JPH045162Y2 - - Google Patents
Info
- Publication number
- JPH045162Y2 JPH045162Y2 JP4157188U JP4157188U JPH045162Y2 JP H045162 Y2 JPH045162 Y2 JP H045162Y2 JP 4157188 U JP4157188 U JP 4157188U JP 4157188 U JP4157188 U JP 4157188U JP H045162 Y2 JPH045162 Y2 JP H045162Y2
- Authority
- JP
- Japan
- Prior art keywords
- porous body
- moisture
- mold
- inorganic
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000945 filler Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 19
- 150000002366 halogen compounds Chemical class 0.000 claims description 14
- 239000011148 porous material Substances 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims description 8
- 230000000717 retained effect Effects 0.000 claims description 5
- 239000004615 ingredient Substances 0.000 claims 1
- 230000000844 anti-bacterial effect Effects 0.000 description 4
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 230000000843 anti-fungal effect Effects 0.000 description 2
- 239000001110 calcium chloride Substances 0.000 description 2
- 229910001628 calcium chloride Inorganic materials 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- -1 etc. Inorganic materials 0.000 description 2
- 239000011094 fiberboard Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011490 mineral wool Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 235000015097 nutrients Nutrition 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000004113 Sepiolite Substances 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 229910001622 calcium bromide Inorganic materials 0.000 description 1
- WGEFECGEFUFIQW-UHFFFAOYSA-L calcium dibromide Chemical compound [Ca+2].[Br-].[Br-] WGEFECGEFUFIQW-UHFFFAOYSA-L 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- UGGQKDBXXFIWJD-UHFFFAOYSA-N calcium;dihydroxy(oxo)silane;hydrate Chemical compound O.[Ca].O[Si](O)=O UGGQKDBXXFIWJD-UHFFFAOYSA-N 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical group O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 239000011491 glass wool Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 235000016709 nutrition Nutrition 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052624 sepiolite Inorganic materials 0.000 description 1
- 235000019355 sepiolite Nutrition 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Landscapes
- Apparatus For Disinfection Or Sterilisation (AREA)
Description
〔産業上の利用分野〕
本考案は、湿潤状態にあつてもカビによる汚
染、劣化を防ぐ事が可能な新規な基材に関する。
〔従来技術とその問題点〕
カビは炭素、窒素等を栄養分として適当な水
分、温度により活発に生育するものである。処
で、従来からカビを防ぐために２−メチル−４−
イソアゾリン−３−オン等の防カビ材を基材の表
面に塗布することがなされているが、高価である
とともに毒性を有するという問題点があつた。
又、基材内部にカビが入り込むとシミ等が表面に
