JPH0453146A - Manufacture of electronic parts - Google Patents

Abstract

PURPOSE:To prevent contamination and damage of a fine lead connecting region by forming the fine lead connecting region at the bottom surface of a recessed area of a terminal member and not exposing such connecting region to the cavity of mold without allowing contact of the connecting region with a mold at the time of forming a terminal member covering body. CONSTITUTION:A terminal member gathering body 11 is formed by a terminal member plate 14 having a wide part 12 and a narrow part 13 and a coupling member 15 for coupling these terminal members, and the narrow part 13 of the three terminal member 14 is provided with a recessed part 16 forming a fine lead connecting region 17 at the bottom surface. Moreover, the recessed part 16 is also formed at the area used as the wiring terminal of the coupling members 15. The gathering body 11 is arranged with the one main surface forming the recessed area 16 to a groove 25 of a lower mold 20 located in the bottom surface side of the groove 25. The fine lead connecting region 17 formed at the bottom surface of recessed part 16 is provided opposed to the bottom surface of the groove 25 and the five members 14 are integrally coupled by the coupling member 15. Therefore, the gathering body 11 can easily be mounted to a metallic mold 18 for the molding.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an electronic component having a structure in which a thin lead wire is connected to a terminal member drawn out from a terminal member covering body.

Figure 6 shows a hybrid IC used in an automobile igniter or actuator control circuit, etc.

This hybrid IC consists of a terminal member covering (1), partially buried terminal members (2) and 4, a heat sink (4) fixed to the bottom of the terminal member covering (1), and a heat sink. (4
), and a thin lead connecting the electrode (not shown) formed on the circuit board (3) and the terminal member (2)! (5) and terminal member covering (1
) and a cover (7) fixed to the top surface of the terminal member covering (1).

To form this hybrid IC, first, a molding die is prepared in which a molding cavity corresponding to the terminal member cover (1) is formed when the upper mold and the lower mold are closed. Next, one end side and the other end side of the terminal member (2) are sandwiched between the upper mold and the lower mold, and the terminal member (2) is placed in the molding die so that the center side is located in the molding cavity. Attach it inside. Subsequently, fluidized sealing resin is injected into the molding cavity and solidified to form a terminal member covering body (1) that covers the center side of the terminal member (2). Next, the circuit board (3) is placed on the terminal member cover (1).
) mounted on the heat sink (4), and then attach the circuit board (3).
) between the electrode on the terminal member (2) and the lead wire (5)
Connect. After that, the terminal member cover (1) and the heat sink (
The area surrounded by 4) is filled with a protective resin (6) as shown in the figure, and a cover (7) is attached to complete the hybrid IC.

11 pairs to Mijiri Saehisa As mentioned above, the terminal member (2) is the terminal member cover (1)
At the time of resin molding, the terminal member covering member (1) is held between the molding molds except for the portion that is scheduled to be covered with the terminal member covering member (1). For this reason,
The terminal member (2) may get dirty or scratched. The portion of the terminal member (2) that is held between the molds also includes an area to which the thin lead wire (5) will be connected in a later process, and if this area becomes dirty or scratched, the thin lead wire (5) ) may not provide sufficient connection strength. Lead thin wire (5)
Although this problem is not a big problem when soldering, this problem becomes noticeable when using the wire bonding method, which has excellent productivity. Therefore, in the past, attempts have been made to remove dirt from the clamping surface of the terminal member by the molding die each time the resin is molded by means such as blowing air. However, it is difficult to sufficiently remove dirt with air, and therefore it is difficult to completely prevent connection failures of the thin lead wires.

Therefore, an object of the present invention is to provide a method for manufacturing electronic components that solves the above problems.

