JPH0454153U - - Google Patents
Info
- Publication number
- JPH0454153U JPH0454153U JP9643290U JP9643290U JPH0454153U JP H0454153 U JPH0454153 U JP H0454153U JP 9643290 U JP9643290 U JP 9643290U JP 9643290 U JP9643290 U JP 9643290U JP H0454153 U JPH0454153 U JP H0454153U
- Authority
- JP
- Japan
- Prior art keywords
- stem
- board
- terminal
- glass
- glass portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9643290U JPH0454153U (xx) | 1990-09-12 | 1990-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9643290U JPH0454153U (xx) | 1990-09-12 | 1990-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0454153U true JPH0454153U (xx) | 1992-05-08 |
Family
ID=31835966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9643290U Pending JPH0454153U (xx) | 1990-09-12 | 1990-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0454153U (xx) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07283556A (ja) * | 1994-04-08 | 1995-10-27 | Toshiba Corp | パッケージの気密端子構造 |
| WO2010117000A1 (ja) * | 2009-04-08 | 2010-10-14 | エヌイーシー ショット コンポーネンツ株式会社 | 高耐圧気密端子およびその製造方法 |
-
1990
- 1990-09-12 JP JP9643290U patent/JPH0454153U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07283556A (ja) * | 1994-04-08 | 1995-10-27 | Toshiba Corp | パッケージの気密端子構造 |
| WO2010117000A1 (ja) * | 2009-04-08 | 2010-10-14 | エヌイーシー ショット コンポーネンツ株式会社 | 高耐圧気密端子およびその製造方法 |
| JP2010244927A (ja) * | 2009-04-08 | 2010-10-28 | Nec Schott Components Corp | 高耐圧気密端子およびその製造方法 |
| CN102388508A (zh) * | 2009-04-08 | 2012-03-21 | 恩益禧肖特电子零件有限公司 | 耐高压气密密封端子及其制造方法 |