JPH0452274A - Method for coating tool with thin film - Google Patents
Method for coating tool with thin filmInfo
- Publication number
- JPH0452274A JPH0452274A JP16169890A JP16169890A JPH0452274A JP H0452274 A JPH0452274 A JP H0452274A JP 16169890 A JP16169890 A JP 16169890A JP 16169890 A JP16169890 A JP 16169890A JP H0452274 A JPH0452274 A JP H0452274A
- Authority
- JP
- Japan
- Prior art keywords
- edge parts
- cutting edge
- parts
- tool
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims description 16
- 239000011248 coating agent Substances 0.000 title claims description 7
- 238000000576 coating method Methods 0.000 title claims description 7
- 238000001704 evaporation Methods 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 8
- 150000004767 nitrides Chemical class 0.000 claims abstract description 6
- 230000008020 evaporation Effects 0.000 claims description 24
- 239000002923 metal particle Substances 0.000 claims description 11
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 6
- 239000010408 film Substances 0.000 abstract description 6
- 239000013528 metallic particle Substances 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 150000001455 metallic ions Chemical class 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 229910021645 metal ion Inorganic materials 0.000 description 8
- 238000009501 film coating Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 230000007935 neutral effect Effects 0.000 description 5
- 230000005684 electric field Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、例えばマイクロドリルのような刃先部の鋭
利な工具に対して、その刃先部の耐摩耗性等を改善する
ために、金属の窒化物薄膜を被覆する方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is aimed at improving the wear resistance of a sharp cutting edge of a tool such as a micro drill. The present invention relates to a method of coating nitride thin films.
この種の薄膜被覆方法の従来例を第４図および第５図を
参照して説明する。A conventional example of this type of thin film coating method will be explained with reference to FIGS. 4 and 5.
図示しない真空排気装置によって真空排気される真空容
器２内に、回転式のドラム１０が収納されており、その
周囲に、刃先部の鋭利な工具の一例として多数の超硬調
のマイクロドリル（ここではドリル径が０．２ｍｍφ〜
１ｍｍφ程度のものをいう）８がその刃先部８ａを外側
に向けて取り付けられている。A rotary drum 10 is housed in a vacuum container 2 that is evacuated by a vacuum evacuation device (not shown), and around it there are a number of ultra-hard-tone micro drills (here, Drill diameter is 0.2mmφ~
(about 1 mmφ) is attached with its cutting edge 8a facing outward.
真空容器２の壁面には、ドラム１０の四方に位置するよ
うに、複数のアーク式の蒸発源４が取り付けられている
。各蒸発源４は、アーク放電によって所要の金属から成
るカソードを局部的に溶解させて金属粒子６を蒸発させ
ることができる。この金属粒子６には、アーク放電を用
いているため、中性粒子６ｎの他に金属イオン６１がか
なりの割合で（例えば６０〜８０％程度の割合で）含ま
れている。A plurality of arc-type evaporation sources 4 are attached to the wall surface of the vacuum container 2 so as to be located on all sides of the drum 10. Each evaporation source 4 can evaporate metal particles 6 by locally melting a cathode made of a required metal by arc discharge. Since arc discharge is used in the metal particles 6, in addition to the neutral particles 6n, metal ions 61 are included in a considerable proportion (for example, in a proportion of about 60 to 80%).
このような構成で、真空容器２内に窒素ガスをそこの圧
力が例えば数ｍｍＴｏｒｒ〜１００ｍｍＴｏｒｒ程度に
なるように導入し、ドラム１０を回転させながら、かつ
各マイクロドリル８にバイアス電源１２からドラム１０
を介して適当な（例えば−２００Ｖ〜−４００Ｖ程度の
）負のバイアス電圧を印加しながら、各蒸発源４から金
属粒子６を蒸発させると、その内の金属イオン６１と雰
囲気中の窒素ガスとが各マイクロドリル８の表面で反応
することによって各マイクロドリル８０表面に同金属の
窒化物薄膜が形成される。例えば、各蒸発源４からＴｉ
を蒸発させると、ＴｉＮ （窒化チタン）薄膜が形成さ
れる。With such a configuration, nitrogen gas is introduced into the vacuum container 2 so that the pressure there becomes, for example, several mm Torr to 100 mm Torr, and while the drum 10 is being rotated, each micro drill 8 is connected to the drum 10 from the bias power supply 12.
When the metal particles 6 are evaporated from each evaporation source 4 while applying an appropriate negative bias voltage (for example, about -200V to -400V) through the By reacting on the surface of each micro-drill 8, a thin nitride film of the same metal is formed on the surface of each micro-drill 80. For example, Ti from each evaporation source 4
Upon evaporation, a thin film of TiN (titanium nitride) is formed.
