JPH0448001Y2 - - Google Patents

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Publication number
JPH0448001Y2
JPH0448001Y2 JP1985171185U JP17118585U JPH0448001Y2 JP H0448001 Y2 JPH0448001 Y2 JP H0448001Y2 JP 1985171185 U JP1985171185 U JP 1985171185U JP 17118585 U JP17118585 U JP 17118585U JP H0448001 Y2 JPH0448001 Y2 JP H0448001Y2
Authority
JP
Japan
Prior art keywords
circular waveguide
case
waveguide
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985171185U
Other languages
Japanese (ja)
Other versions
JPS6280401U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985171185U priority Critical patent/JPH0448001Y2/ja
Publication of JPS6280401U publication Critical patent/JPS6280401U/ja
Application granted granted Critical
Publication of JPH0448001Y2 publication Critical patent/JPH0448001Y2/ja
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、高周波受信装置に使用される低雑音
周波数変換器に関し、特に高周波受信装置の導波
管接合構造に関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a low-noise frequency converter used in a high-frequency receiver, and particularly relates to a waveguide junction structure of a high-frequency receiver.

〔従来の技術〕[Conventional technology]

従来この種の高周波装置の構造は第3図に示す
如く、高周波回路の搭載されたプリント基板21
を収容するケース22とカバー23で構成され、
ケースの円形導波管22aと、短絡面23bを持
つカバーの円形導波管23aが分割され、プリン
ト基板の高周波受信導体24設置面で接続された
構造となつていた。又従来、第2図に示す構造の
ものもあつた。
Conventionally, the structure of this type of high-frequency device is as shown in FIG.
It is composed of a case 22 and a cover 23 that accommodate the
The circular waveguide 22a of the case and the circular waveguide 23a of the cover having the short-circuit surface 23b were separated and connected at the high-frequency reception conductor 24 installation surface of the printed circuit board. Conventionally, there was also a structure shown in FIG.

〔考案が解決しようとする課題〕[The problem that the idea aims to solve]

上述した接続面はケース、カバー組合せ後の円
形導波管端面の円筒度、密着性が装置の特性を左
右することから、各々の接続面の面精度向上、プ
リント基板の厚さとプリント基板収容部の寸法管
理、ケース、カバーの円形導波管端面のずれ防止
に対する製作精度の向上が要求された。
As for the above-mentioned connection surfaces, the cylindricity and adhesion of the circular waveguide end face after combining the case and cover affect the characteristics of the device, so it is important to improve the surface precision of each connection surface, the thickness of the printed circuit board, and the printed circuit board housing area. Improvements in manufacturing accuracy were required for dimensional control and prevention of misalignment of the circular waveguide end face of the case and cover.

前記分割導波管の欠点を解決するためには、第
2図の如く接続フランジ部11aから短絡面12
aまでが一体構造となつた円形導波管12の採用
が考えられるが、ハウジングとしてのケース11
の接続フランジ部11aと円形導波管12は製造
プロセス上一体とすることは困難で、接続フラン
ジ部11aと円形導波管12とのかん合が必要で
ある。このかん合部も分割導波管の場合と同様、
接地性を確保するための作成、組立精度が要求さ
れ、量産には不向きのものであつた。
In order to solve the drawbacks of the split waveguide, as shown in FIG.
It is conceivable to adopt a circular waveguide 12 with an integral structure up to a, but the case 11 as a housing may be used.
It is difficult to integrate the connecting flange portion 11a and the circular waveguide 12 due to the manufacturing process, and it is necessary to engage the connecting flange portion 11a and the circular waveguide 12. This mating part is also similar to the case of split waveguides.
It required precision fabrication and assembly to ensure ground contact, making it unsuitable for mass production.

