JPH0448900A - Manufacture of ultrasonic probe - Google Patents
Manufacture of ultrasonic probeInfo
- Publication number
- JPH0448900A JPH0448900A JP15816390A JP15816390A JPH0448900A JP H0448900 A JPH0448900 A JP H0448900A JP 15816390 A JP15816390 A JP 15816390A JP 15816390 A JP15816390 A JP 15816390A JP H0448900 A JPH0448900 A JP H0448900A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric ceramic
- side electrode
- matching layer
- acoustic matching
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000853 adhesive Substances 0.000 claims abstract description 41
- 230000001070 adhesive effect Effects 0.000 claims abstract description 41
- 239000000919 ceramic Substances 0.000 claims abstract description 37
- 238000003475 lamination Methods 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 19
- 239000012939 laminating adhesive Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000012856 packing Methods 0.000 abstract 3
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 description 13
- 238000002604 ultrasonography Methods 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 238000004506 ultrasonic cleaning Methods 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229920001651 Cyanoacrylate Polymers 0.000 description 2
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 210000001015 abdomen Anatomy 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000002405 diagnostic procedure Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 210000004400 mucous membrane Anatomy 0.000 description 1
- LYGJENNIWJXYER-UHFFFAOYSA-N nitromethane Chemical compound C[N+]([O-])=O LYGJENNIWJXYER-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002432 poly(vinyl methyl ether) polymer Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 210000004872 soft tissue Anatomy 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、超音波探触子の製造方法に関し、特に圧電セ
ラミックにおいて、その側面に電極を有するような超音
波探触子の製造方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method of manufacturing an ultrasonic probe, and particularly to a method of manufacturing an ultrasonic probe that is made of piezoelectric ceramic and has electrodes on its side surface. .
[従来の技術]
医用超音波探触子は、皮膚表面から体内に向けて超音波
を発することにより腹部、胸部などの体内の軟部組織を
画像表示として動態観測する際に広く用いられているが
、最近はより正確な診断情報を得るために超音波探触子
を口から飲み込んで胃壁の粘膜の様子を鮮明に画像とし
て描き出すような要求が高まってきている。特に医用内
視鏡を用いて患部を観察するとともに超音波を用いて内
部の様子を観察する画像診断方法は、より確実で多くの
情報を提供してくれるものとして今後更に要求が高まっ
てくる。[Prior Art] Medical ultrasound probes are widely used for dynamic observation of soft tissues in the body, such as the abdomen and chest, as images by emitting ultrasound waves from the skin surface into the body. Recently, in order to obtain more accurate diagnostic information, there has been an increasing demand for ultrasound probes to be swallowed through the mouth to clearly depict the appearance of the mucous membranes of the stomach wall. In particular, the demand for image diagnostic methods that use a medical endoscope to observe the affected area and the internal state using ultrasound will increase in the future as it provides more reliable information.
このように医用内視鏡とともに超音波探触子を併用する
際には、内視鏡の処理具用穴に超音波探触子を挿入して
用いるため、この微小超音波探触子はかなり小型である
あることが必要とされる。When an ultrasound probe is used in conjunction with a medical endoscope, the ultrasound probe is inserted into the endoscope's processing tool hole, so the ultrasonic probe is quite small. It is required to be small.
従来から用いられている超音波探触子の構造の一例を第
3図に示す。FIG. 3 shows an example of the structure of a conventionally used ultrasonic probe.
第3図において、圧電セラミック1の超音波を送受波す
る振動面には電極2が設けられている。In FIG. 3, an electrode 2 is provided on the vibrating surface of the piezoelectric ceramic 1 for transmitting and receiving ultrasonic waves.