ところが、上記方法だと、各マイクロドリル８の刃先部
８ａが鋭利であるためそこにバイアス電圧による電界が
集中しく第５図中の１４はその等電位面の一例を示す）
、蒸発源４より発生された金属イオン（例えばＴｉ”
） ６ ｉが刃先部８ａに集中するという問題が起こる
。その結果、刃先部８ａが金属イオン６１のエネルギー
で局部的に極端に加熱（例えば本来４００°Ｃ以下にし
たいのに刃先部８ａだけが６００〜１０００°Ｃ程度に
なる）されて結晶の異常成長（これをノジュールと呼ぶ
）が多数生じ、また鋼製の工具ではなまり、その切れ味
が悪くなる。また、刃先部８ａに被覆される薄膜の膜厚
が極端に厚くなり、このことからもその切れ味が悪くな
る。However, in the above method, since the cutting edge 8a of each microdrill 8 is sharp, the electric field due to the bias voltage is concentrated there, and 14 in FIG. 5 shows an example of the equipotential surface.)
, metal ions (e.g. Ti”) generated from the evaporation source 4
) 6 i is concentrated on the cutting edge portion 8a. As a result, the cutting edge part 8a is locally extremely heated by the energy of the metal ions 61 (for example, only the cutting edge part 8a is heated to about 600 to 1000°C even though it is originally intended to be below 400°C), resulting in abnormal crystal growth. A large number of nodules (these are called nodules) are formed, and steel tools become dull and lose their sharpness. Furthermore, the thickness of the thin film covering the cutting edge portion 8a becomes extremely thick, which also makes the blade less sharp.
また、蒸発源４から発生するドロップレフト（イオン化
していない大きなサイズの中性粒子６ｎ）が各マイクロ
ドリル８の刃先部８ａおよびその近傍に付着して表面が
粗くなるという問題も起こる。その結果、このマイクロ
ドリル８によって例えばプリント基板等に穴をあける場
合に、滑らかな穴をあけることができなくなる。また、
スミャ現象（摩擦熱によってプリント基板を構成する絶
縁基板材が融けてそれが下の銅箔等に付着すること）が
発生しやすくなる。Further, a problem occurs in that drop left (non-ionized large-sized neutral particles 6n) generated from the evaporation source 4 adheres to the cutting edge portion 8a of each microdrill 8 and its vicinity, making the surface rough. As a result, when drilling a hole in a printed circuit board or the like using the micro drill 8, it is no longer possible to make a smooth hole. Also,
Smear phenomenon (frictional heat causes the insulating substrate material constituting the printed circuit board to melt and adhere to the underlying copper foil, etc.) is likely to occur.
上記のような問題は、マイクロドリル以外の刃先部が鋭
利な工具についても同様に起こる。The above problem also occurs with tools other than micro drills that have sharp cutting edges.
そこでこの発明は、蒸発源より発注された金属イオンが
刃先部の鋭利な工具の刃先部に集中すること、ならびに
同工具の刃先部およびその近傍に大きなサイズの金属粒
子が付着することを防止することができる￥ｌＩ膜被覆
方法を提供することを主たる目的とする。Therefore, this invention prevents metal ions ordered from an evaporation source from concentrating on the sharp cutting edge of a tool, and also prevents large-sized metal particles from adhering to the cutting edge of the tool and its vicinity. The main objective is to provide a method for coating a \lI film that can be applied.
上記目的を達成するため、この発明の薄膜被覆方法は、
窒素ガス雰囲気中においてアーク式の蒸発源を用いて金
属粒子を蒸発させて、負のバイアス電圧を印加した刃先
部の鋭利な工具に対して前記金属の窒化物薄膜を被覆す
る際に、前記工具の刃先部を前記蒸発源に対して反対側
に向けておくことを特徴とする。In order to achieve the above object, the thin film coating method of the present invention includes:
When coating a sharp-edged tool with a negative bias voltage by evaporating metal particles using an arc-type evaporation source in a nitrogen gas atmosphere, the tool is coated with a nitride thin film of the metal. The blade edge portion of the blade is directed toward the opposite side to the evaporation source.
その場合、前記工具を、負のバイアス電圧が印加された
導電性で籠状の支持枠の内側に、その刃先部を内側に向
けて取り付けておいても良い。In that case, the tool may be attached with its cutting edge facing inward inside a conductive cage-like support frame to which a negative bias voltage is applied.
