JPH0451593A - Method for cleaning by water of soldered printed circuit board - Google Patents
Method for cleaning by water of soldered printed circuit boardInfo
- Publication number
- JPH0451593A JPH0451593A JP16101390A JP16101390A JPH0451593A JP H0451593 A JPH0451593 A JP H0451593A JP 16101390 A JP16101390 A JP 16101390A JP 16101390 A JP16101390 A JP 16101390A JP H0451593 A JPH0451593 A JP H0451593A
- Authority
- JP
- Japan
- Prior art keywords
- water
- cleaning
- circuit board
- alcohol
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 238000004140 cleaning Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000004094 surface-active agent Substances 0.000 claims abstract description 19
- 238000005406 washing Methods 0.000 claims abstract description 9
- 230000004907 flux Effects 0.000 claims description 13
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 10
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 9
- 238000009413 insulation Methods 0.000 abstract description 11
- 150000003839 salts Chemical class 0.000 abstract description 11
- 239000012535 impurity Substances 0.000 abstract description 8
- 238000005476 soldering Methods 0.000 abstract description 8
- 230000006866 deterioration Effects 0.000 abstract description 7
- 239000002904 solvent Substances 0.000 abstract description 5
- 230000005012 migration Effects 0.000 abstract description 4
- 238000013508 migration Methods 0.000 abstract description 4
- 230000008859 change Effects 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract description 2
- 230000007774 longterm Effects 0.000 abstract description 2
- 150000002500 ions Chemical class 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- -1 amine hydrochlorides Chemical class 0.000 description 5
- 239000012190 activator Substances 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- WRMNZCZEMHIOCP-UHFFFAOYSA-N 2-phenylethanol Chemical compound OCCC1=CC=CC=C1 WRMNZCZEMHIOCP-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- 239000003945 anionic surfactant Substances 0.000 description 2
- 239000003093 cationic surfactant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000002529 flux (metallurgy) Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 125000001165 hydrophobic group Chemical group 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 description 1
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 description 1
- 206010007269 Carcinogenicity Diseases 0.000 description 1
- 208000035859 Drug effect increased Diseases 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical class Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007670 carcinogenicity Effects 0.000 description 1
- 231100000260 carcinogenicity Toxicity 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000007524 organic acids Chemical group 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical group [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- CSIGAEASXSGNKS-UHFFFAOYSA-N propane-1,1,3-triol Chemical compound OCCC(O)O CSIGAEASXSGNKS-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M sodium chloride Inorganic materials [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はロジン系フラックスとソルダーペーストを使用
したハンダ付けプリント基板の水洗浄方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for washing soldered printed circuit boards with water using rosin-based flux and solder paste.
現在、電子機器用には一般に、松脂をベースとしたロジ
ン系フラックスとソルダーペーストが使用され、ハンダ
付け後フロンなどの有機溶剤で洗浄している。しかし、
近年フロンによるオゾン層破壊の問題やトリクロロエチ
レン類の発ガン性の疑いなど、環境破壊や労働衛生の立
場より各種有ｍ溶剤の規制が強くなり、その対応が迫ら
れている。一方、最新のプリント基板は民生機器メーカ
ーの「軽薄短小」化のニーズに応じて表面実装技術（Ｓ
ＭＴ： ５ｕｒｆａｃｅ Ｍｏｕｎｔ Ｔｅｃｈｎ
ｏｌｏｇｙ）が研究、開発され実用化されている。Currently, rosin-based flux and solder paste are generally used for electronic devices, and after soldering, they are cleaned with organic solvents such as fluorocarbons. but,
In recent years, regulations on various molar solvents have become stricter from the standpoint of environmental destruction and occupational health, such as the ozone layer depletion caused by fluorocarbons and the suspicion of carcinogenicity of trichlorethylene, and there is an urgent need to address these issues. On the other hand, the latest printed circuit boards are manufactured using surface mount technology (S
MT: 5surface Mount Techn.
technology) has been researched, developed, and put into practical use.