発生し、このような汚染状態では表面からでは取
れないという問題点があつた。
〔本考案の目的〕
本考案はかかる従来例の欠点に鑑みてなされた
もので、その目的とする処は、大気中の湿気を取
り込んだ時にその水分によつてイオン化し、殺菌
作用を発揮する特殊な防カビ性基材を提供するに
ある。
〔問題点を解決するための手段〕
本考案はかかる従来例の問題点を解決するため
に；
平均細孔径0.1μ以上、100μ以下の範囲にある
空〓を有する無機質系多孔質体１に、
イオン性ハロゲン化合物を該多孔質体１の見
かけ体積に対して含有率1.5ｇ×10-2／cm3以上
を必須成分とする無機質系の吸湿性フイラーが
含有率６ｇ×10-2／cm3以上にて多孔質体１内部
迄含有保持する。
該多孔質体１の表面に透湿性保護材２を形成
してなる。
；という技術的手段を採用している。
〔作用〕
吸湿性フイラーの作用にて大気中の水分を無
機質系多孔質体１の一方の面から体内に取り込
んで行き、一方又は他方の面から放湿するもの
の内部が高湿度状態となり、カビの発生しやす
い環境となる。
処が、無機質系多孔質体１及び吸湿性フイラ
ーがともにカビの栄養源とならないので、カビ
が付着しても増殖しないものである。
加えて、吸湿性フイラーが大気中の水分を取
り込むことにより、フイラーに含まれたイオン
性ハロゲン化合物がイオン化して陰イオンや電
子流が発生し、その殺菌作用によつて、カビが
増殖しないものである。
又、吸湿性フイラーの存在により高湿度環境
下でも、無機質系多孔質体１と透湿性保護材２
の界面で濡れ現象が生ずる事が少ないので、カ
ビが生じにくい結果になる。
しかも、無機質系多孔質体１の平均孔径を
0.1μ〜100μにしてあるので、吸湿性フイラーの
吸湿体１内での均一な分散保持がなされる。
更に、無機質系多孔質体１の内部までイオン
性ハロゲン化合物を含む吸湿性フイラーが保持
されているので、内部でもカビの生育が阻止さ
れて内部から変色することもない。
吸湿体１の表面には透湿性保護材２が形成さ
れ、清掃が可能なだけでなく、吸湿性フイラー
の材外への流出を防ぐ。
尚、前記フイラーは万一、材外へ流出しても
毒性がなく、安価であるので、大量に用いるこ
とができるものである。
〔実施例〕
以下、本考案を詳述する。
本考案に用いる無機質系多孔質体１の材質は、
例えば、石膏、セメント、ケイ酸カルシウム等
の水硬性無機質硬化体、ロツクウール、ガラス
ウール等を接着剤で層状に圧密硬化させ、界面活
性剤により親水化させた繊維板などで、その平均
細孔径が0.1〜100μの範囲に調整したものである。
細孔径が100μ以上では吸湿性フイラー及びハロ
ゲン化合物の流動が多く、逆に0.1μ以下では吸湿
性フイラーの分散が悪く水分の移動がスムースに
行われず、吸湿性フイラーの効果を発揮できな
い。
更に、多孔質体１は、透湿率が１×10-3ｇ／
ｍ・ｈ・mmhg、熱伝導抵抗が2.0ｍ・ｈ・℃／
kcal以上で、材質は５mm以上、好ましくは20mm以
上あれば望ましいものである。
吸湿性フイラーは、
モンモリロナイト、セピオライト、ゼオライ
ト、ゾノトライト、モレキユラーシーブス、活
性アルミナ等や、
塩化カルシウム、塩化リチウム等の無機質系
物質の単独又はその混合体である。
ハロゲン化合物は、
臭化カルシウム、臭カリウム、臭ナトリウ
ム、塩化カルシウム、塩化マグネシウム、塩化
リチウム等のハロゲン化合物で水溶性のもの、
（即ち、Cl-Br-イオンを生じるもの）である。
上記ハロゲン化合物のうち、無水塩、２水塩等
は吸湿性フイラーとしての性能も良好であり、兼
用できて好適である。ハロゲン化合物の含有量は
カビ等が付着する面積に比して適宜分散されてい
るのが好適であり、その添加率は多孔質体の比重
（空〓率）により異なるので、見かけ比重を基礎
として含有率を測定した処、1.5ｇ×10-2／cm3以
上のハロゲン化合物が存在すれば防カビ効果があ
ることが実証された。これを重量％に換算すれば
以下の通りである。
ロツクウールボード（比重0.25）の場合…６重量
％以上
石コウボード （〃 0.9 ） 〃 …1.7〃
セメント系ボード （〃 1.2） 〃 …1.3〃
の添加率であり、好ましくは６〜20g×10-2／cm3
である。含有方法としては、水にハロゲン化合物
を所定量溶解し、その後、吸湿性フイラーを水に
分散し、水硬性無機材を混合して板状に形成し、
硬化、乾燥させる。
又は、水にハロゲン化合物所定量を溶解し、吸
湿性フイラーを水に分散し、あらかじめ板状に成
形し親水化した繊維板に含浸し乾燥するというよ
うな方法がとられる。
透湿性保護膜は、できるだけ湿性を妨げないよ
うに表面の汚れや吸湿性フイラーの材外への流失
を防止するためのもので、シリコン、フツ素樹脂
等の塗着や不織布や通気性樹脂シート等の貼着に
より形成される。
[Field of Industrial Application] The present invention relates to a new base material that can prevent mold contamination and deterioration even in a moist state. [Prior art and its problems] Molds grow actively with appropriate moisture and temperature using carbon, nitrogen, etc. as nutrients. In order to prevent mold, 2-methyl-4-
Antifungal materials such as isoazolin-3-one have been applied to the surface of the substrate, but these have the problems of being expensive and toxic.