In the method for manufacturing an electronic component according to the present invention, one end side and the other end side of the terminal member are led out from one side surface and the other side surface of the terminal member covering body, respectively, and the terminal member is electrically connected to an electrode of an electronic element disposed on one side surface of a terminal member covering via a thin lead wire connected to one end side of the thin lead wire connection area. A molding cavity corresponding to the shape of the terminal member covering body is formed by closing the terminal member having one main surface formed with a recessed portion having a bottom surface and the first mold and the second mold. a first part of the other main surface of the terminal member located on the opposite side of the thin lead wire connection area, a second part on the other end side continuous thereto, and the terminal. A third portion of one main surface of the member located on the opposite side of the second portion is exposed to the molding cavity, and the thin lead wire connection region does not come into contact with the molding die and is not exposed to the molding cavity. A step of placing the terminal member in a molding mold without exposing it and sandwiching it between a first mold and a second mold, a step of injecting a resin to form the terminal member covering into the molding cavity, and molding. After the resin in the cavity is cured to form a terminal member covering that covers the first, second, and third portions of the terminal member and does not cover the thin lead wire connection area, the terminal member is molded. The method includes a step of removing the wire from the mold, and a step of pressing the thin lead wire in the thickness direction of the terminal member to connect the thin lead wire to the thin lead wire connection area of the terminal member.

- According to the method of manufacturing an electronic component of the present invention, the thin lead wire connection region is formed on the bottom surface of the recess of the terminal member, and when the terminal member covering body is resin-molded, the thin lead wire connection region is brought into contact with the molding die. Make sure that they do not come into contact with each other and do not expose them to the molding cavity. Therefore, it is possible to prevent staining and damage to the thin lead wire connection area when mounting the terminal member on the mold. Further, a portion of the other main surface of the terminal member located on the opposite side of the thin lead wire connection area is exposed to the molding cavity, and a part of the terminal member covering body is also formed in this portion. This part of the terminal member covering functions as a holding part for the terminal member when connecting the thin lead wire, and can effectively apply pressure in the thickness direction of the terminal member to the thin lead wire, thereby preventing the dirt and scratches mentioned above. In addition to this, the thin lead wires can be connected well.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a hybrid IC for an automobile igniter, which is an embodiment of the present invention, will be described below.

To form the hybrid IC of this example.

First, a terminal member assembly (11) shown in FIG. 2 is prepared.

The terminal member assembly (11) includes plate-shaped terminal members (14) each having a wide portion (12) and a narrow portion (13), and a connecting member (15) that connects these terminal members (14) to each other.
). The narrow portion (13) of the three terminal members (14) arranged inside is provided with a recess (16) in which a thin lead wire connection region (17) is formed on the bottom surface. Further, a recess (16) is also formed in a portion of the connecting portion (15) that is used as a wiring terminal. These recesses (16) are formed by a well-known coining process in the pressing process of punching out a metal plate (aluminum plate material) to form the terminal member assembly (11). Recess (1
6) is formed at a depth of approximately 0.3 mm on one main surface of the terminal member assembly (11) over the entire length of the terminal member (14) and the connecting member (15) in the width direction.

Next, a molding die (18) shown in FIG. 3 is prepared in order to form a terminal member covering body that covers a part of the terminal member (11). The molding die (18) is an upper die (first die) (1
9) and a lower mold (second mold) (20).

A first recess (21) and a second recess (22) are provided on one main surface of the upper mold (19) and one main surface of the lower mold (2o), respectively.
is formed. Further, a gate (23) and a runner (24) connected to the second recess (22), and a groove (25) crossing the second recess (22) are formed in the lower mold (2o). Note that the first recess (21) and the second recess (22)
) are shown separated to the left and right, but in reality, the first and second recesses (21) and (22) are each formed in an annular shape when viewed from above.

Next, the terminal member assembly (11) shown in Fig. 2 is placed in a lower mold (20
) into the groove (25). At this time, the terminal member assembly (11) is arranged so that one main surface side on which the recess (16) is formed is the bottom surface side of the groove (25), and
The thin lead wire connection region (17) formed on the bottom surface of the groove 6) faces the bottom surface of the groove portion (25).

Since the five terminal members (14) are connected to the body by the connecting portions (15), the terminal member assembly (11) can be easily mounted on the molding die (18).