ロジン系フラックスとソルダーペーストとは、金属表面
酸化物を除去するための活性剤とフラックスの流動を調
整するためのアルコール類とを含み、活性剤は有機酸、
有機アミン、有機アミン塩酸塩、臭化水素酸塩、塩化亜
鉛、アルコール類は一価、二価および／または三価の脂
肪族アルコール（ポリグリコール）等を混合している。Rosin-based flux and solder paste contain an activator for removing metal surface oxides and alcohols for adjusting flux flow, and the activator is an organic acid,
Organic amines, organic amine hydrochlorides, hydrobromides, zinc chloride, alcohols are mixed with monovalent, divalent and/or trivalent aliphatic alcohols (polyglycols), and the like.
活性剤は酸性であるので、ハンダ付け後、部品表面に残
る。洗浄水または加温水は表面張力が大きいので、前記
の塩類とフラックス中の不純物、銅塩化物、銅アビエチ
ン酸等は電子パーツの表面または隙間に残って金属部分
を腐食させ、絶縁を劣化させる。Since the activator is acidic, it remains on the surface of the component after soldering. Since cleaning water or heated water has a high surface tension, the impurities in the salts and flux, copper chloride, copper abietic acid, etc., remain on the surfaces or gaps of electronic parts, corroding metal parts and degrading insulation.
また回路パターンにエレクトロマイグレーション、イオ
ンマイグレーションが成長して回路不良となる。以上の
実体からハンダ付けプリント基板洗浄後の塩類をコント
ロールする必要がある。Furthermore, electromigration and ion migration grow in the circuit pattern, resulting in circuit defects. From the above facts, it is necessary to control salts after cleaning soldered printed circuit boards.
しかし、前記のハンダ付けプリント基板の水洗浄では、
活性剤に含まれる塩類とフラックス中の不純物で絶縁劣
化、回路不良という重大欠点があった。そこで本発明は
上記問題点および欠点を除去するものでその目的とする
ところは、十分な強度を有するハンダ付けを行ないしか
もハンダ付けの後に、腐食性の塩類と不純物を残さない
、電子機器用プリント基板の水洗浄方法を提供すること
である。However, when cleaning the soldered printed circuit board with water,
It had serious drawbacks such as insulation deterioration and circuit failure due to salts contained in the activator and impurities in the flux. SUMMARY OF THE INVENTION The present invention aims to eliminate the above-mentioned problems and disadvantages, and the object thereof is to provide a printed circuit board for electronic devices that can perform soldering with sufficient strength and that does not leave corrosive salts and impurities after soldering. An object of the present invention is to provide a method for cleaning a substrate with water.
上記課題を解決するため、ロジン系フラックスとソルダ
ーペーストを使用してハンダ付けしたプリント基板の水
洗浄方法であって、水／アルコール／界面活性剤で構成
するようにしたものである。In order to solve the above-mentioned problems, there is provided a water cleaning method for printed circuit boards soldered using rosin-based flux and solder paste, which consists of water/alcohol/surfactant.
本発明の上δ５目的は、ロジン系フラックス、ソルダー
ペーストを使用してハンダ付けしたプリント基板の水洗
浄方法であって、水／アルコール／界面活性剤を含む洗
浄水を使用することを特徴とする６本発明実現に向けて
努力した水／アルコール／界面活性剤を含む洗浄水を使
用したプリント基板の水洗浄方法によって必ずや達成で
きる。本発明のアルコールの目的は、プリント基板表面
に附着する塩類と不純物をプリント基板から引きはがす
力が比較的良好な溶媒であり、水との相溶性も良好かつ
安価で多量入手できる。しかし、アルコールのアミン塩
溶解量は１ ｍ ｇ ／ ｃ ｃ前後であまり大きくな
い。一方、水は塩類と不純物の最良の溶剤である。水の
アミン塩溶解量は３００ｍｇ／ ＣＣとアルコールの約
３００倍の溶解量のために、アルコールの希釈剤として
最も有効な溶媒である。一方、水はプリント基板表面に
附着する塩類と不純物を引きはなす力はない、前記のア
ルコールは本発明を損なうものでなければ以下述べるい
ずれのアルコール類でも良い、たとえば、メタノール（
ＣＨｓＯＨ）、エタノール（ＣＨｓ ＣＨ２０Ｈ）、１
−プロパツール（ＣＨｓＣＨｐｃ Ｈｔ ＯＨ）、２−
プロパツール（ＣＨｓＯＨ（ＯＨ）ＣＨ＊）、 １−
ペンタノール（ＣＨ３（ＣＨＩ）ｎｃＨｔＯＨ）と２−
メチル−１−プロパツール、２−メチル−２−プロパツ