また、導波管の接続構造に関して、実開昭55−
102201号開示の技術がある。この技術は導波管の
端面と、接続用フランジの端面との間に導電性材
料よりなるガスケツトを挟み込んで電気的な接続
性を満すとともに、更に導波管の外周とフランジ
内周面とを接着剤を用いて機械的に補強するもの
である。
In addition, regarding the connection structure of waveguides,
There is a technique disclosed in No. 102201. This technology sandwiches a gasket made of a conductive material between the end face of the waveguide and the end face of the connecting flange to ensure electrical connectivity, and also connects the outer circumference of the waveguide and the inner circumference of the flange. mechanically reinforced using adhesive.

従つて、実開昭55−102201号開示の技術を本願
に係わる高周波受信装置に適用しようとしても、
導波管の端面とフランジの端面との間にガスケツ
トが挿入されるため、ケース内の円形導波管の軸
方向の位置を精度よく決めることが困難となり、
更にガスケツトの厚みの経時変化もありこの位置
を正確に保つことも困難である。特にケース内の
円形導波管に高周波信号用回路基板が接続され、
この基板の他端が更にケースと接続される本願考
案の場合には、この円形導波管の軸方向位置に精
度不足及び経年変化は大きな問題であり、ずれが
設計値より大きい場合は回路の機能にも悪影響を
与え、最悪の場合には回路機能が失われることと
なる。更に導波管の端面とフランジ端面との間に
挟み込まれたガスケツトにより導波管の軸方向の
反力が発生し、これも導波管に接続される回路基
板にストレスを与えることになり、回路の信頼性
を低下させる。一方、接着剤の使用は組立工数や
コストの増加を伴うことになり、不利なものであ
る。
Therefore, even if one tries to apply the technology disclosed in Utility Model Application Publication No. 55-102201 to the high frequency receiving device related to the present application,
Because a gasket is inserted between the end face of the waveguide and the end face of the flange, it becomes difficult to accurately determine the axial position of the circular waveguide inside the case.
Furthermore, the thickness of the gasket changes over time, making it difficult to maintain this position accurately. In particular, a high-frequency signal circuit board is connected to a circular waveguide inside the case.
In the case of the present invention in which the other end of this board is further connected to the case, the lack of accuracy and secular change in the axial position of this circular waveguide are major problems, and if the deviation is larger than the design value, the circuit This will also have a negative impact on functionality, and in the worst case, circuit functionality will be lost. Furthermore, the gasket sandwiched between the end face of the waveguide and the end face of the flange generates a reaction force in the axial direction of the waveguide, which also applies stress to the circuit board connected to the waveguide. Decreases circuit reliability. On the other hand, the use of adhesives is disadvantageous because it increases assembly man-hours and costs.

〔課題を解決するための手段〕[Means to solve the problem]

上記課題を解決するために本考案では、少なく
とも高周波回路を搭載したプリント基板をその周
面に取り付け、高周波受信用の導体をその内部に
突出し、一端が短絡面で他端が開口である中空円
筒状の円形導波管と、この円形導波管及びプリン
ト基板を内部に包含し、この円形導波管の他端が
取り付けられる開口を有すると共に、この取り付
け部のケース壁面に溝を形成し、この溝を有する
開口部に前記円形導波管が取り付けられると前記
プリント基板が所定位置に配置されるケースと、
前記円形導波管と前記ケースとの間で、前記溝に
かん合し、前記円形導波管とケースとを電気的に
接続すると共に、この円形導波管の外周とケース
とに挟持される導電弾性体とを有する高周波受信
装置の導波管接合構造を提供する。
In order to solve the above problems, the present invention has a hollow cylinder with a printed circuit board equipped with at least a high-frequency circuit mounted on its circumferential surface, a conductor for high-frequency reception protruding into the inside, and a short-circuit surface at one end and an opening at the other end. a circular waveguide having a shape, containing the circular waveguide and the printed circuit board therein, having an opening to which the other end of the circular waveguide is attached, and forming a groove in the case wall surface of the attachment part; a case in which the printed circuit board is placed in a predetermined position when the circular waveguide is attached to the opening having the groove;
Fits into the groove between the circular waveguide and the case, electrically connects the circular waveguide and the case, and is sandwiched between the outer periphery of the circular waveguide and the case. A waveguide joint structure for a high frequency receiving device having a conductive elastic body is provided.