Furthermore, when mold gets inside the base material, stains are generated on the surface, and such a contaminated state cannot be removed from the surface. [Purpose of the present invention] The present invention was devised in view of the drawbacks of the conventional examples.The purpose of the present invention is to ionize moisture when it takes in moisture from the atmosphere and exert a bactericidal effect. To provide a special anti-mold base material. [Means for Solving the Problems] In order to solve the problems of the conventional example, the present invention includes: an inorganic porous body 1 having voids with an average pore diameter in the range of 0.1μ or more and 100μ or less; An inorganic hygroscopic filler containing an ionic halogen compound at a content rate of 1.5 g x 10 -2 /cm 3 or more based on the apparent volume of the porous body 1 as an essential component has a content rate of 6 g x 10 -2 /cm 3 In the above manner, it is contained and retained up to the inside of the porous body 1. A moisture permeable protective material 2 is formed on the surface of the porous body 1. ; is adopted as a technical means. [Function] Due to the action of the hygroscopic filler, moisture from the atmosphere is taken into the body from one side of the inorganic porous body 1, and moisture is released from one or the other side, but the interior becomes in a high humidity state, causing mold and mildew. This creates an environment where it is easy for this to occur. However, since both the inorganic porous body 1 and the hygroscopic filler do not serve as nutritional sources for mold, even if mold adheres to it, it will not grow. In addition, when the hygroscopic filler takes in moisture from the atmosphere, the ionic halogen compound contained in the filler ionizes, generating anions and electron flow, and its bactericidal action prevents the growth of mold. It is. In addition, due to the presence of the hygroscopic filler, the inorganic porous material 1 and the moisture permeable protective material 2 can be
Because wetting phenomenon rarely occurs at the interface, mold is less likely to form. Moreover, the average pore diameter of the inorganic porous body 1 is
Since the thickness is 0.1 μ to 100 μ, the hygroscopic filler can be kept uniformly dispersed within the hygroscopic body 1. Furthermore, since the hygroscopic filler containing the ionic halogen compound is retained inside the inorganic porous body 1, the growth of mold is inhibited and discoloration occurs from within. A moisture permeable protective material 2 is formed on the surface of the moisture absorbent body 1, which not only enables cleaning but also prevents the moisture absorbent filler from flowing out of the material. Incidentally, even if the filler leaks out of the material, it is not toxic and is inexpensive, so it can be used in large quantities. [Example] The present invention will be described in detail below. The material of the inorganic porous body 1 used in the present invention is as follows:
For example, fiberboard is made by compacting and hardening hydraulic inorganic hardened materials such as gypsum, cement, calcium silicate, rock wool, glass wool, etc. in layers with an adhesive, and making it hydrophilic with a surfactant. It was adjusted to a range of 0.1 to 100μ.
If the pore size is 100μ or more, the flow of the hygroscopic filler and halogen compound is large, whereas if the pore size is 0.1μ or less, the hygroscopic filler is poorly dispersed and moisture does not move smoothly, making it impossible to exhibit the effect of the hygroscopic filler. Furthermore, the porous body 1 has a moisture permeability of 1×10 -3 g/
m・h・mmhg, thermal conduction resistance is 2.0m・h・℃/
kcal or more and the material is preferably 5 mm or more, preferably 20 mm or more. The hygroscopic filler is montmorillonite, sepiolite, zeolite, xonotlite, molecular sieves, activated alumina, etc., or an inorganic material such as calcium chloride, lithium chloride, etc. alone or in a mixture thereof. Halogen compounds include water-soluble halogen compounds such as calcium bromide, potassium odor, sodium odor, calcium chloride, magnesium chloride, lithium chloride, etc.
(i.e., one that produces Cl - Br - ions). Among the above halogen compounds, anhydrous salts, dihydrate salts, etc. have good performance as hygroscopic fillers and are suitable for dual use. It is preferable that the content of the halogen compound is appropriately dispersed in relation to the area to which mold, etc. adhere, and the addition rate varies depending on the specific gravity (void ratio) of the porous material, so it is based on the apparent specific gravity. When the content was measured, it was demonstrated that the presence of a halogen compound of 1.5 g x 10 -2 /cm 3 or more has an antifungal effect. If this is converted into weight percent, it is as follows. In the case of rock wool board (specific gravity 0.25), the addition rate is 6% by weight or more Stone wool board (〃 0.9)〃 …1.7〃 Cement board (〃 1.2)〃 …1.3〃, preferably 6 to 20 g × 10 -2 / cm3
It is. The method for containing it is to dissolve a predetermined amount of a halogen compound in water, then disperse a hygroscopic filler in water, mix it with a hydraulic inorganic material, and form it into a plate shape.
Harden and dry. Alternatively, a method may be used in which a predetermined amount of a halogen compound is dissolved in water, a hygroscopic filler is dispersed in water, and a fiberboard that has been previously formed into a plate shape and made hydrophilic is impregnated with the solution and dried. The moisture-permeable protective film is used to prevent dirt on the surface and moisture-absorbing filler from flowing out of the material so as not to impede moisture as much as possible. It is formed by pasting etc.