ールおよびシクロヘキサノール、フェニルアルコール、
２−フェニルエタノールさらに、１．２−エタジオール
（基官能命名：エチレングリコール）、１． ２． ３
−プロパントリオール（基官能命名： グリセリン）で
あり、それ以外のアルコールも全て本発明に含まれる０
本発明の洗浄効果が得られるアルコール濃度は消防法、
安全性、排水濃度を考慮して６０％および６０％以下で
５０％および５０％以上であるが、洗浄効果を損なうも
のでなければ前記以外の濃度も全て本発明に含まれる。The object of the present invention is to provide a method for washing printed circuit boards soldered using rosin-based flux and solder paste, which is characterized by using washing water containing water/alcohol/surfactant. 6. This can definitely be achieved by the water cleaning method for printed circuit boards using cleaning water containing water/alcohol/surfactant, which has been developed to realize the present invention. The purpose of the alcohol of the present invention is to be a solvent that has a relatively good ability to peel off salts and impurities adhering to the surface of a printed circuit board, has good compatibility with water, and can be obtained in large quantities at low cost. However, the amount of amine salt dissolved in alcohol is not very large, around 1 mg/cc. On the other hand, water is the best solvent for salts and impurities. The amount of amine salt dissolved in water is 300 mg/CC, which is about 300 times that of alcohol, making it the most effective solvent as a diluent for alcohol. On the other hand, water does not have the power to remove salts and impurities adhering to the surface of the printed circuit board.The alcohol mentioned above may be any of the following alcohols as long as it does not impair the present invention.For example, methanol (
CHsOH), ethanol (CHs CH20H), 1
-Proper tool (CHsCHpc Ht OH), 2-
Proper tool (CHsOH(OH)CH*), 1-
Pentanol (CH3(CHI)ncHtOH) and 2-
Methyl-1-propanol, 2-methyl-2-propanol and cyclohexanol, phenyl alcohol,
2-phenylethanol, 1.2-ethadiol (group functional name: ethylene glycol), 1. 2. 3
-Propanetriol (group functional name: glycerin), and all other alcohols are included in the present invention.
The alcohol concentration at which the cleaning effect of the present invention can be obtained is determined by the Fire Service Act.
Considering safety and wastewater concentration, the concentration is 60% and 60% or less and 50% and 50% or more, but any concentration other than the above is also included in the present invention as long as it does not impair the cleaning effect.
次に界面活性剤を説明すると陰イオン界面活性剤、陽イ
オン界面活性剤、両性界面活性剤、非イオン界面活性剤
があり、いずれの活面活性剤も洗浄効果を損なうもので
なければ本発明に含まれる。この界面活性剤は低濃度で
、水、アルコールの表面エネルギー（表面張力）を下げ
ることができる物質で、このような化合物は、疎水基、
親水基とが化合した有機化合物として構成されている。Next, to explain surfactants, there are anionic surfactants, cationic surfactants, amphoteric surfactants, and nonionic surfactants.If any surfactant does not impair the cleaning effect, it can be used in the present invention. include. This surfactant is a substance that can lower the surface energy (surface tension) of water and alcohol at low concentrations, and such compounds have hydrophobic groups,
It is composed of an organic compound with a hydrophilic group.