Next, when the upper mold (19) and the lower mold (20) are clamped as shown in Fig. 1, one end side and the other end side of the terminal member (14) and the connecting part (15) are Mold (19) and lower mold (20
) is held by

Therefore, the portion of one main surface of the terminal member assembly (11) accommodated in the groove (25) is in close contact with the bottom surface of the groove (25) except for the recess (16). Although not shown, the width of the groove (25) is set such that the side surfaces of the terminal member (14) and the connecting portion (15) accommodated in the groove (25) are in close contact with the side surfaces of the groove (25). 14) and connecting part (
15). The recess (21) of the upper mold (19) has a first portion of the other main surface of the terminal member (14) corresponding to the side opposite to the recess (16), and a wide portion (12) continuous to the first portion. ) side extends long along the second portion. Further, the recess (22) of the lower mold (20) extends along a third portion of one main surface of the terminal member (14) on the opposite side to the second portion. In addition, terminal members (
The thin lead wire connection area (17) of 14) is formed in the molding cavity (26).
).

Subsequently, resin is press-fitted into the molding cavity (26) through the runner (24) and the gate (23). In Fig. 1, the resin injected from the gate (23) fills the molding cavity (26) on the right side of the molding die (18), and then passes through the side portion connecting the left and right molding cavities to the area shown in the drawing. Fill the left molding cavity (26). The side surface of the portion of the terminal member (14) where the recess (16) is formed is in close contact with the groove (25) of the lower mold (20), and the recess (16) of one main surface of the terminal member (14) is in close contact with the groove (25) of the lower mold (20).
6) and the recess (22) of the lower mold (20) is a groove (25).
), the resin does not flow into the recess (16).

After the resin injected into the molding cavity (26) has hardened.

The upper mold (19) and lower mold (20) are released, and the terminal member assembly (11) on which the terminal member covering body (27) obtained by curing the resin is formed is taken out from the molding mold (18). ,
The terminal member cover (27) has an annular planar shape as shown in FIG. 4, and extends from its inner wall (one side) and outer wall (other side) to one end of the terminal member assembly (11). and the other end are respectively derived. Terminal member cover (
27) is a piece of meat formed between the distal end side of the wide part (12) of the terminal member (14) and the recess (1G) by covering the second and third parts of the terminal member (14). Thick part (27a)
Continuing from this, the terminal member (14) and the connecting portion (15)
The protruding portion (27b) extends to the bottom of the recess (16).
have. The protruding portion (2) of the terminal member covering (27)
The end of 7b) is the terminal member cover (27) of the recess (16).
located inside the end on the side away from the When viewed from above, there is a recess (
16), a space is secured at the bottom in which wire bonding of thin lead wires, which will be described later, can be performed satisfactorily. Note that since the recess (16) formed on the right side of the connecting part (15) in FIG. 27b) is not formed. The terminal member assembly (11) is cut along the broken line in FIG. 4 to electrically separate the terminal members (14) from each other.

Next, as shown in Figure 5, a circuit board (two
8) is placed on one main surface of the zero circuit board (28) that is fixed to the terminal member cover (27) via an adhesive (not shown). An electric circuit consisting of thick film conductors, thick film resistors, semiconductor elements, etc. is formed.

Next, a thin lead wire (31) made of AQ (aluminum) is attached between the electrode (not shown) of the semiconductor element (30) on the circuit board (28) and the terminal member (14) by a well-known wire bonding method. Connect.

That is, a capillary to which ultrasonic vibrations containing a component that vibrates in parallel to one main surface of the terminal member (14) is applied is pressed against one end of the thin lead wire (31) in the thickness direction of the terminal member (14), and the thin lead wire One end of (31) is crushed in its radial direction and connected to the thin lead wire connection area (17). The thin lead wire connection area (17) is formed on the bottom surface of the recess (16), and in addition to being free from dirt and scratches during resin molding as described above, the thin lead wire connection area (17) is formed under the thin lead wire connection area (17). The protrusion (27b) of the terminal member cover (27) extends, and it is possible to sufficiently transmit the vibration of the capillary and the pressing force by the capillary to the thin lead wire (31). Lead fine wire connection area (17)
can be well connected to. Similarly, the thin lead wire (31) is also connected to the thin lead wire connection area (17) of the connecting portion (15).
can be connected well.

Next, silicone resin (32) is injected into the area surrounded by the terminal member cover (27), and the ends of the circuit board (28), the terminal member (14) and the connecting portion (15), and the thin lead wire (31) are injected into the area surrounded by the terminal member cover (27).
), and then a cover (33) is attached to complete the hybrid IC shown in FIG.

