JPH0451166U - - Google Patents
Info
- Publication number
- JPH0451166U JPH0451166U JP9211890U JP9211890U JPH0451166U JP H0451166 U JPH0451166 U JP H0451166U JP 9211890 U JP9211890 U JP 9211890U JP 9211890 U JP9211890 U JP 9211890U JP H0451166 U JPH0451166 U JP H0451166U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- peripheral wall
- conductor layers
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000012212 insulator Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9211890U JPH0451166U (pt) | 1990-08-31 | 1990-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9211890U JPH0451166U (pt) | 1990-08-31 | 1990-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0451166U true JPH0451166U (pt) | 1992-04-30 |
Family
ID=31828335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9211890U Pending JPH0451166U (pt) | 1990-08-31 | 1990-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451166U (pt) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007005431A (ja) * | 2005-06-22 | 2007-01-11 | Shinko Electric Ind Co Ltd | コンデンサ埋め込み基板およびその製造方法 |
| JP2021180316A (ja) * | 2017-05-12 | 2021-11-18 | 大日本印刷株式会社 | 貫通電極基板、貫通電極基板を備える実装基板並びに貫通電極基板の製造方法 |
-
1990
- 1990-08-31 JP JP9211890U patent/JPH0451166U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007005431A (ja) * | 2005-06-22 | 2007-01-11 | Shinko Electric Ind Co Ltd | コンデンサ埋め込み基板およびその製造方法 |
| JP2021180316A (ja) * | 2017-05-12 | 2021-11-18 | 大日本印刷株式会社 | 貫通電極基板、貫通電極基板を備える実装基板並びに貫通電極基板の製造方法 |