一方、上記振動面と振動面積をより多く確保するために
、圧電セラミック1の超音波を送受波する振動面とは異
なる側面には、上下両振動面各々の電極2,2が短絡し
ないように上下両振動面各々の電極2.2から延長され
た電極が側面電極2a。On the other hand, in order to secure a larger vibration surface and vibration area, the electrodes 2 on both the upper and lower vibration surfaces are placed on the side surface of the piezoelectric ceramic 1 that is different from the vibration surface that transmits and receives ultrasonic waves so as not to short-circuit. The electrodes extending from the electrodes 2.2 on both the upper and lower vibration surfaces are side electrodes 2a.
2aとして設けられている。この電極2及び側面電極2
aは、圧電セラミックlへの金属または導電性金属酸化
物の蒸着やメツキや導電性塗料の塗装等によって形成さ
れている。この圧電セラミック1の一方の振動面にはエ
ポキシ系等の積層用接着剤5を介して音響整合層3が接
着・固定されている。また、音響整合層3を固定した圧
電セラミックlの振動面とは反対側の振動面にも、やは
り積層用接着剤5を介してバッキング材4が接着・固定
されている。さらに音響整合層3とバッキング材4とを
有するこの圧電セラミックlはリード線8と共にモール
ドハウジング6中に埋め込まれており、圧電セラミック
1の側面電極2aはリード線8と導電性接着剤7を介し
て電気的に結合されている。2a. This electrode 2 and side electrode 2
A is formed by vapor deposition or plating of a metal or conductive metal oxide on the piezoelectric ceramic l, or by coating with a conductive paint. An acoustic matching layer 3 is bonded and fixed to one vibrating surface of the piezoelectric ceramic 1 via a lamination adhesive 5 such as epoxy. Further, a backing material 4 is also bonded and fixed to the vibration surface of the piezoelectric ceramic 1 opposite to the vibration surface of the piezoelectric ceramic 1 to which the acoustic matching layer 3 is fixed via the lamination adhesive 5. Further, this piezoelectric ceramic l having an acoustic matching layer 3 and a backing material 4 is embedded in a mold housing 6 together with a lead wire 8, and a side electrode 2a of the piezoelectric ceramic 1 is connected to the lead wire 8 via a conductive adhesive 7. are electrically coupled.
このような超音波探触子を積層して製造する場合、先に
音響整合層3とバッキング材4を積層用接着剤5を介し
てそれぞれ圧電セラミックlに接合し、接合用接着剤5
の硬化後にモールドハウジング6中に埋め込んだ後、圧
電セラミック1の側面電極2aとリード線8とを導電性
接着剤7あるいは半田等を用いて電気的に結合している
。When manufacturing such an ultrasonic probe by laminating layers, the acoustic matching layer 3 and the backing material 4 are first bonded to the piezoelectric ceramic l via the lamination adhesive 5, and then
After being hardened and embedded in a mold housing 6, the side electrode 2a of the piezoelectric ceramic 1 and the lead wire 8 are electrically coupled using a conductive adhesive 7, solder, or the like.
このような側面電極を有する圧電セラミックを用いた超
音波探触子については、特開昭63−242100号公
報等に記載のものが提案されている。As for an ultrasonic probe using a piezoelectric ceramic having such a side electrode, the one described in Japanese Patent Application Laid-Open No. 63-242100 and the like has been proposed.
[発明が解決しようとする課題]
ところで、上記のようにして音響整合層3とバッキング
材4を積層用接着剤5を介してそれぞれ圧電セラミック
lに接合する場合、積層用接着剤5の量が少ないと経時
的劣化により圧電セラミック1と音響整合層3、あるい
は圧電セラミック1とバッキング材4との剥がれを生ず
るため、積層用接着剤5の量を一般に多めにして塗付し
ている。[Problems to be Solved by the Invention] By the way, when the acoustic matching layer 3 and the backing material 4 are respectively bonded to the piezoelectric ceramic l via the lamination adhesive 5 as described above, the amount of the lamination adhesive 5 is If the amount is too low, the piezoelectric ceramic 1 and the acoustic matching layer 3, or the piezoelectric ceramic 1 and the backing material 4 may peel off due to deterioration over time, so a large amount of the lamination adhesive 5 is generally applied.