According to the method for manufacturing a hybrid IC described above, the thin lead wire (31) can be well connected to the terminal member (14) and the connecting portion (15), and the recess (16) can be formed in the pressing process for forming the terminal member assembly (14). ) can be formed at the same time, so productivity does not decrease. In this point, the thin lead wire (31) is connected to the thin lead wire connection area (17) via a separate metal member.
This is advantageous compared to the method of connecting.

Modifications of the above-described embodiments of the present invention are possible. For example, the terminal member cover (27) may be formed by injection molding such as transfer molding in addition to injection molding.The terminal member (14) may be formed short in advance, and the terminal member (14) may be formed short in advance, and the terminal member covering body (27) may be formed by injection molding such as transfer molding. The extending thick portion may be held between an upper mold (19) and a lower mold (20) and resin molded. Further, the bottom surface of the fourth part (16) except for the thin lead wire connection area (17) may be held. In this case, there is no need to cut the terminal member after resin molding. However, the terminal member assembly (11) is better in that the terminal member (14) can be securely fixed during resin molding, and that the terminal member assembly (11) is raised integrally at the connecting portion (15).
From the point of view of ease of handling, the terminal member (1
It is preferable to form 4) long and cut it later.

The shape of the terminal member cover (27) is not limited to the embodiment.

For example, the outer wall portion may have a U-shaped cross section, and the terminal member (14) may be led out from the bottom surface. Note that the electronic device in the present invention includes a semiconductor device such as a power transistor chip, a thick film resistor formed on a circuit board, a thick film conductor, and the like.

As described above, according to the present invention, it is possible to provide a method of manufacturing an electronic component in which a thin lead wire can be connected well to a terminal member.

[Brief explanation of drawings]

Fig. 1 is a sectional view of a molding die showing the method for manufacturing electronic components according to the present invention, Fig. 2 is a plan view of a terminal member assembly used in this manufacturing method, and Fig. 3 is a diagram showing the terminal member assembly mounted thereon. 4 is a plan view of a terminal member cover in which a terminal member assembly is insert-molded; FIG. 5 is a sectional view of a hybrid IC used in an automobile igniter manufactured according to the present invention; FIG. 6 shows a cross-sectional view of a hybrid IC used in a conventional automobile igniter. (,27), ,Terminal member covering, (14), ,
Terminal member, (2g), , Circuit board, (31),
, thin lead wire, (16) , recess, (19) ,
, first type, (20) , . Second mold, (18) , Molding mold, (26) ,
, molding space, Fig. 1 Fig. 3 Fig. 4 Fig. 1 Koji 2 Fig.

Claims (1)

[Claims] (1) One end side and the other end side of the terminal member are led out from one side surface and the other side surface of the terminal member covering body, respectively, and the terminal member is connected to the one end side. In the method for manufacturing an electronic component electrically connected to an electrode of an electronic element disposed on the one side surface side of the terminal member covering via a thin lead wire, the recess has a bottom surface serving as a thin lead wire connection area. the terminal member having one main surface formed therein; and a molding mold in which a molding cavity corresponding to the shape of the terminal member covering body is formed by closing the first mold and the second mold. a first portion of the other main surface of the terminal member located on the opposite side of the thin lead wire connection area, a second portion on the other end side that is continuous thereto, and the terminal member. A third portion located on the opposite side of the second portion of one main surface of the second portion is exposed to the molding cavity, and the thin lead wire connection region does not come into contact with the mold, and the third portion is located on the opposite side of the second portion. a step of arranging the terminal member in the molding die without exposing it to the molding cavity and sandwiching it between the first mold and the second mold; and molding the resin for forming the terminal member covering. injecting the resin into the cavity, and the resin in the molding cavity hardens to cover the first part, the second part, and the third part of the terminal member, and to cover the lead thin wire connection area. After the uncoated terminal member covering is formed, the terminal member is taken out from the mold, and the thin lead wire is pressed in the thickness direction of the terminal member to connect the thin lead wire to the thin lead wire connection area of the terminal member. A method for manufacturing an electronic component, comprising the steps of: