JPH0448626U - - Google Patents
Info
- Publication number
- JPH0448626U JPH0448626U JP9175790U JP9175790U JPH0448626U JP H0448626 U JPH0448626 U JP H0448626U JP 9175790 U JP9175790 U JP 9175790U JP 9175790 U JP9175790 U JP 9175790U JP H0448626 U JPH0448626 U JP H0448626U
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- heat sink
- resin
- molding device
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000008188 pellet Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9175790U JPH0448626U (OSRAM) | 1990-08-31 | 1990-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9175790U JPH0448626U (OSRAM) | 1990-08-31 | 1990-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448626U true JPH0448626U (OSRAM) | 1992-04-24 |
Family
ID=31827670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9175790U Pending JPH0448626U (OSRAM) | 1990-08-31 | 1990-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448626U (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011108699A (ja) * | 2009-11-13 | 2011-06-02 | Shindengen Electric Mfg Co Ltd | 半導体装置製造用金型、半導体装置の製造方法、および半導体装置 |
-
1990
- 1990-08-31 JP JP9175790U patent/JPH0448626U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011108699A (ja) * | 2009-11-13 | 2011-06-02 | Shindengen Electric Mfg Co Ltd | 半導体装置製造用金型、半導体装置の製造方法、および半導体装置 |