JPH0451514Y2 - - Google Patents

Info

Publication number
JPH0451514Y2
JPH0451514Y2 JP4855787U JP4855787U JPH0451514Y2 JP H0451514 Y2 JPH0451514 Y2 JP H0451514Y2 JP 4855787 U JP4855787 U JP 4855787U JP 4855787 U JP4855787 U JP 4855787U JP H0451514 Y2 JPH0451514 Y2 JP H0451514Y2
Authority
JP
Japan
Prior art keywords
spacer
opening edge
circuit board
lead pin
protrusions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4855787U
Other languages
Japanese (ja)
Other versions
JPS63153590U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4855787U priority Critical patent/JPH0451514Y2/ja
Publication of JPS63153590U publication Critical patent/JPS63153590U/ja
Application granted granted Critical
Publication of JPH0451514Y2 publication Critical patent/JPH0451514Y2/ja
Expired legal-status Critical Current

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  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【考案の詳細な説明】 (産業上の利用分野) 本考案は外部引出用リードピンを半田付けによ
つて多数固着してなる回路基板を実装基板へ挿着
する際に、回路基板と実装基板との間に一定間隔
を形成する回路基板用スペーサーに関する。
[Detailed description of the invention] (Industrial application field) This invention is designed to connect the circuit board and the mounting board when inserting the circuit board, which has a large number of external lead pins fixed by soldering, into the mounting board. The present invention relates to a spacer for a circuit board that forms a constant interval between the spacers.

(従来の技術とその問題点) 従来、この種のスペーサー1は第4図に示す構
造のものであり、回路基板2を実装基板3に実装
する際には、回路基板2の下面から突出する所定
位置、例えば四隅のリードピン21にスペーサー
1を挿着して、回路基板2と実装基板3間に一定
の間〓を形成し、安定した導通状態を保つてい
た。
(Prior art and its problems) Conventionally, this type of spacer 1 has the structure shown in FIG. Spacers 1 are inserted into predetermined positions, for example, lead pins 21 at the four corners, to form a gap between the circuit board 2 and the mounting board 3 for a certain period of time, thereby maintaining a stable conductive state.

スペーサー1は所望材料で形成された所望厚さ
のリング体で、上面から下面迄リードピン21へ
挿着する為の挿通孔11を貫通開穿し、この挿通
孔11の上面開口縁13から下面開口縁14迄を
直線状に形成してなつている。
The spacer 1 is a ring body made of a desired material and having a desired thickness, and is bored through an insertion hole 11 for insertion into the lead pin 21 from the upper surface to the lower surface, and is opened from the upper surface opening edge 13 of the insertion hole 11 to the lower surface. It is formed in a straight line up to the edge 14.

一方、回路基板2に固着されたリードピン21
は、その周囲に半田層23を形成し、該基板2下
面から突出する脚杆22の上端にフイレツト24
が形成される。
On the other hand, lead pins 21 fixed to the circuit board 2
A solder layer 23 is formed around it, and a fillet 24 is formed at the upper end of the leg rod 22 protruding from the lower surface of the substrate 2.
is formed.

このようなリードピン21に上記スペーサー1
を挿着した場合、スペーサー1の上面開口縁13
がフイレツト24にぶつかつてスペーサー1上面
を回路基板2下面へ密接させることができず、よ
つてスペーサー1は非常に不安定な状態でリード
ピン21に挿着され、この為実装基板3に実装し
た回路基板2の取り付け精度が低く、導通不良を
引起す虞れがあつた。
The spacer 1 is attached to such a lead pin 21.
is inserted, the upper opening edge 13 of the spacer 1
The spacer 1 collides with the fillet 24 and cannot bring the top surface of the spacer 1 into close contact with the bottom surface of the circuit board 2. Therefore, the spacer 1 is inserted into the lead pin 21 in a very unstable state, and as a result, the circuit mounted on the mounting board 3 The mounting accuracy of the board 2 was low, and there was a risk of causing poor conduction.

(考案が解決しようとする技術的課題) 以上の問題点を解決しようとする本考案の技術
的課題は、スペーサーの上面開口縁にフイレツト
の逃がし部を形成してスペーサーの上面を基板下
面へ密接させることによつて両基板間を所定間隔
に確保することである。
(Technical problem to be solved by the invention) The technical problem of the present invention, which attempts to solve the above problems, is to form a fillet relief part at the opening edge of the upper surface of the spacer so that the upper surface of the spacer is brought into close contact with the lower surface of the substrate. This is to ensure a predetermined distance between both substrates.

(技術的課題を達成する為の手段) 以上の技術的課題を達成する為の本考案の手段
は、スペーサー本体を絶縁材でもつてリング状に
形成し、その上面開口縁を湾曲面に形成し、下面
開口縁に複数の突起を円周上等間隔をおいて設
け、該突起を下面開口縁より内側へ向けて所望量
突出させることである。
(Means for Achieving the Technical Problem) The means of the present invention for achieving the above-mentioned technical problem is to form the spacer main body into a ring shape using an insulating material, and to form the upper opening edge into a curved surface. A plurality of protrusions are provided on the lower opening edge at equal intervals on the circumference, and the protrusions are made to protrude inward from the lower opening edge by a desired amount.

(作用) 上記構成によれば、スペーサーの上面開口縁が
フイレツトに適合してスペーサーを基板の下面に
密接状に固定させ、又、下面開口縁の突起がリー
ドピンの外周へ圧接してスペーサーの脱落を防止
する。
(Function) According to the above structure, the upper opening edge of the spacer fits into the fillet to tightly fix the spacer to the lower surface of the substrate, and the protrusion on the lower opening edge presses against the outer periphery of the lead pin, preventing the spacer from falling off. prevent.

(効果) 本考案は以上の様な構成にしたことにより下記
の効果を有する。
(Effects) The present invention has the following effects by having the above configuration.

スペーサーの上面開口縁を湾曲面に形成した
ので、スペーサーが基板下面にて安定した状態
で固定し、よつて実装基板に実装した回路基板
の取付け精度が大幅に向上し、導通不良を起こ
す虞れをなくす。
Since the upper opening edge of the spacer is formed into a curved surface, the spacer is stably fixed on the bottom surface of the board, which greatly improves the mounting accuracy of the circuit board mounted on the mounting board, eliminating the risk of conduction failure. Eliminate.

又、スペーサーれの上面開口縁の曲面形状に
より、スペーサーをリードピンに挿着する際該
開口へのリードピン下端の挿入が容易になる。
Furthermore, the curved shape of the upper opening edge of the spacer allows the lower end of the lead pin to be easily inserted into the opening when the spacer is inserted into the lead pin.

下面開口縁の突起がリードピンへ挿着したス
ペーサーの脱落を防止するので、スペーサーの
リードピンへの挿着工程が容易にかつ確実に行
える。
Since the protrusion on the lower opening edge prevents the spacer inserted into the lead pin from falling off, the process of inserting the spacer into the lead pin can be performed easily and reliably.

(実施例) 以下本考案に係る回路基板用スペーサーの一実
施例を第1図〜第3図に基づいて説明する。
(Example) An example of a spacer for a circuit board according to the present invention will be described below based on FIGS. 1 to 3.

図中1はスペーサー、2は実装基板3に実装す
る回路基板、21は回路基板に固着したリードピ
ンである。
In the figure, 1 is a spacer, 2 is a circuit board mounted on the mounting board 3, and 21 is a lead pin fixed to the circuit board.

スペーサー1は,ゴム、合成樹脂等の絶縁材料
で形成されたドーナツ型のリング体で、挿通孔1
1とリング部12とからなる。
The spacer 1 is a donut-shaped ring body made of an insulating material such as rubber or synthetic resin.
1 and a ring portion 12.

挿通孔11はスペーサー1の上面から下面まで
貫通すると共にその内径を回路基板2下面から突
出するリードピン21の脚杆部22へ嵌合可能に
開穿し、スペーサー1の上面に上面開口縁13
を、下面に下面開口縁14を夫々形成する。
The insertion hole 11 penetrates from the upper surface to the lower surface of the spacer 1 and is opened so that its inner diameter can be fitted into the leg rod portion 22 of the lead pin 21 protruding from the lower surface of the circuit board 2 .
A lower opening edge 14 is formed on the lower surface.

リング部12は挿通孔11を形成する輪郭部分
で、その上面及び下面を円弧状の曲面に形成し、
断面略楕円形もしくは略円形に呈して前記上面開
口縁13及び下面開口縁14を湾曲面に形成し、
又、下面には突起15を複数個設ける。
The ring portion 12 is a contour portion forming the insertion hole 11, and has an upper surface and a lower surface formed into an arcuate curved surface.
The upper opening edge 13 and the lower opening edge 14 are formed into curved surfaces with a substantially elliptical or circular cross section;
Further, a plurality of protrusions 15 are provided on the lower surface.

突起15は平面円形のおわん型の突出体で、ス
ペーサ1の下面開口縁14に、その円周上等間隔
をおいて設けられると共に、突起15外周を前記
開口縁14の内周へ所望量突出してその先端を挿
通孔11へ嵌合するリードピン21の脚杆部22
の外周へ圧接する。
The protrusions 15 are bowl-shaped protrusions with a circular plan view, and are provided on the lower opening edge 14 of the spacer 1 at equal intervals on the circumference, and the outer periphery of the protrusions 15 protrudes a desired amount to the inner periphery of the opening edge 14. The leg portion 22 of the lead pin 21 whose tip fits into the insertion hole 11
Press to the outer periphery of the

スペーサー1を回路基板2下面から突出するリ
ードピン21の脚杆部22の上端にて固定させた
際には、スペーサー1の上面開口縁13がフイレ
ツト24下面へ密接してスペーサー1の上面を回
路基板2下面へ密接させ、又、突起15夫々がリ
ードピン21脚杆部22外周へ圧接して脚杆部2
2を挟持する。
When the spacer 1 is fixed at the upper end of the leg portion 22 of the lead pin 21 protruding from the lower surface of the circuit board 2, the upper opening edge 13 of the spacer 1 is brought into close contact with the lower surface of the fillet 24, and the upper surface of the spacer 1 is attached to the circuit board. 2, and the protrusions 15 are pressed against the outer periphery of the lead pin 21 and the leg rod portion 22, so that the leg rod portion 2
Hold 2.

尚、本実施例においては、スペーサー1の上面
及び下面共に曲面に構成してその生産性を上げて
いる。
In this embodiment, both the upper and lower surfaces of the spacer 1 are curved to increase productivity.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案に係る回路基板用スペーサーの一
実施例を示し、第1図はスペーサーの中央縦断面
図で回路基板に挿着した状態を示し、第2図は同
単体の底面図、第3図は同回路基板に挿着した状
態における底面図であり、又、第4図は従来の回
路基板用スペーサーの中央縦断面図で回路基板に
装着した状態を示す。 尚、図中、スペーサー本体……1、上面開口縁
……13、下面開口縁……14、突起……15と
する。
The drawings show an embodiment of the spacer for a circuit board according to the present invention, and FIG. 1 shows a central vertical cross-sectional view of the spacer when it is inserted into a circuit board, FIG. 2 shows a bottom view of the spacer, and FIG. This figure is a bottom view of the conventional spacer for a circuit board, and FIG. 4 is a vertical cross-sectional view of the conventional circuit board spacer, showing the spacer installed on the circuit board. In the figure, the spacer body...1, the upper opening edge...13, the lower opening edge...14, and the protrusion...15.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] スペーサー本体を絶縁材でもつてリング状に形
成し、その上面開口縁を湾曲面に形成し、下面開
口縁に複数の突起を円周上等間隔をおいて設け、
該突起を下面開口縁より内側へ向けて所望量突出
させて成る回路基板用スペーサー。
The spacer body is made of an insulating material and formed into a ring shape, the upper opening edge thereof is formed into a curved surface, and the lower opening edge is provided with a plurality of protrusions at equal intervals on the circumference,
A spacer for a circuit board, which has the protrusion projecting a desired amount inward from the opening edge of the lower surface.
JP4855787U 1987-03-30 1987-03-30 Expired JPH0451514Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4855787U JPH0451514Y2 (en) 1987-03-30 1987-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4855787U JPH0451514Y2 (en) 1987-03-30 1987-03-30

Publications (2)

Publication Number Publication Date
JPS63153590U JPS63153590U (en) 1988-10-07
JPH0451514Y2 true JPH0451514Y2 (en) 1992-12-03

Family

ID=30870199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4855787U Expired JPH0451514Y2 (en) 1987-03-30 1987-03-30

Country Status (1)

Country Link
JP (1) JPH0451514Y2 (en)

Also Published As

Publication number Publication date
JPS63153590U (en) 1988-10-07

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