周知の如く、界面活性剤分子の疎水基を類別すると、炭
化水素系、シリコン系、フッ素系の三つの化学薬品に分
類できる。この界面活性剤は前記の如く、水の表面張力
を低下させ電子部品相互間の狭い隙間にまで一侵入して
、ハンダ付け後に残存する塩類を残りなく除去し、かつ
吸湿性がないために、電気絶縁性の劣化、エレクトロマ
イグレーション、イオンマイグレーション防止の利点を
有する。洗浄水の界面活性剤の含有量は炭化水素系、シ
リコン系、フッ素系の分類で多少異なるが０゜００１％
より少ないときは界面活性剤の効果は認められず、１％
以上は安定な泡が発生するので有効でない、しかし、１
０ｐｐｍおよび１０ｐｐｍ以下あるいは１％および１％
以上で、本発明の効果を損なうものでなければ全て本発
明に含まれる。さらに、実施例および比較例を詳細に説
明する。第１図は試験用プリント基板平面図、第２図は
イオン残渣Ｉ、第３図は絶縁抵抗値の結果である。第１
図に示すように、プリント基板上に、１１パタ一ン幅１
．０ｍｍ、 １２間隔０．２ｍｍの１３くし形銅ハク
電極パターンを作り、このパターン上のＩＣ、コンデン
サー、ＩＣソケットなどの電子部品を搭載できる試験用
プリント基板を作成した。このプリント基板に電子部品
を搭載し、ロジン系フラックス（日本アルファメタルズ
製ＰＭ−６２７）を隼温で２ｓｅｃＤｉｐして発泡塗布
し、１００°Ｃブレヒート後自動ハンダ付ハンダ付電子
部品をハンダ付けした。この基板の水洗工程は、１例と
して、６０℃温純水ブリウォッシュ１分−水／６０％エ
タノール１０゜５％界面活性済水溶液（住友スリーエム
株製、フロラードＦＣ−９３またはＦＣ−１３５）ウォ
ッシュ２分−温純水リンス１分で洗浄を行なった。As is well known, when the hydrophobic groups of surfactant molecules are categorized, they can be classified into three types: hydrocarbon-based, silicon-based, and fluorine-based chemicals. As mentioned above, this surfactant lowers the surface tension of water, penetrates into the narrow gaps between electronic components, removes all remaining salts after soldering, and is not hygroscopic. It has the advantage of preventing deterioration of electrical insulation, electromigration, and ion migration. The content of surfactant in cleaning water varies depending on the classification of hydrocarbon, silicone, and fluorine, but it is 0°001%.
When the amount is less than 1%, no effect of surfactant is observed.
The above is not effective because stable bubbles are generated, but 1
0ppm and 10ppm or less or 1% and 1%
All of the above are included in the present invention as long as they do not impair the effects of the present invention. Furthermore, Examples and Comparative Examples will be explained in detail. FIG. 1 is a plan view of the test printed circuit board, FIG. 2 is the ion residue I, and FIG. 3 is the results of the insulation resistance value. 1st
As shown in the figure, there are 11 patterns per width 1 on the printed circuit board.
．． A 13-comb-shaped copper strip electrode pattern of 0 mm and 12 intervals of 0.2 mm was made, and a test printed circuit board on which electronic components such as ICs, capacitors, and IC sockets could be mounted was created. Electronic components were mounted on this printed circuit board, and rosin-based flux (PM-627 manufactured by Alpha Metals Japan) was applied by dipping for 2 seconds at Hayate temperature, and the electronic components were soldered with automatic soldering after being heated at 100°C. The water washing process for this substrate is, for example, 1 minute of 60°C warm pure water wash, 2 minutes of water/60% ethanol 10°5% surfactant aqueous solution (manufactured by Sumitomo 3M Ltd., Florado FC-93 or FC-135) wash. - Cleaning was performed with warm pure water rinsing for 1 minute.
この洗浄方法、順序は前記以外も本発明に含まれる。前
記の界面活性剤は、化学薬品安定性、熱安定性に優れ、
搭載された電子部品、プラスチック、ゴムに全く影響は
ない。フロラードＦＣ−９３はアニオン系、ＦＣ−１３
５はカチオン系であり、外観は白色粉末で成分、パーフ
ルオロアルキルスルホン酸のカリウム塩である。洗浄後
エアーブローにて熱風乾燥したプリント基板をオメガメ
ータ（日本アルファメタルズ製、スタティック方式、６
００ＳＭＤ）によりイオン残渣を測定した結果を第２図
に示す。このオメガメータの原理を説明すると、一定量
の抽出溶液（ＩＰＡ７５％、純水）に測定物の残留イオ
ンを抽出し、この溶液の電気抵抗を測定し、得られた電
気抵抗値をマイクロプロセッサにより同量のＮａＣ１イ
オンに変換され、第２の結果が得られる。この結果得ら
れるイオン残渣量の単位はｍｇＮａｃｌ／Ｅ３９−ｉｎ
である。The present invention includes cleaning methods and orders other than those described above. The above surfactant has excellent chemical stability and thermal stability,
There is no effect on the electronic components, plastic, or rubber installed. Florado FC-93 is anionic, FC-13
No. 5 is a cationic type, and the appearance is a white powder, and the ingredient is a potassium salt of perfluoroalkylsulfonic acid. After cleaning, the printed circuit board was dried with hot air using an Omega meter (Japan Alpha Metals, static method, 6
FIG. 2 shows the results of measuring the ion residues using 00SMD). To explain the principle of this omega meter, residual ions of the object to be measured are extracted into a certain amount of extraction solution (75% IPA, pure water), the electrical resistance of this solution is measured, and the obtained electrical resistance value is processed by a microprocessor. It is converted into the same amount of NaCl ions, giving the second result. The unit of the amount of ion residue obtained as a result is mgNacl/E39-in.
