JPH0448699U - - Google Patents
Info
- Publication number
- JPH0448699U JPH0448699U JP9144590U JP9144590U JPH0448699U JP H0448699 U JPH0448699 U JP H0448699U JP 9144590 U JP9144590 U JP 9144590U JP 9144590 U JP9144590 U JP 9144590U JP H0448699 U JPH0448699 U JP H0448699U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- flat package
- package integrated
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9144590U JPH0448699U (me) | 1990-08-30 | 1990-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9144590U JPH0448699U (me) | 1990-08-30 | 1990-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448699U true JPH0448699U (me) | 1992-04-24 |
Family
ID=31827083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9144590U Pending JPH0448699U (me) | 1990-08-30 | 1990-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448699U (me) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5837991A (ja) * | 1981-08-31 | 1983-03-05 | 株式会社東芝 | フラツトパツケ−ジ形電子部品の実装装置 |
| JPS63242000A (ja) * | 1987-03-28 | 1988-10-07 | 株式会社東芝 | 電子部品の実装方法 |
| JPH0147085B2 (me) * | 1980-08-13 | 1989-10-12 | Bicc Plc |
-
1990
- 1990-08-30 JP JP9144590U patent/JPH0448699U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0147085B2 (me) * | 1980-08-13 | 1989-10-12 | Bicc Plc | |
| JPS5837991A (ja) * | 1981-08-31 | 1983-03-05 | 株式会社東芝 | フラツトパツケ−ジ形電子部品の実装装置 |
| JPS63242000A (ja) * | 1987-03-28 | 1988-10-07 | 株式会社東芝 | 電子部品の実装方法 |