しかし、積層用接着剤5の量を多めにすると、第4図に
示すように接合時に積層用接着剤5が接合面外まではみ
出し、側面電極2aを覆ってしまうことになる。そして
、積層用接着剤5で覆われた側面電極2aを有する圧電
セラミック1を接合後、モールドハウジング6中に埋め
込み、圧電セラミックlの側面電極2aとリード線8と
を導電性接着剤7を用いて電気的に結合しようとしても
、既に側面電極2aを覆っている積層用接着剤5が導電
性を有しないため導電不良となる。However, if the amount of the lamination adhesive 5 is too large, the lamination adhesive 5 will protrude outside the bonding surface during bonding and cover the side electrodes 2a, as shown in FIG. After bonding the piezoelectric ceramic 1 having the side electrode 2a covered with the lamination adhesive 5, it is embedded in the mold housing 6, and the side electrode 2a of the piezoelectric ceramic 1 and the lead wire 8 are connected using the conductive adhesive 7. Even if an attempt is made to electrically connect the side electrodes 2a, the lamination adhesive 5 that already covers the side electrodes 2a does not have conductivity, resulting in poor conductivity.
このような不具合を防止するためには、特開昭63−2
42100号公報記載の発明の利用が考えられる。これ
は、バッキング打倒の電極の一部に電極のリード線の役
割をする補助電極を設けるものである。しかし、なるべ
く微小な超音波探触子を得るためには、なるべく微小な
(例えば1×2X0.14 (mm) )圧電セラミッ
クを使用し、かつこの圧電セラミックの超音波を送受波
する振動面を全面使用することが必要とされるが、上記
のように補助電極を設けた場合、補助電極によって不要
な音波の反射波がノイズとして発生して音響特性が劣化
してしまうという問題がある。In order to prevent such problems, Japanese Unexamined Patent Publication No. 63-2
Utilization of the invention described in 42100 can be considered. In this method, an auxiliary electrode that serves as a lead wire for the electrode is provided on a part of the electrode for overturning the backing. However, in order to obtain an ultrasonic probe as small as possible, a piezoelectric ceramic as small as possible (for example, 1 x 2 x 0.14 (mm)) should be used, and the vibration surface of this piezoelectric ceramic should be Although it is necessary to use the entire surface, when the auxiliary electrode is provided as described above, there is a problem that the auxiliary electrode generates reflected waves of unnecessary sound waves as noise, deteriorating the acoustic characteristics.
本発明は、かかる従来の問題点に鑑みてなされたもので
あって、微小な超音波探触子を電極部の導電不良を生ず
ることなく容易に作成することができ、しかも、製品と
して超音波探触子の音響特性を劣化させることがない製
造方法を提供することを目的とする。The present invention has been made in view of such conventional problems, and it is possible to easily create a minute ultrasonic probe without causing conductivity defects in the electrode part, and furthermore, as a product, it is possible to It is an object of the present invention to provide a manufacturing method that does not deteriorate the acoustic characteristics of a probe.