【表】【table】
本考案は叙上のように、平均孔径0.1μ以上、
100μ以下の空〓を有する無機質系多孔質体に、
イオン性ハロゲン化合物を該多孔質体の見かけ体
積に対して含有率1.5ｇ×10-2／cm3以上を必須成
分とする無機質系の吸湿性フイラーが含有率6g
×10-2／cm3以上にて基材内部迄含有保持されてい
るとともに該多孔質体表面に透湿性保護材を形成
してなるので、無機質系多孔質体及び吸湿性フイ
ラーがともにカビの栄養源とならず、カビが付着
しても増殖しないものであり、加えて吸湿性フイ
ラーが大気中の水分を取り込むことにより含有さ
れたイオン性ハロゲン化合物がイオン化し、陰イ
オン、電子流の発生により殺菌作用が生じてカビ
が増殖しないという利点があり、更に吸湿性フイ
ラーの存在により高湿度環境下でも表面結露した
り、濡れ現象が少なく、その結果、カビが生じに
くいものである。又、無機質系多孔質体の平均細
孔径を0.1〜100μとしてあるために、吸湿性フイ
ラーの均一な分散保持が容易で、透湿性保護性の
存在により多孔質体外への流出が少なく、清掃す
ることができる。しかも前記殺菌性を持つフイラ
ーが多孔質体の内部まで保持されているので、内
部でカビの生育が阻害されて内部から変色するこ
ともないという利点がある。尚、前記フイラーは
毒性はなく、安価であり、大量に用いることがで
きるものである。
As mentioned above, the present invention has an average pore diameter of 0.1μ or more,
Inorganic porous material with pores of 100μ or less,
An inorganic hygroscopic filler containing an ionic halogen compound at a content rate of 1.5 g x 10 -2 /cm 3 or more based on the apparent volume of the porous body as an essential component has a content rate of 6 g.
×10 -2 /cm 3 or more is contained and retained inside the base material, and a moisture permeable protective material is formed on the surface of the porous body, so both the inorganic porous body and the hygroscopic filler are resistant to mold. It does not serve as a nutrient source and does not grow even if mold attaches to it.In addition, when the hygroscopic filler takes in moisture from the atmosphere, the ionic halogen compounds contained in it are ionized, generating anion and electron flow. This has the advantage that it has a bactericidal effect and prevents the growth of mold.Furthermore, due to the presence of the hygroscopic filler, there is little surface condensation or wetting phenomenon even in high humidity environments, and as a result, it is difficult for mold to grow. In addition, since the average pore diameter of the inorganic porous material is 0.1 to 100μ, it is easy to maintain uniform dispersion of the hygroscopic filler, and due to the presence of moisture permeable protective properties, there is less leakage out of the porous body, making it easy to clean. be able to. Furthermore, since the bactericidal filler is retained inside the porous body, there is an advantage that the growth of mold inside the porous body is inhibited and discoloration does not occur from within. Note that the filler is non-toxic, inexpensive, and can be used in large quantities.
第１図…本発明の一実施例の斜視図。 １……多孔質体、２……透湿性保護材。 FIG. 1: A perspective view of an embodiment of the present invention. 1... Porous body, 2... Moisture permeable protective material.
Claims (1)
る空〓を有する無機質系多孔質体に、イオン性ハ
ロゲン化合物を該多孔質体の見かけ体積に対して
含有率1.5ｇ×10-2／cm3以上を必須成分とする無
機質系の吸湿性フイラーが含有率６ｇ×10-2／cm3
以上にて該多孔質体内部迄含有保持されてなると
ともに該多孔質体表面に透湿性保護材を形成して
なる事を特徴とする防カビ性基材。 An ionic halogen compound is added to an inorganic porous body having voids with an average pore size distribution ranging from 0.1μ to 100μ at a content rate of 1.5g x 10 -2 /cm 3 based on the apparent volume of the porous body. Inorganic hygroscopic filler containing the above essential ingredients at a content rate of 6g x 10 -2 /cm 3
A mold-proofing base material characterized in that the above-mentioned material is contained and retained inside the porous body, and a moisture-permeable protective material is formed on the surface of the porous body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4157188U JPH045162Y2 (en) | 1988-03-29 | 1988-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4157188U JPH045162Y2 (en) | 1988-03-29 | 1988-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01144043U JPH01144043U (en) | 1989-10-03 |
| JPH045162Y2 true JPH045162Y2 (en) | 1992-02-14 |
Family
ID=31268009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4157188U Expired JPH045162Y2 (en) | 1988-03-29 | 1988-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH045162Y2 (en) |
-
1988
- 1988-03-29 JP JP4157188U patent/JPH045162Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01144043U (en) | 1989-10-03 |
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