385A (en) | 1990-06-26 | 1990-06-26 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0456385A true JPH0456385A (en) | 1992-02-24 |
Family
ID=15847793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16733390A Pending JPH0456385A (en) | 1990-06-26 | 1990-06-26 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456385A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6651335B2 (en) * | 2000-10-20 | 2003-11-25 | Konica Corporation | Method of producing an ink jet print head through a processing method of electroless plating |
-
1990
- 1990-06-26 JP JP16733390A patent/JPH0456385A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6651335B2 (en) * | 2000-10-20 | 2003-11-25 | Konica Corporation | Method of producing an ink jet print head through a processing method of electroless plating |
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