上記のように刃先部の鋭利な工具の刃先部を蒸発源に対
して反対側に向けておくと、刃先部に対する電界集中が
緩和されるので、蒸発源より発生された金属イオンが刃
先部に集中することが防止される。As mentioned above, if the cutting edge of a tool with a sharp cutting edge is facing away from the evaporation source, the electric field concentration on the cutting edge will be alleviated, and the metal ions generated from the evaporation source will be directed to the cutting edge. Concentration is prevented.
また、蒸発源より発生されたイオン化していない金属粒
子が刃先部およびその近傍に入射する割合が大幅に減る
ので、刃先部およびその近傍に大きなサイズの金属粒子
が付着することが防止される。Furthermore, since the proportion of non-ionized metal particles generated from the evaporation source entering the blade edge and its vicinity is significantly reduced, large-sized metal particles are prevented from adhering to the blade edge and its vicinity.
第１図は、この発明に係る薄膜被覆方法を実施する装置
の一例を示す概略横断面図である。第２図は、第１図の
装置の概略縦断面図である。第３図は、第１図中のマイ
クロドリル周りを部分的に拡大して示す図である。第４
図および第５図の例と同一または相当する部分には同一
符号を付し、以下においては当該従来例との相違点を主
に説明する。FIG. 1 is a schematic cross-sectional view showing an example of an apparatus for implementing the thin film coating method according to the present invention. 2 is a schematic longitudinal sectional view of the device of FIG. 1; FIG. FIG. 3 is a partially enlarged view showing the area around the micro drill in FIG. 1. Fourth
The same reference numerals are given to the same or corresponding parts as in the example of FIG. 5 and FIG. 5, and the differences from the conventional example will be mainly explained below.
この例では、前述したような真空容器２内に、外部のモ
ータ２２によって回転させられる回転軸１８を通し、こ
れに籠状をした導電性の支持枠１６を取り付けている。In this example, a cage-shaped conductive support frame 16 is attached to a rotating shaft 18 that is rotated by an external motor 22 and passed through the vacuum container 2 as described above.
２０は、電気絶縁機能および真空シール機能を有する軸
受である。２ａは、窒素ガスを導入するガス導入口であ
る。20 is a bearing having an electrical insulation function and a vacuum sealing function. 2a is a gas introduction port for introducing nitrogen gas.
そしてこの支持枠１６の内側に、刃先部の鋭利な工具の
一例として前述したような多数のマイクロドリル８を、
各刃先部８ａが内側に向くように、即ちその外側にある
蒸発源４に対して反対側に向くように取り付けている。Inside this support frame 16, a large number of micro drills 8 as described above are installed as an example of a tool with a sharp cutting edge.
Each blade edge portion 8a is attached so as to face inward, that is, to face opposite to the evaporation source 4 located outside.
また、回転軸１８を介して支持枠１６およびそれに取り
付けられた各マイクロドリル８に、外部のバイアス電源
１２から適当な（例えば−２００Ｖ〜−４００Ｖ程度の
）負のバイアス電圧を印加するようにしている。Further, an appropriate negative bias voltage (for example, about -200V to -400V) is applied from an external bias power supply 12 to the support frame 16 and each microdrill 8 attached to it via the rotating shaft 18. There is.
なお、第２図に示すように、この例では蒸発源４を上下
２段に配置しているが、勿論それ以外、例えば支持枠１
６の上下方向の長さ等によっては１段でも良い。In addition, as shown in FIG. 2, in this example, the evaporation sources 4 are arranged in two stages, upper and lower, but of course there are other evaporation sources, such as the support frame 1.
Depending on the vertical length of 6, etc., one stage may be sufficient.
成膜時は、従来の場合と同様に、真空容器２内に窒素ガ
スをそこの圧力が例えば数ｍｍＴｏｒｒ〜１００ｍｍＴ
ｏ ｒ ｒ程度になるように導入し、支持枠１６を回転
させながら、かつ支持枠１６および各マイクロドリル８
に対して前述したような負のバイアス電圧を印加しなが
ら、各蒸発源４から金属粒子６を発生させる。During film formation, nitrogen gas is introduced into the vacuum container 2 at a pressure of, for example, several mmTorr to 100 mmT, as in the conventional case.
o r r, and while rotating the support frame 16, the support frame 16 and each micro drill 8
Metal particles 6 are generated from each evaporation source 4 while applying a negative bias voltage as described above to the evaporation source 4 .