It is.
Ａは比較例でＢは実施例である。Ｂはエタノール／フロ
ラードＦＣ−９３，Ｃはエタノール／フロラードＦＣ／
３５で明らかに比較例のイオン残渣量より少ない。さら
に、熱風乾燥したプリント基板のくし形電極の絶縁抵抗
を測定し、かつ温度４０℃、相対湿度９０〜９５％の雰
囲気中り、 Ｃ。A is a comparative example and B is an example. B is ethanol/Florado FC-93, C is ethanol/Florado FC/
35, which is clearly lower than the amount of ion residue in the comparative example. Furthermore, the insulation resistance of the comb-shaped electrodes of the printed circuit board that had been dried with hot air was measured, and in an atmosphere with a temperature of 40°C and a relative humidity of 90 to 95%.
３０Ｖを４００時間印加し、絶縁抵抗値を測定する。そ
の結果は第３図のＢおよびＣで示すように絶縁劣化は４
００時間で極めて少ない。また、カチオン系界面活性剤
を含む場合も、前記、非イオン系およびアニオン系も同
様な結果が得られる。30V was applied for 400 hours and the insulation resistance value was measured. As shown in B and C in Figure 3, the insulation deterioration was 4.
00 hours is extremely low. Furthermore, when a cationic surfactant is included, similar results can be obtained with the above-mentioned nonionic and anionic surfactants.
次に比較例として、前記洗浄工程において、石油系洗浄
剤で洗浄後のイオン残渣量を第２図のＡ、絶縁抵抗値の
結果を第３図のＡに示す。これと比較して、本発明の前
記ＢおよびＣの結果は、いずれもイオン残漬量が少なく
、かつ絶縁劣化に於いても優れている。さらに、前記結
果を表面張力の観点で考察すると水の表面張力と６０％
エタノール１０．５％ＦＣ−９３洗浄水および６０％エ
タノール１０．５％ＦＣ−１３９洗浄水の表面張力を表
面張力計で検査すると水は約７３ｄｙｎｅｓ／ ｃ ｍ
２５℃、６０％エタノール１０，５％ＦＣ−９３は約
１８ ｄ ｙ ｎ ｅ ｓ ／ ｃ ｍ ２５℃、６０
％エタノール１０．５％ＦＣ−１３９は約１３ｄｙｎ
ｅ ｓ ／ ｃ ｍ ２５℃と下がっており、この表面
張力が小なくなった割合だけ洗浄効果が高まっている。Next, as a comparative example, in the cleaning step, the amount of ion residue after cleaning with a petroleum-based detergent is shown in A of FIG. 2, and the result of the insulation resistance value is shown in A of FIG. Compared to this, results B and C of the present invention both have a small amount of residual ions and are excellent in terms of insulation deterioration. Furthermore, considering the above results from the perspective of surface tension, the surface tension of water and 60%
When the surface tension of ethanol 10.5% FC-93 washing water and 60% ethanol 10.5% FC-139 washing water was tested using a surface tension meter, the water was approximately 73 dynes/cm
25℃, 60% ethanol 10.5% FC-93 is about 18 dynes/cm 25℃, 60
% ethanol 10.5% FC-139 is approximately 13 dyn
e s / cm decreased to 25° C., and the cleaning effect increased by the proportion that this surface tension decreased.
