JPH0455020A - Bending machine - Google Patents

Bending machine

Info

Publication number
JPH0455020A
JPH0455020A JP16610590A JP16610590A JPH0455020A JP H0455020 A JPH0455020 A JP H0455020A JP 16610590 A JP16610590 A JP 16610590A JP 16610590 A JP16610590 A JP 16610590A JP H0455020 A JPH0455020 A JP H0455020A
Authority
JP
Japan
Prior art keywords
die
mold
detector
temp
bending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16610590A
Other languages
Japanese (ja)
Inventor
Tetsukazu Miyashita
哲一 宮下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP16610590A priority Critical patent/JPH0455020A/en
Publication of JPH0455020A publication Critical patent/JPH0455020A/en
Pending legal-status Critical Current

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  • Bending Of Plates, Rods, And Pipes (AREA)

Abstract

PURPOSE:To provide the bending machine which allows high-accuracy bending and easy handling and operates highly efficiently by detecting the temp. of griping members, computing the elongation quantity of dies by a difference in the temp. at the time of measuring the die sizes and correcting this quantity to the set moving quantity of upper and lower rams. CONSTITUTION:A lower die detector 7 and an upper die size measuring instrument 8 are mounted to a detector mounting plate 9 and a sliding plate 10 and are constituted to allow dealing with the case the width of the upper and lower dies is changed. The detector and instrument are coupled to a shaft of a rotating cylinder 11 and can be thereby rotated 180 deg.. The reason for such constitution lies in that the projecting or recessed die can be detected even if this die is mounted to either of the upper die or the lower die. The detection is not possible unless the upper die size measuring instrument 8 is used for the projecting die and the lower die size measuring instrument 7 is used for the recessed die. A rotating cylinder mounting plate 12 is coupled to the shaft of a longitudinal cylinder 13 and stands by backward while measurement is not made. The die measurement is necessitated to be made once at the time of insertion of the die. The temp. of the gripping member needs to be detected without fail by a temp. detector at the same time.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、板金材料の曲げ加工を行なう、ベンディング
加工機に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a bending machine for bending sheet metal materials.

〔従来の技術〕[Conventional technology]

従来、ベンディング加工機では、上下金型を把持部に挿
入係合後、上下金型を所定圧力で型合わせを行い、加工
原点とする。この加工原点を基準に、加工材質による曲
げ応力、板厚9曲げ角度に応じた係数を考慮し、金型に
加える圧力、金型押し込み量を制御して加工を行ってい
る。
Conventionally, in a bending processing machine, after inserting and engaging the upper and lower molds into a gripping part, the upper and lower molds are aligned under a predetermined pressure and used as a machining origin. Based on this processing origin, processing is performed by controlling the pressure applied to the mold and the amount of mold depression, taking into account the bending stress due to the material to be processed and the coefficient according to the plate thickness 9 bending angle.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかし、前述の従来技術では、加工機スタート直後に加
工された製品と、ある時間後加工された製品では、製品
寸法にバラツキが生ずる。そのため、加工途中で抜き取
り検査を行う、製品寸法を所定の公差内に入っているか
測定を行いながら加工を行う。所定公差に入っていない
場合には、加工機を停止し、加工圧力、金型圧力、金型
押し込み量を所定し直さなければならず、設定値修正の
わずられしい計算を行なわなければならないといった作
業が必要であった。より高精度な加工を容易に行え、稼
動率向上できるベンディング加工機の実現が課題であっ
た。そこで、本発明は、このような課題を解決するため
のもので、その目的とするところは、製品寸法バラツキ
を少なくできる高精度で扱い易い高稼動なベンディング
加工機を提供することである。
However, in the above-mentioned conventional technology, variations occur in product dimensions between a product processed immediately after the processing machine starts and a product processed after a certain period of time. Therefore, processing is performed while performing sampling inspections during processing and measuring whether the product dimensions are within predetermined tolerances. If the specified tolerances are not met, the processing machine must be stopped and the processing pressure, mold pressure, and mold push amount must be reset to the specified values, and tedious calculations must be made to correct the set values. Such work was necessary. The challenge was to create a bending machine that could easily perform more precise machining and improve operating rates. The present invention has been made to solve these problems, and its purpose is to provide a highly accurate, easy-to-handle, and highly operational bending machine that can reduce variations in product dimensions.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のベンディング加工機は、上下金型寸法を、金型
挿着後加工開始迄の間に測定する手段を有し、金型を係
合把持する代表部材内に、温度検出手段を有し、かつ、
検出温度により、金型の延び量を演算する手段を加工機
制御系内に有し、上下ラム設定移動量を金型の延び量で
補正させる構成としたことを特徴とする。
The bending machine of the present invention has means for measuring the dimensions of the upper and lower molds after inserting the molds and before starting machining, and has temperature detecting means in the representative member that engages and grips the molds. ,and,
The present invention is characterized in that the processing machine control system includes means for calculating the elongation amount of the mold based on the detected temperature, and the set movement amount of the upper and lower rams is corrected by the elongation amount of the mold.