〔実施例〕〔Example〕

本考案について図面を参照して説明する。 The present invention will be explained with reference to the drawings.

第1図は本考案の一実施例断面図である。高周
波回路の搭載されたプリント基板1に、ケース2
の接続フランジ部2aとの接合部から短絡面4a
迄が一体となつた円形導波管4が予め半田付け等
によつて固着され、組立時にケース2の接続フラ
ンジ部2aの接合に円形導波管4の端面をかん合
させ、カバー3を接着することによつて高周波装
置を形成している。
FIG. 1 is a sectional view of one embodiment of the present invention. A case 2 is placed on a printed circuit board 1 on which a high frequency circuit is mounted.
from the joint with the connecting flange 2a to the short circuit surface 4a
The circular waveguide 4, which is integrated with the other parts, is fixed in advance by soldering or the like, and during assembly, the end face of the circular waveguide 4 is fitted to the connection flange 2a of the case 2, and the cover 3 is glued. By doing so, a high frequency device is formed.

接続フランジ部2aと円形導波管4の端面との
接地性能は本装置自体の性能を左右するものであ
り、確実な接触度を確保するため、接続フランジ
部2aに導波管かん合部内壁を一周する溝2bを
設け、これに導電弾性体5を挟持させるものであ
る。導電弾性体としては導電性ゴム、金属性のフ
インガー等が考えられる。
The grounding performance between the connecting flange portion 2a and the end face of the circular waveguide 4 affects the performance of the device itself, and in order to ensure a reliable degree of contact, the inner wall of the waveguide mating portion is attached to the connecting flange portion 2a. A groove 2b that goes around the groove 2b is provided, and the conductive elastic body 5 is held in this groove. As the conductive elastic body, conductive rubber, metallic fingers, etc. can be considered.

本願考案では、導波管4の外周に対向する溝2
bを設けることによつて導電性弾性体5を全て導
波管4の外周とケース2の間に配置することがで
き、導波管4の端部とケース2との間に隙間が生
じるようなことがなく、よつて導波管の接地が安
定して行われるとともに、導波管の軸方向の位置
決めも正確にしかも安定におこなわれ、従つて高
周波受信装置としての信頼性が保たれる。すなわ
ち、導波管の端面に弾性体が接することもなく、
導波管の軸方向の反力の発生がなく、この方向の
導波管の位置ずれも生じない。
In the present invention, the groove 2 facing the outer periphery of the waveguide 4 is
By providing b, all of the conductive elastic body 5 can be placed between the outer periphery of the waveguide 4 and the case 2, so that a gap is created between the end of the waveguide 4 and the case 2. Therefore, the grounding of the waveguide is performed stably, and the axial positioning of the waveguide is also performed accurately and stably, thus maintaining reliability as a high frequency receiving device. . In other words, the elastic body does not touch the end face of the waveguide,
There is no reaction force in the axial direction of the waveguide, and no displacement of the waveguide in this direction occurs.

また導電性弾性体5を溝2b内にかん合して、
導波管4をその円周方向から締める形をとるの
で、この弾性体5による反力が常に導波管4の管
中心方向にかかるので、導波管4の周部とケース
2とを他の手段(接着剤等)であらためて固着す
る必要がない。
Further, the conductive elastic body 5 is fitted into the groove 2b,
Since the waveguide 4 is tightened from the circumferential direction, the reaction force by the elastic body 5 is always applied toward the center of the waveguide 4, so that the circumference of the waveguide 4 and the case 2 are There is no need to reattach using other means (glue, etc.).