その場合、この方法だと、バイアス電圧による等電位面
１４は例えば第３図中に示すようになり、従来例の場合
と違って各マイクロドリル８の刃先部８ａに対する電界
集中が緩和される。In that case, with this method, the equipotential surface 14 due to the bias voltage becomes as shown in FIG. 3, for example, and the electric field concentration on the cutting edge portion 8a of each microdrill 8 is relaxed, unlike in the conventional case.
しかし、マイクロドリル８にはバイアス電圧が印加され
ているので、蒸発源４より発生された金属イオン６１は
支持枠１６の隙間を通ってマイクロドリル８の刃先部８
ａにも他の部位と同様に回り込み、そこで雰囲気中の窒
素ガスと反応して、そこに同金属の窒化物薄膜が形成さ
れる。However, since a bias voltage is applied to the microdrill 8, the metal ions 61 generated from the evaporation source 4 pass through the gap in the support frame 16 to the cutting edge portion 8 of the microdrill 8.
Similarly to other parts, the metal passes around a, reacts with nitrogen gas in the atmosphere, and forms a nitride thin film of the same metal there.
その結果、マイクロドリル８の刃先部８ａが極端に加熱
されることがなくなり、しかも刃先部８ａに被覆される
薄膜の膜厚も他の部位と同じ程度になるので、切れ味の
良好なものが得られる。As a result, the cutting edge 8a of the micro drill 8 is not heated excessively, and the thickness of the thin film coated on the cutting edge 8a is about the same as that of other parts, resulting in good sharpness. It will be done.
また、蒸発源４より発生された中性粒子６ｎは、支持枠
１６によって遮られるので、あるいはその隙間を通るも
のも電界による回り込みがなく直進するので、大きなサ
イズの中性粒子６ｎが（勿論小さいサイズのものも）マ
イクロドリル８の刃先部８ａおよびその近傍に入射して
付着する割合は極端に減り、刃先部８ａは非常に滑らか
になる。Moreover, since the neutral particles 6n generated from the evaporation source 4 are blocked by the support frame 16, or those passing through the gap travel straight without being detoured by the electric field, the neutral particles 6n of large size (of course, small The proportion of particles incident on and adhering to the cutting edge 8a of the micro drill 8 and its vicinity is extremely reduced, and the cutting edge 8a becomes extremely smooth.
従って、上記マイクロドリル８を例えばプリント基板の
穴あけに用いる場合、従来の方法で被覆されたマイクロ
ドリル８の場合は例えば３０００ヒツト（回）程度でス
ミャ現象が発生する等して使えなくなっていたのに対し
て、上記方法で被覆されたマイクロドリル８の場合は例
えば１００００ヒツト程度も使用することができ、しか
も滑らかな穴をあけることができる。Therefore, when the micro drill 8 is used, for example, for drilling holes in printed circuit boards, the micro drill 8 coated by the conventional method suffers from a smear phenomenon after about 3,000 hits, making it unusable. On the other hand, in the case of the micro drill 8 coated by the above method, for example, about 10,000 drill holes can be used, and smooth holes can be made.
なお、上記方法ではコーティング時間が従来の方法より
も長くなると想像されるが、元々刃先部８ａは鋭利であ
り上記のように反対向きにしても適当量（必要以上厚く
なく）ｉｉｌ膜が形成されるので、時間は実際上は変わ
らない。Although it is assumed that the coating time will be longer in the above method than in the conventional method, the cutting edge 8a is originally sharp, and even if it is turned in the opposite direction as described above, an appropriate amount (not thicker than necessary) of the IIL film will be formed. Therefore, time does not actually change.
また、上記方法は、前述したようなＴｉ以外のＩＶａＶ
ａ族金属ｒ、Ｈｆ）、更にはＶａ族金属（Ｖ、Ｎｂ 、
、Ｔａ ）やＶＩａ族金属（Ｃｒ、Ｍｏ、Ｗ）の窒化物
薄膜の被覆にも勿論適用することができる。Further, the above method can be applied to IVaV other than Ti as described above.
A group metals r, Hf), and even Va group metals (V, Nb,
, Ta) or group VIa metals (Cr, Mo, W).
また、上記方法は、前述したようなマイクロドリル以外
の刃先部が鋭利な工具への薄膜被覆にも勿論適用するこ
とができる。Furthermore, the above-mentioned method can of course be applied to thin-film coating tools with sharp cutting edges other than the aforementioned microdrills.