[課題を解決するための手段]
上記目的を達成するため、本発明では、超音波を送受波
する2つの振動面とは異なる側面に電極を有する圧電セ
ラミックの前記振動面の一方と音響整合層、および前記
振動面の他方とバッキング材のそれぞれを前記積層用接
着剤を用いて接着することにより積層体を形成し、その
積層体の一部をモールドハウジング中に埋め込んだ後、
前記側面電極と前記モールドハウジング中に埋設されて
いるリード線とを電気的結合するようにした超音波探触
子の製造方法において、前記側面電極を樹脂で覆った状
態で、前記振動面と前記音響整合層、および前記振動面
と前記バッキング材のそれぞれを前記積層用接着剤を用
いて接着し、前記積層用接着剤の硬化後前記側面電極と
前記リード線との電気的結合前に、前記樹脂を除去する
ようにしている。[Means for Solving the Problems] In order to achieve the above object, the present invention provides an acoustic matching layer and one of the vibrating surfaces of a piezoelectric ceramic having an electrode on a side surface different from the two vibrating surfaces that transmit and receive ultrasonic waves. , and the other of the vibrating surfaces and the backing material are bonded to each other using the lamination adhesive to form a laminate, and a part of the laminate is embedded in a mold housing, and then
In the method for manufacturing an ultrasonic probe in which the side electrode and the lead wire buried in the mold housing are electrically coupled, the side electrode is covered with a resin, and the vibrating surface and the The acoustic matching layer, the vibration surface, and the backing material are each bonded using the lamination adhesive, and after the lamination adhesive is cured and before the side electrode and the lead wire are electrically connected, the I'm trying to remove the resin.
[作用コ
上記手段によれば、圧電セラミックの振動面に音響整合
層またはバッキング材を積層用接着剤を用いて積層・整
合する前に、予め側面電極を樹脂で覆っておくため、接
合の際に積層用接着剤により側面が覆われてしまっても
、側面電極は上記樹脂によって保護されており、当該樹
脂を除去しさえすれば、側面電極が露出する。したがっ
て、側面電極とリード線との導通を確保することができ
る。[Operation] According to the above means, the side electrodes are covered with resin in advance before the acoustic matching layer or backing material is laminated and aligned on the vibrating surface of the piezoelectric ceramic using a lamination adhesive. Even if the side surfaces are covered with the lamination adhesive, the side electrodes are protected by the resin, and the side electrodes are exposed as long as the resin is removed. Therefore, conduction between the side electrode and the lead wire can be ensured.
また、側面電極とリード線との電気的結合を、特開昭6
3−242100号公報記載の発明と異なり補助電極を
用いずに行なうので、製品としての超音波探触子の音響
特性を劣化させることもない。In addition, the electrical connection between the side electrode and the lead wire was
Unlike the invention described in Japanese Patent No. 3-242100, this method is performed without using an auxiliary electrode, so that the acoustic characteristics of the ultrasonic probe as a product are not deteriorated.
[実施例コ
(第1実施例)
本発明の第1実施例を第1図および第2図に基づき説明
する。[Example 1 (First Example) A first example of the present invention will be described based on FIGS. 1 and 2.
まず、電極2,2および側面電極2a、2aを有する圧
電セラミックlを離型フィルム9a、9bで挾み込む。First, a piezoelectric ceramic 1 having electrodes 2, 2 and side electrodes 2a, 2a is sandwiched between release films 9a, 9b.
このときの離型フィルムとしては透明で紫外線透過率の
良いもので、例えばオレフィン系、ポリエステル系、フ
ッ素系等のものが用いられる。次いで、この離型フィル
ム9a、9bと側面電極2a、2aとで区画された部分
に、デイスペンサーや注射器などを用いて側面電極2a
。The release film used at this time is transparent and has good ultraviolet transmittance, such as olefin-based, polyester-based, or fluorine-based films. Next, a dispenser, a syringe, or the like is used to inject the side electrode 2a into the area defined by the release films 9a, 9b and the side electrodes 2a, 2a.
.
2aが濡れるように保護樹脂10を満遍なく注入する。The protective resin 10 is evenly injected so that the resin 2a is wetted.
このときの保護樹脂1oとしては、例えば変性ポリアク
リルアミド、変性ポリアクリル酸、変性ポリメタクリル
酸、変性ポリイタコン酸、変性ポリビニルアルコール、
変性ポリエチレンオキサイド、変性ポリビニルピロリド
ン、変性ポリビニルメチルエーテル等の、分子中に一〇
〇NH,。Examples of the protective resin 1o at this time include modified polyacrylamide, modified polyacrylic acid, modified polymethacrylic acid, modified polyitaconic acid, modified polyvinyl alcohol,
Modified polyethylene oxide, modified polyvinyl pyrrolidone, modified polyvinyl methyl ether, etc. have 100 NH in the molecule.