〔作用〕[Effect]

本発明によれば、上下金型寸法を金型挿着後加工開始迄
の間に測定することKより、加工に使う金型の正確な高
さ寸法を把握し、その時刻での把持部材の温度を検出し
、金型の延゛び量を演算させる加工機制御系内に記憶さ
せ、各々曲げ加工時、いいかえると上下ラムが設定移動
量移動する直前に、再度把持部材の温度を検出し前記金
型寸法測定時刻の一温度との差により、金型の延び量を
演算させ、上下ラム設定移動量に補正させることKより
、高精度な曲げ加工を可能とし、扱い易い、高稼動なベ
ンディング加工機とすることができる。
According to the present invention, by measuring the dimensions of the upper and lower molds after inserting the molds and before starting machining, the exact height dimensions of the molds used for machining can be grasped and the gripping member at that time can be determined. The temperature is detected and stored in the processing machine control system that calculates the amount of mold elongation, and during each bending process, the temperature of the gripping member is detected again just before the upper and lower rams move the set amount. The elongation of the mold is calculated based on the temperature difference at the time of the mold dimension measurement, and the amount of elongation of the mold is corrected to the set travel amount of the upper and lower rams.This enables high-precision bending, is easy to handle, and is highly operational. It can be used as a bending machine.

〔実施例〕〔Example〕

以下に、本発明の実施例を図面にもとづいて説明する。 Embodiments of the present invention will be described below based on the drawings.

第1図において、本発明のベンディング加工機の上下金
型寸法測定及び温度検出実施例を示す。上下金型がある
が、構成は全(同一であるため、下金型の検出例で説明
する。下ラム軸1には、下ラム2が取り付けられ上下に
設定移動量移動可能である。金型ホルダー3には、金型
4が直交2面で位置決めされ、固定ネジ5にて固定され
る。温度検出器6は、下ラム2に挿入ネジ固定され、下
ラム2の中心部に近い位置の温度検出が可能である。下
金型寸法測定器7及び上金型寸法測定器8は、上下金型
のエツジを検出させるため背面取り付けとしである。こ
の測定器は、磁気式を用いたが、レーザ光等能の検出方
式も可能である。第2図は、本発明のベンディング加工
機の金型測定装置全体実施例を示す。前記説明の下金型
検出器7と上金型寸法測定器8は、検出器取付板9及び
スライド板1oに取り付けられ、上下金型の幅を変えた
場合に対応できる構成としである。又、回転シリンダ1
1の軸と結合し、1800回転可能としである。これは
、上金型、下金型どちらに、凸状、凹状金型を取り付け
ても検出可能とするためである。凸状金型には、上金型
寸法測定器8を凹状金型には、下金型寸法測定器7を使
わなければ検出できない。回転シリンダ取付板12は、
前後シ替ンダ15の軸と結合され、測定しない時には、
後方に待機している。金型測定は、金型挿着時に1回行
えば良(、同時刻に・把持部材温度を温度検出B6にて
必ず検出しなければならない〔発明の効果〕 本発明のベンディング加工機は、以上説明したように、
上下金型寸法を、金型挿着後加工開始迄の間に測定する
手段を有し、金型を係合把持する代表部材内に、温度検
出手段を有し、がっ、検出温度により、金型の延び量を
演算する手段を加工機制御系内に有し、上下ラム設定移
動量を金型の延び量で補正させる構成としたことで、自
動で金型寸法と同時刻の金型温度を計測し、上下ラム移
動各に、金型温度を再計測し温度変化に対応する金型延
び量を上下ラム設定移動量に自動補正させたことから、
加工途中での抜き取り検査を少な(でき、設定値修正の
作業や加工機停止による稼動率低下を防止し、製品寸法
バラツキを少なくする高精度で扱い昌いベンディング加
工を可能にできるという効果を有する。
FIG. 1 shows an example of measuring the dimensions of upper and lower molds and detecting the temperature of the bending machine of the present invention. There are upper and lower molds, but since they are all the same in configuration, we will explain the detection example of the lower mold. A lower ram 2 is attached to the lower ram shaft 1 and can move up and down by a set amount of movement. A mold 4 is positioned in the mold holder 3 on two orthogonal surfaces and fixed with fixing screws 5.A temperature sensor 6 is fixed to the lower ram 2 with an insertion screw, and is positioned near the center of the lower ram 2. The lower mold dimension measuring device 7 and the upper mold dimension measuring device 8 are mounted on the back to detect the edges of the upper and lower molds.This measuring device uses a magnetic type. However, a detection method using a laser beam or the like is also possible. Fig. 2 shows an overall embodiment of the mold measuring device for the bending processing machine of the present invention. The lower mold detector 7 and upper mold dimensions described above are shown. The measuring device 8 is attached to a detector mounting plate 9 and a slide plate 1o, and has a configuration that can be used when the width of the upper and lower molds is changed.
It is connected to the shaft of No. 1 and can rotate 1800 times. This is to enable detection regardless of whether a convex or concave mold is attached to either the upper mold or the lower mold. Convex molds cannot be detected unless the upper mold dimension measuring device 8 is used, and concave molds cannot be detected unless the lower mold dimension measuring device 7 is used. The rotating cylinder mounting plate 12 is
It is connected to the axis of the front/rear shifter 15, and when not measuring,
I'm waiting at the back. The mold measurement only needs to be carried out once when inserting the mold (at the same time, the temperature of the gripping member must be detected by the temperature detection B6 [Effects of the Invention]) As explained,
It has a means for measuring the upper and lower mold dimensions after the mold is inserted and before the start of processing, and has a temperature detection means in the representative member that engages and grips the mold, and according to the detected temperature, The processing machine control system has a means to calculate the elongation of the mold, and the setting movement of the upper and lower rams is corrected by the elongation of the mold, which automatically calculates the mold dimensions and the mold at the same time. By measuring the temperature and re-measuring the mold temperature each time the upper and lower rams move, the amount of mold extension corresponding to the temperature change is automatically corrected to the set travel amount of the upper and lower rams.
It has the effect of reducing sampling inspections during processing, preventing a decrease in operating rate due to setting value correction work and stopping the processing machine, and enabling high-precision and easy-to-handle bending processing that reduces product dimensional variation. .