以上のようにこの発明によれば、蒸発源より発生された
金属イオンが刃先部の鋭利な工具の刃先部に集中するこ
と、ならびに同工具の刃先部およびその近傍に大きなサ
イズの金属粒子が付着することを防止することができる
。従って、表面が滑らかでしかも切れ味の良い工具を得
ることができる。As described above, according to the present invention, metal ions generated from the evaporation source concentrate on the cutting edge of the tool, which has a sharp cutting edge, and large-sized metal particles adhere to the cutting edge of the tool and its vicinity. This can be prevented. Therefore, a tool with a smooth surface and good sharpness can be obtained.
第１図は、この発明に係る薄膜被覆方法を実施する装置
の一例を示す概略横断面図である。第２図は、第１図の
装置の概略縦断面図である。第３図は、第１図中のマイ
クロドリル周りを部分的に拡大して示す図である。第４
図は、従来の薄膜被覆方法を実施する装置の一例を示す
概略横断面図である。第５図は、第４図中のマイクロド
リル周りを部分的に拡大して示す図である。
２・・・真空容器、４・・・アーク式の蒸発源、６、・
・金属粒子、６ｎ・・・中性粒子、６ｉ−・、金属イオ
ン、８・・・マイクロドリル、８ａ、・、刃先部、１２
・・・バイアス電源、１６・・・支持枠。FIG. 1 is a schematic cross-sectional view showing an example of an apparatus for implementing the thin film coating method according to the present invention. 2 is a schematic longitudinal sectional view of the device of FIG. 1; FIG. FIG. 3 is a partially enlarged view showing the area around the micro drill in FIG. 1. Fourth
The figure is a schematic cross-sectional view showing an example of an apparatus for carrying out a conventional thin film coating method. FIG. 5 is a partially enlarged view showing the area around the micro drill in FIG. 4. 2...vacuum container, 4...arc type evaporation source, 6...
・Metal particle, 6n... Neutral particle, 6i-., Metal ion, 8... Micro drill, 8a,... Blade tip, 12
...Bias power supply, 16...Support frame.
Claims (2)
いて金属粒子を蒸発させて、負のバイアス電圧を印加し
た刃先部の鋭利な工具に対して前記金属の窒化物薄膜を
被覆する際に、前記工具の刃先部を前記蒸発源に対して
反対側に向けておくことを特徴とする工具への薄膜被覆
方法。(1) Metal particles are evaporated using an arc type evaporation source in a nitrogen gas atmosphere, and a nitride thin film of the metal is coated on a tool with a sharp cutting edge to which a negative bias voltage is applied. . A method for coating a tool with a thin film, characterized in that the cutting edge of the tool is directed toward the opposite side to the evaporation source.
性で籠状の支持枠の内側に、その刃先部を内側に向けて
取り付けておく請求項１記載の工具への薄膜被覆方法。(2) The method for coating a tool with a thin film according to claim 1, wherein the tool is mounted inside an electrically conductive cage-like support frame to which a negative bias voltage is applied, with its cutting edge facing inward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16169890A JPH0452274A (en) | 1990-06-20 | 1990-06-20 | Method for coating tool with thin film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16169890A JPH0452274A (en) | 1990-06-20 | 1990-06-20 | Method for coating tool with thin film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0452274A true JPH0452274A (en) | 1992-02-20 |
Family
ID=15740168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16169890A Pending JPH0452274A (en) | 1990-06-20 | 1990-06-20 | Method for coating tool with thin film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0452274A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007138286A (en) * | 2005-10-17 | 2007-06-07 | Kobe Steel Ltd | Arc ion plating apparatus |
| US7586592B2 (en) | 2004-11-16 | 2009-09-08 | Kabushiki Kaisha Nippon Conlux | Sheet recognizing device and method |
| WO2012089306A1 (en) * | 2010-12-28 | 2012-07-05 | Oerlikon Trading Ag, Trübbach | Holder for boring head coating |
-
1990
- 1990-06-20 JP JP16169890A patent/JPH0452274A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7586592B2 (en) | 2004-11-16 | 2009-09-08 | Kabushiki Kaisha Nippon Conlux | Sheet recognizing device and method |
| JP2007138286A (en) * | 2005-10-17 | 2007-06-07 | Kobe Steel Ltd | Arc ion plating apparatus |
| WO2012089306A1 (en) * | 2010-12-28 | 2012-07-05 | Oerlikon Trading Ag, Trübbach | Holder for boring head coating |
| CN103261475A (en) * | 2010-12-28 | 2013-08-21 | 欧瑞康贸易股份公司(特吕巴赫) | Holder for boring head coating |
| US9869023B2 (en) | 2010-12-28 | 2018-01-16 | Oerlikon Surface Solutions Ag, Pfäffikon | Holder for drill-head coating |
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