〔考案の効果〕[Effect of idea]

以上説明したように本考案は、ケースの導波管
かん合部内壁に溝を設けて導電弾性体を挟持させ
ることによつて、接地性を確保するとともに、か
ん合部の寸法精度を上げることができ、従来技術
にともなう量産の不適性、原価高を解消する効果
がある。
As explained above, the present invention ensures grounding performance and improves the dimensional accuracy of the mating part by providing grooves on the inner wall of the waveguide mating part of the case and sandwiching the conductive elastic body. This has the effect of eliminating the unsuitability of mass production and high costs associated with conventional technology.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案による高周波装置の断面図、第
2図と第3図は従来構造の断面図。 1……プリント基板、2……ケース、2a……
接続フランジ部、2b……溝、4……円形導波
管、4a……短絡面、5……導電弾性体、24…
…高周波受信導体。
FIG. 1 is a sectional view of a high frequency device according to the present invention, and FIGS. 2 and 3 are sectional views of a conventional structure. 1...Printed circuit board, 2...Case, 2a...
Connection flange portion, 2b... Groove, 4... Circular waveguide, 4a... Short circuit surface, 5... Conductive elastic body, 24...
...High frequency receiving conductor.

Claims (1)

【実用新案登録請求の範囲】 少なくとも高周波回路を搭載したプリント基板
を周面に取り付け、一端が短絡面で他端が開口で
ある中空円筒状の円形導波管と、前記円形導波管
の径に対応した開口部をもち、この開口部の端に
円形導波管の端面を受け取めるフランジ部をも
ち、前記円形導波管の他端の端面を前記フランジ
部内側に接触させて受け入れるとともに、内部に
前記円形導波管及び前記プリント基板を包含し前
記プリント基板の端部を支えるケースとから構成
される高周波受信装置において、 前記円形導波管と前記ケースとの接続構造が前
記ケースの開口部で壁面に設けられた溝と、前記
溝にかん合され、前記ケースの開口部とこの開口
部に挿入された前記円形導波管の外周部との間で
挟持させられ、前記ケースと前記円形導波管の電
気的接続をはかる導電弾性体と を有することを特徴とする高周波受信装置の導波
管接合構造。
[Claims for Utility Model Registration] A hollow cylindrical circular waveguide with a printed circuit board equipped with at least a high-frequency circuit attached to its peripheral surface, one end of which is a short-circuit surface and the other end of which is open, and the diameter of the circular waveguide. and a flange portion at the end of the opening to receive the end surface of the circular waveguide, and the end surface of the other end of the circular waveguide is received in contact with the inside of the flange portion. , a high frequency receiving device comprising a case that includes the circular waveguide and the printed circuit board and supports an end of the printed circuit board, wherein a connection structure between the circular waveguide and the case is formed in the case. A groove provided in a wall surface at an opening is engaged with the groove, and is held between an opening of the case and an outer circumference of the circular waveguide inserted into the opening, and is connected to the case. A waveguide joining structure for a high frequency receiving device, comprising a conductive elastic body for electrically connecting the circular waveguide.
JP1985171185U 1985-11-06 1985-11-06 Expired JPH0448001Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985171185U JPH0448001Y2 (en) 1985-11-06 1985-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985171185U JPH0448001Y2 (en) 1985-11-06 1985-11-06

Publications (2)

Publication Number Publication Date
JPS6280401U JPS6280401U (en) 1987-05-22
JPH0448001Y2 true JPH0448001Y2 (en) 1992-11-12

Family

ID=31106582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985171185U Expired JPH0448001Y2 (en) 1985-11-06 1985-11-06

Country Status (1)

Country Link
JP (1) JPH0448001Y2 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6244561Y2 (en) * 1979-01-09 1987-11-26
JPS58182429U (en) * 1982-05-28 1983-12-05 富士通株式会社 Package for MIC

Also Published As

Publication number Publication date
JPS6280401U (en) 1987-05-22

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