一方、この水／アルコール／界面活性剤洗浄液の廃液水
はＢＯＤおよびＣＯＤにあまり影響しないので地下水を
汚染することはない。さらに、ロジン系フラックス、ソ
ルダーペーストに有効であることはもちろんであるが水
溶性フラックス、水溶性ソルダーペーストにはより有効
な発明である。On the other hand, the waste liquid water of this water/alcohol/surfactant cleaning solution does not significantly affect BOD and COD and therefore does not contaminate groundwater. Furthermore, the present invention is of course effective for rosin-based fluxes and solder pastes, but is even more effective for water-soluble fluxes and water-soluble solder pastes.
以上述べたように本発明によれば水／アルコール／界面
活性剤を含む洗浄剤を使用すればハンダ付け後にプリン
ト基板に残ったロジン系フラックス、ソルダーペースト
を完全に除去し、水洗後の電食（エレクトロマイグレー
ション、イオンマイグレーション）、絶縁劣化などのな
い長期信頼性の高い電子機器用実装プリント基板が得ら
れる。As described above, according to the present invention, by using a cleaning agent containing water/alcohol/surfactant, rosin-based flux and solder paste remaining on printed circuit boards after soldering can be completely removed, and electrolytic corrosion can be prevented after washing with water. (electromigration, ion migration), a mounted printed circuit board for electronic devices with high long-term reliability without insulation deterioration etc. can be obtained.
前記の効果を発揮する水／アルコール／界面活性剤は安
価で、公害も少なく、水洗浄方式の基本構造を変えない
ため自由度のある洗浄設計が可能となった点の波及効果
は大きいと言える。The water/alcohol/surfactant that exhibits the above-mentioned effects is inexpensive and causes little pollution, and since the basic structure of the water cleaning method does not change, it can be said to have a large ripple effect in that it allows for flexible cleaning designs. .
第１図は本発明の試験用プリント基板平面図。 第２図はイオン残液量を示す図。 第３図は絶縁抵抗値結果を示す図。 以 上 出願人 セイコーエプソン株式会社 代理人 弁理士 鈴木 喜三部 他１名第 図 第２図 FIG. 1 is a plan view of a test printed circuit board of the present invention. FIG. 2 is a diagram showing the amount of ion residual liquid. FIG. 3 is a diagram showing the insulation resistance value results. that's all Applicant: Seiko Epson Corporation Agent: Patent attorney Kisanbe Suzuki and 1 other person figure Figure 2
Claims (1)
ンダ付けしたプリント基板の水洗浄方法であつて、水／
アルコール／界面活性剤で構成することを特徴とするハ
ンダ付けプリント基板の水洗浄方法。A water cleaning method for printed circuit boards soldered using rosin flux and solder paste.
A method for washing soldered printed circuit boards with water, characterized by comprising alcohol/surfactant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16101390A JPH0451593A (en) | 1990-06-19 | 1990-06-19 | Method for cleaning by water of soldered printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16101390A JPH0451593A (en) | 1990-06-19 | 1990-06-19 | Method for cleaning by water of soldered printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0451593A true JPH0451593A (en) | 1992-02-20 |
Family
ID=15726921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16101390A Pending JPH0451593A (en) | 1990-06-19 | 1990-06-19 | Method for cleaning by water of soldered printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451593A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06238243A (en) * | 1992-12-25 | 1994-08-30 | Japan Field Kk | Washing and drying method |
| CN103394823A (en) * | 2013-08-05 | 2013-11-20 | 美特科技(苏州)有限公司 | Halogen-free soldering flux for loudspeaker and preparation method for same |
| CN103923514A (en) * | 2014-05-04 | 2014-07-16 | 深圳市实锐泰科技有限公司 | PCB developing tank cleaning solution and method for cleaning developing tank by using same |
-
1990
- 1990-06-19 JP JP16101390A patent/JPH0451593A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06238243A (en) * | 1992-12-25 | 1994-08-30 | Japan Field Kk | Washing and drying method |
| CN103394823A (en) * | 2013-08-05 | 2013-11-20 | 美特科技(苏州)有限公司 | Halogen-free soldering flux for loudspeaker and preparation method for same |
| CN103923514A (en) * | 2014-05-04 | 2014-07-16 | 深圳市实锐泰科技有限公司 | PCB developing tank cleaning solution and method for cleaning developing tank by using same |
| CN103923514B (en) * | 2014-05-04 | 2016-01-20 | 深圳市实锐泰科技有限公司 | Use the method for PCB developing trough scavenging solution cleaning developing trough |
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