−COOH,−○H基等を有する線状高分子上ツマ−お
よびオリゴマーにアセトフェノンやベンゾフェノン等の
光重合開始剤と接着付与剤や増粘剤等の添加剤を添加し
た光重合型の水溶性高分子系樹脂が用いられる。A photopolymerizable water-soluble product made by adding a photopolymerization initiator such as acetophenone or benzophenone and additives such as an adhesion promoter or thickener to a linear polymeric polymer or oligomer having -COOH, -○H groups, etc. A polymer resin is used.
次に、離型フィルム9a、9b越しに高強度の紫外線を
照射するか、また側面から紫外線を照射するかによって
保護樹脂1oを硬化させる。ここまでの状態が第1図に
示されている。Next, the protective resin 1o is cured by irradiating high-intensity ultraviolet rays through the release films 9a and 9b or by irradiating ultraviolet rays from the side. The state up to this point is shown in FIG.
次に、離型フィルム9a、9bを剥して除去した後、通
常の工程で積層用接着剤5を用いて音響整合層3とバッ
キング材4を圧電セラミック1に積層接合し、加圧しな
がら加熱硬化させる。この場合、積層用接着剤5として
通常の2液工ポキシ系接着剤を用いれば、80℃、2時
間程度で硬化は終了する。接着硬化後は第2図のように
なっており、これを30〜40℃のぬるま湯に浸漬する
か水中で超音波洗浄を行なうがすることにより、硬化し
た保護樹脂10を溶解除去する。また、はみ出したまま
硬化した積層用接着剤5はナイフ等で容易に除去する。Next, after peeling off and removing the release films 9a and 9b, the acoustic matching layer 3 and backing material 4 are laminated and bonded to the piezoelectric ceramic 1 using a lamination adhesive 5 in a normal process, and heated and cured while applying pressure. let In this case, if a normal two-component poxy adhesive is used as the lamination adhesive 5, curing will be completed in about 2 hours at 80°C. After the adhesive is cured, the result is as shown in FIG. 2, and the cured protective resin 10 is dissolved and removed by immersing it in lukewarm water at 30 to 40 DEG C. or by performing ultrasonic cleaning in water. Further, the lamination adhesive 5 that has hardened while protruding is easily removed with a knife or the like.
なお、超音波探触子の性能上、バッキング材等への水分
の浸透が問題になるような場合は、保護樹脂10の溶解
の際に湯や水ではなく例えばアセトンやエタノール等の
有機溶媒を用いる。この場合も超音波洗浄を行なうとよ
い。積層用接着剤5としてエポキシ系接着剤を用いれば
、十分に溶剤や超音波洗浄にも耐えつる。Note that if moisture penetration into the backing material is a problem due to the performance of the ultrasonic probe, use an organic solvent such as acetone or ethanol instead of hot water or water when dissolving the protective resin 10. use In this case as well, it is advisable to perform ultrasonic cleaning. If an epoxy adhesive is used as the lamination adhesive 5, it can sufficiently withstand solvents and ultrasonic cleaning.
上記実施例によれば、以下に述べるような効果が得られ
る。According to the above embodiment, the following effects can be obtained.
即ち、圧電セラミック1の振動面に音響整合層3およよ
びバッキング材4を積層用接着剤5を用いて積層・整合
する前に、予め側面電極を保護樹脂10で覆っておくた
め、圧電セラミックlの側面電極2aが絶縁性の積層用
接着剤5で覆われることなく音響整合層3およびバッキ
ング材4を接合することができ、その結果、モールドハ
ウジング6中に埋め込み後、圧電セラミック1の側面電
極2aとリード線8とを導電性接着剤7または半田等を
用いて確実に電気的結合することができることになる。That is, before the acoustic matching layer 3 and the backing material 4 are laminated and aligned on the vibrating surface of the piezoelectric ceramic 1 using the lamination adhesive 5, the side electrodes are covered with the protective resin 10 in advance. The acoustic matching layer 3 and the backing material 4 can be bonded without the side electrode 2a of the piezoelectric ceramic 1 being covered with the insulating lamination adhesive 5, and as a result, the side surface of the piezoelectric ceramic 1 can be The electrode 2a and the lead wire 8 can be reliably electrically coupled using the conductive adhesive 7, solder, or the like.
