JPH0448680U - - Google Patents

Info

Publication number
JPH0448680U
JPH0448680U JP9129290U JP9129290U JPH0448680U JP H0448680 U JPH0448680 U JP H0448680U JP 9129290 U JP9129290 U JP 9129290U JP 9129290 U JP9129290 U JP 9129290U JP H0448680 U JPH0448680 U JP H0448680U
Authority
JP
Japan
Prior art keywords
cavity
base body
semiconductor package
ceramic
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9129290U
Other languages
English (en)
Japanese (ja)
Other versions
JP2532943Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990091292U priority Critical patent/JP2532943Y2/ja
Publication of JPH0448680U publication Critical patent/JPH0448680U/ja
Application granted granted Critical
Publication of JP2532943Y2 publication Critical patent/JP2532943Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP1990091292U 1990-08-30 1990-08-30 半導体パッケージ Expired - Lifetime JP2532943Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990091292U JP2532943Y2 (ja) 1990-08-30 1990-08-30 半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990091292U JP2532943Y2 (ja) 1990-08-30 1990-08-30 半導体パッケージ

Publications (2)

Publication Number Publication Date
JPH0448680U true JPH0448680U (US20080094685A1-20080424-C00004.png) 1992-04-24
JP2532943Y2 JP2532943Y2 (ja) 1997-04-16

Family

ID=31826779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990091292U Expired - Lifetime JP2532943Y2 (ja) 1990-08-30 1990-08-30 半導体パッケージ

Country Status (1)

Country Link
JP (1) JP2532943Y2 (US20080094685A1-20080424-C00004.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045825A (ja) * 1998-12-22 2005-02-17 Sony Corp 電子機器及び電子機器取付方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6355943A (ja) * 1986-08-26 1988-03-10 Matsushita Electric Works Ltd チツプキヤリア

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6355943A (ja) * 1986-08-26 1988-03-10 Matsushita Electric Works Ltd チツプキヤリア

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045825A (ja) * 1998-12-22 2005-02-17 Sony Corp 電子機器及び電子機器取付方法

Also Published As

Publication number Publication date
JP2532943Y2 (ja) 1997-04-16

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