JPH0448640U - - Google Patents
Info
- Publication number
- JPH0448640U JPH0448640U JP9175590U JP9175590U JPH0448640U JP H0448640 U JPH0448640 U JP H0448640U JP 9175590 U JP9175590 U JP 9175590U JP 9175590 U JP9175590 U JP 9175590U JP H0448640 U JPH0448640 U JP H0448640U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- die
- package
- lead shaping
- shaping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007493 shaping process Methods 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002699 waste material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、この考案の一実施例を示すリード整
形装置の斜視図、第２図ａ，ｂ，ｃは第１図に示
す装置における半田くずの持ち去りの作用を説明
するリード整形装置の部分断面図である。第３図
はこの考案によつてリード整形される半導体装置
の斜視図、第４図は第３図に示す半導体装置のリ
ード整形前の状態を示す斜視図、第５図は従来の
リード整形装置を示す斜視図、第６図及び第７図
は、夫々第５図に示す装置によるリード整形工程
を示すリード整形装置の正面図、第８図は第５図
に示す従来装置においてダイに半田くずが被着す
る状態を示すダイの斜視図、第９図は大きく成長
した半田くずがリードに乗り移つた状態を示す半
導体装置の拡大斜視図である。
１……半導体装置、２……半田メツキリード、
３……パツケージ、１２……リード整形装置、１
３……ダイ、１４……パツケージ位置決め部、１
６……リード整形面、１７……リード押え、１９
……パンチ、２０……スライド機構。
FIG. 1 is a perspective view of a lead shaping device showing an embodiment of this invention, and FIGS. 2 a, b, and c are diagrams of the lead shaping device illustrating the effect of removing solder waste in the device shown in FIG. 1. FIG. FIG. 3 is a perspective view of a semiconductor device whose leads are shaped according to this invention, FIG. 4 is a perspective view showing the state of the semiconductor device shown in FIG. 3 before lead shaping, and FIG. 5 is a conventional lead shaping device. FIGS. 6 and 7 are front views of a lead shaping device showing the lead shaping process using the device shown in FIG. FIG. 9 is an enlarged perspective view of the semiconductor device showing a state in which solder waste has grown to a large extent and has transferred to the leads. 1...Semiconductor device, 2...Solder plating lead,
3...Package, 12...Lead shaping device, 1
3...Die, 14...Package positioning section, 1
6...Lead shaping surface, 17...Lead presser, 19
...Punch, 20...Slide mechanism.
Claims (1)
置のパツケージを、側方にリード整形面を持つダ
イの上に位置決めして置き、リード押えでリード
根部を挾み付け固定した状態で、リードの上から
パンチをリード整形面に押し付けてリードを整形
するリード整形装置において、 ダイのパツケージ位置決め部及びリード整形面
を、リード突出方向と直交する方向に、同一断面
形状を保つてパツケージよりも長尺に設け、 所定回数のリード整形を行う毎に、ダイを長手
方向に所定ピツチづつスライドさせるスライド機
構を設けたことを特徴とするリード整形装置。[Scope of Claim for Utility Model Registration] A package of a semiconductor device with solder-plated leads protruding from the side is positioned and placed on a die having a lead shaping surface on the side, and the base of the lead is clamped and fixed with a lead presser. In a lead shaping device that shapes the lead by pressing a punch onto the lead shaping surface from above the lead, the package positioning part of the die and the lead shaping surface maintain the same cross-sectional shape in the direction perpendicular to the lead protrusion direction. What is claimed is: 1. A lead shaping device, characterized in that a slide mechanism is provided, the die being longer than the package, and sliding the die by a predetermined pitch in the longitudinal direction every time lead shaping is performed a predetermined number of times.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9175590U JPH0448640U (en) | 1990-08-31 | 1990-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9175590U JPH0448640U (en) | 1990-08-31 | 1990-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448640U true JPH0448640U (en) | 1992-04-24 |
Family
ID=31827666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9175590U Pending JPH0448640U (en) | 1990-08-31 | 1990-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448640U (en) |
-
1990
- 1990-08-31 JP JP9175590U patent/JPH0448640U/ja active Pending
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