また、側面電極2aとリード線8との電気的結合を、特
開昭63−242100号公報記載の発明と異なり補助
電極を用いずに行なうので、製品としての超音波探触子
の音響特性を劣化させることもない。Furthermore, since electrical coupling between the side electrode 2a and the lead wire 8 is performed without using an auxiliary electrode, unlike the invention described in JP-A-63-242100, the acoustic characteristics of the ultrasonic probe as a product can be improved. It will not deteriorate.
(第2実施例)
本発明の第2実施例を以下に説明するが、第1実施例と
異なるのは、保護樹脂10として用いた光重合型の水溶
性高分子系樹脂の代わりにシアノアクリレート系樹脂を
用いる点である。その製造工程は第1実施例と同様で、
まず、離型フィルム9a、9bと側面電極2a、2aで
区画された部分に保護樹脂10を注入する。保護樹脂1
0として用いるシアノアクリレート系樹脂は瞬間接着剤
として通常用いられており、空気中の水分と反応して短
時間に硬化する性質を有している。しかし、本発明のよ
うに多量に注入する場合は極端に硬化速度が遅くなるた
め、保護樹脂10を注入後硬化促進剤として芳香族アミ
ンをエタノール中に溶解させたものを添加する。(Second Example) A second example of the present invention will be described below, but the difference from the first example is that cyanoacrylate was used instead of the photopolymerizable water-soluble polymer resin used as the protective resin 10. The point is that a resin based on this method is used. The manufacturing process is the same as the first example,
First, the protective resin 10 is injected into the area defined by the release films 9a, 9b and the side electrodes 2a, 2a. Protective resin 1
The cyanoacrylate resin used as No. 0 is commonly used as an instant adhesive and has the property of reacting with moisture in the air and curing in a short time. However, when a large amount is injected as in the present invention, the curing speed becomes extremely slow, so after injecting the protective resin 10, an aromatic amine dissolved in ethanol is added as a curing accelerator.
次に、保護樹脂10の硬化後難型フィルム9a。Next, after the protective resin 10 is cured, the hard-to-form film 9a is formed.
9bを剥して除去した後、通常の工程で積層用接着剤5
を用いて音響整合層3とバッキング材4を圧電セラミッ
ク1に積層・接合し、加圧しながら加熱硬化させる。硬
化終了後、これをアセトン、ニトロメタン、ジメチルホ
ルムアミド等の有機溶媒中に浸漬し、超音波洗浄を数分
間性なうことにより、硬化した保護樹脂10を溶解除去
することができる。はみ出したまま硬化した積層用接着
剤5はナイフ等で容易に除去することができる。After peeling off and removing 9b, apply the laminating adhesive 5 in the normal process.
The acoustic matching layer 3 and the backing material 4 are laminated and bonded to the piezoelectric ceramic 1 using a method, and heated and cured while applying pressure. After curing, the cured protective resin 10 can be dissolved and removed by immersing it in an organic solvent such as acetone, nitromethane, dimethylformamide, etc. and subjecting it to ultrasonic cleaning for several minutes. The lamination adhesive 5 that has hardened while protruding can be easily removed with a knife or the like.
上記実施例によれば、以下に述べるような効果が得られ
る。According to the above embodiment, the following effects can be obtained.
