JPH045620U - - Google Patents

Info

Publication number

JPH045620U

JPH045620U JP4592490U JP4592490U JPH045620U JP H045620 U JPH045620 U JP H045620U JP 4592490 U JP4592490 U JP 4592490U JP 4592490 U JP4592490 U JP 4592490U JP H045620 U JPH045620 U JP H045620U

Authority

JP

Japan

Prior art keywords

winding

molded

surface mount

winding portion

mount terminal

Prior art date

1990-04-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Links

• Espacenet
• Global Dossier
• Discuss

• 238000004804 winding Methods 0.000 claims description 12
• 239000004020 conductor Substances 0.000 claims 1
• 239000011347 resin Substances 0.000 claims 1
• 229920005989 resin Polymers 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
• 229910052802 copper Inorganic materials 0.000 description 3
• 239000010949 copper Substances 0.000 description 3
• 238000000034 method Methods 0.000 description 2
• 238000010586 diagram Methods 0.000 description 1
• 238000003780 insertion Methods 0.000 description 1
• 230000037431 insertion Effects 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1