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本発明のベンディング加工機の実施例を示す
概要図。 第2図は、本発明のベンディング加工機の金型測定装置
の実施例を示す概要図。 1−m−下ラム軸 2−・−・−下ラム 3−・−一・金型ホルダー 4− ・−・−・金 型 5−・・・・・・固定ネジ 6−・・・−温度検出器 7 ・・・−・−・下金型寸法測定器 8−・・・・−・上金型寸法測定器 9−−・−・−・検出器取付板 10・・・・・・・・・スライド板 11−・−・・−・回転シリンダ 12−・−一・回転シリンダ取付板 15−・・−一・前後シリンダ
FIG. 1 is a schematic diagram showing an embodiment of the bending machine of the present invention. FIG. 2 is a schematic diagram showing an embodiment of a mold measuring device for a bending machine according to the present invention. 1-m-Lower ram shaft 2--Lower ram 3--1/Mold holder 4--Mold 5--Fixing screw 6--Temperature Detector 7 --- Lower mold dimension measuring device 8 --- Upper mold dimension measuring instrument 9 --- Detector mounting plate 10 ---・・Slide plate 11−・−・・−・Rotary cylinder 12−・−1・Rotary cylinder mounting plate 15−・・−1・Front and rear cylinder

Claims (1)

【特許請求の範囲】[Claims]  ベンディング加工機において、上下金型寸法を、金型
挿着後加工開始迄の間に測定する手段を有し、金型を係
合把持する代表部材内に、温度検出手段を有し、かつ、
検出温度により、金型の延び量を演算する手段を加工機
制御系内に有し、上下ラム設定移動量を金型の延び量で
補正させる構成としたことを特徴とする、ベンディング
加工機。
The bending processing machine has means for measuring the dimensions of the upper and lower molds after inserting the molds and before starting machining, and has temperature detecting means in a representative member that engages and grips the molds, and
1. A bending processing machine, characterized in that the processing machine control system includes means for calculating the elongation amount of the mold based on detected temperature, and the set movement amount of the upper and lower rams is corrected by the elongation amount of the mold.
JP16610590A 1990-06-25 1990-06-25 Bending machine Pending JPH0455020A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16610590A JPH0455020A (en) 1990-06-25 1990-06-25 Bending machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16610590A JPH0455020A (en) 1990-06-25 1990-06-25 Bending machine

Publications (1)

Publication Number Publication Date
JPH0455020A true JPH0455020A (en) 1992-02-21

Family

ID=15825110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16610590A Pending JPH0455020A (en) 1990-06-25 1990-06-25 Bending machine

Country Status (1)

Country Link
JP (1) JPH0455020A (en)

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