即ち、圧電セラミックlの側面電極2aが絶縁性の積層
用接着剤5で覆われることなく音響整合層3およびバッ
キング材4を接合することができ、その結果、モールド
ハウジング6中に埋め込み後、圧電セラミックlの側面
電極2aとリード線8とを導電性接着剤7または半田等
を用いて確実に電気的結合することができる。That is, the acoustic matching layer 3 and the backing material 4 can be bonded without the side electrode 2a of the piezoelectric ceramic l being covered with the insulating lamination adhesive 5, and as a result, after being embedded in the mold housing 6, the piezoelectric The side electrode 2a of the ceramic 1 and the lead wire 8 can be reliably electrically coupled using the conductive adhesive 7, solder, or the like.
また、側面電極2aとリード線8との電気的結合を、特
開昭63−242100号公報記載の発明とは異なり補
助電極を用いずに行なうので、製品としての超音波探触
子の音響特性を劣化させることもない。Further, since electrical coupling between the side electrode 2a and the lead wire 8 is performed without using an auxiliary electrode unlike the invention described in JP-A-63-242100, the acoustic characteristics of the ultrasonic probe as a product are It does not cause deterioration.
[発明の効果]
本発明の超音波探触子の製造方法では、超音波を送受波
する2つの振動面とは異なる側面に電極を有する圧電セ
ラミックの前記振動面の一方と音響整合層、および前記
振動面の他方とバッキング材のそれぞれを前記積層用接
着剤を用いて接着することにより積層体を形成し、その
積層体の一部をモールドハウジング中に埋め込んだ後、
前記側面電極と前記モールドハウジング中に埋設されて
いるリード線とを電気的結合するに際して、前記側面電
極を樹脂で覆った状態で、前記振動面と前記音響整合層
、および前記振動面と前記バッキング材のそれぞれを前
記積層用接着剤を用いて接着し、前記積層用接着剤の硬
化後前記側面電極と前記リード線との電気的結合前に、
前記樹脂を除去するようにしたので、積層用接着剤によ
り側面が覆われてしまっても、側面電極は上記樹脂によ
って保護されており、樹脂を除去すれば側面電極を露出
させることができる。したがって、側面電極とリード線
との導通を確保することができ、品質の向上を図ること
ができる。[Effects of the Invention] In the method for manufacturing an ultrasound probe of the present invention, one of the vibrating surfaces of a piezoelectric ceramic having an electrode on a side surface different from the two vibrating surfaces that transmit and receive ultrasonic waves, and an acoustic matching layer; After forming a laminate by bonding the other of the vibrating surfaces and each of the backing materials using the lamination adhesive, and embedding a part of the laminate in a mold housing,
When electrically coupling the side electrode and the lead wire embedded in the mold housing, the vibration surface and the acoustic matching layer, and the vibration surface and the backing are connected with the side electrode covered with resin. Each of the materials is adhered using the lamination adhesive, and after the lamination adhesive has hardened and before the electrical connection between the side electrode and the lead wire,
Since the resin is removed, even if the side surfaces are covered with the lamination adhesive, the side electrodes are protected by the resin, and the side electrodes can be exposed by removing the resin. Therefore, conduction between the side electrode and the lead wire can be ensured, and quality can be improved.
また、側面電極とリード線との電気的結合を、特開昭6
3−242100号公報記載の発明と異なり補助電極を
用いずに行なうので、製品として超音波探触子の音響特
性を劣化させることもなくなる。In addition, the electrical connection between the side electrode and the lead wire was
Unlike the invention described in Japanese Patent Publication No. 3-242100, this method is carried out without using an auxiliary electrode, so that the acoustic characteristics of the ultrasonic probe as a product are not deteriorated.
第1図および第2図は本発明に係る超音波探触子の製造
方法の実施例における工程断面図、第3図は正常な超音
波探触子の断面図、第4図は従来の不具合が生じた超音
波探触子の製造途中における断面図である。
・・・・圧電セラミック
a・・・・側面電極
・・・・音響整合層
・・・・バッキング材
・・・・積層用接着剤
・・・・保護樹脂(樹脂)
特許出願人 オリンパス光学工業株式会社代理人 弁
理士 奈 良 武
6、補正の内容
別紙のとおり第3図および第4図を補正する。
平成2年9月28日
7、添付書類の目録1 and 2 are process cross-sectional views in an embodiment of the method for manufacturing an ultrasound probe according to the present invention, FIG. 3 is a cross-sectional view of a normal ultrasound probe, and FIG. 4 is a conventional defect. FIG. 3 is a cross-sectional view of an ultrasonic probe in the process of being manufactured, in which this occurs. ... Piezoelectric ceramic a ... Side electrode ... Acoustic matching layer ... Backing material ... Lamination adhesive ... Protective resin (resin) Patent applicant Olympus Optical Industry Co., Ltd. Takeshi Nara, Company Agent Patent Attorney 6. Amend Figures 3 and 4 as shown in the attachment. September 28, 1990 7, List of attached documents
Claims (1)
極を有する圧電セラミックの前記振動面の一方と音響整
合層、および前記振動面の他方とバッキング材のそれぞ
れを前記積層用接着剤を用いて接着することにより積層
体を形成し、その積層体の一部をモールドハウジング中
に埋め込んだ後、前記側面電極と前記モールドハウジン
グ中に埋設されているリード線とを電気的結合するよう
にした超音波探触子の製造方法において、前記側面電極
を樹脂で覆った状態で、前記振動面と前記音響整合層、
および前記振動面と前記バッキング材のそれぞれを前記
積層用接着剤を用いて接着し、前記積層用接着剤の硬化
後前記側面電極と前記リード線との電気的結合前に、前
記樹脂を除去するようにしたことを特徴とする超音波探
触子の製造方法。Using the laminating adhesive, one of the vibrating surfaces of a piezoelectric ceramic having an electrode on a side different from the two vibrating surfaces that transmit and receive ultrasonic waves, an acoustic matching layer, and the other vibrating surface and a backing material, respectively. A laminate is formed by adhering the laminate, a part of the laminate is embedded in a mold housing, and then the side electrode and the lead wire embedded in the mold housing are electrically coupled. In the method for manufacturing an ultrasonic probe, the vibration surface and the acoustic matching layer, with the side electrode covered with resin,
and bonding each of the vibration surface and the backing material using the lamination adhesive, and removing the resin after the lamination adhesive has hardened and before the side electrode and the lead wire are electrically connected. A method for manufacturing an ultrasonic probe, characterized in that:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15816390A JPH0448900A (en) | 1990-06-15 | 1990-06-15 | Manufacture of ultrasonic probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15816390A JPH0448900A (en) | 1990-06-15 | 1990-06-15 | Manufacture of ultrasonic probe |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0448900A true JPH0448900A (en) | 1992-02-18 |
Family
ID=15665648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15816390A Pending JPH0448900A (en) | 1990-06-15 | 1990-06-15 | Manufacture of ultrasonic probe |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0448900A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007521490A (en) * | 2003-09-22 | 2007-08-02 | ヒョン−ユン,キム | Structural health monitor sensor and system |
WO2009050881A1 (en) * | 2007-10-15 | 2009-04-23 | Panasonic Corporation | Ultrasonic probe |
-
1990
- 1990-06-15 JP JP15816390A patent/JPH0448900A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007521490A (en) * | 2003-09-22 | 2007-08-02 | ヒョン−ユン,キム | Structural health monitor sensor and system |
WO2009050881A1 (en) * | 2007-10-15 | 2009-04-23 | Panasonic Corporation | Ultrasonic probe |
JP5415274B2 (en) * | 2007-10-15 | 2014-02-12 | パナソニック株式会社 | Ultrasonic probe |
US8834377B2 (en) | 2007-10-15 | 2014-09-16 | Konica Minolta, Inc. | Ultrasonic probe |
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