JPH0447880U - - Google Patents

Info

Publication number
JPH0447880U
JPH0447880U JP8941490U JP8941490U JPH0447880U JP H0447880 U JPH0447880 U JP H0447880U JP 8941490 U JP8941490 U JP 8941490U JP 8941490 U JP8941490 U JP 8941490U JP H0447880 U JPH0447880 U JP H0447880U
Authority
JP
Japan
Prior art keywords
metal plates
horn
ultrasonic bonding
anvil
contact portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8941490U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8941490U priority Critical patent/JPH0447880U/ja
Publication of JPH0447880U publication Critical patent/JPH0447880U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を表す超音波接合装
置の概略図、第2図は上記超音波接合装置の部分
側面図、第3図は上記超音波接合装置のホーンの
拡大斜視図、第4図は従来例を表す超音波接合装
置の概略図である。 図中、1はアンビル、2はホーン、3a,3b
は金属板、4は冷却液、6aは金属板の上面とホ
ーンとの接触部、6bは金属板の下面とアンビル
との接触部、7は冷却手段である。
FIG. 1 is a schematic diagram of an ultrasonic bonding device representing an embodiment of the present invention, FIG. 2 is a partial side view of the ultrasonic bonding device, and FIG. 3 is an enlarged perspective view of the horn of the ultrasonic bonding device. FIG. 4 is a schematic diagram of a conventional ultrasonic bonding apparatus. In the figure, 1 is an anvil, 2 is a horn, 3a, 3b
4 is a metal plate, 4 is a cooling liquid, 6a is a contact portion between the upper surface of the metal plate and the horn, 6b is a contact portion between the lower surface of the metal plate and the anvil, and 7 is a cooling means.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] アンビル上に接合すべき金属板を重ねて設置す
ると共に、これら金属板を超音波振動するホーン
で上方から加圧して接合する超音波接合装置にお
いて、上記金属板の上面とホーンとの接触部、お
よび金属板の下面とアンビルとの接触部を、それ
ぞれ冷却液で冷却する冷却手段を備えたことを特
徴とする超音波接合装置。
In an ultrasonic bonding apparatus that places metal plates to be bonded one on top of another on an anvil and pressurizes and bonds these metal plates from above with a horn that vibrates ultrasonically, a contact portion between the top surface of the metal plates and the horn; and an ultrasonic bonding apparatus characterized by comprising cooling means for cooling the contact portion between the lower surface of the metal plate and the anvil with a cooling liquid.
JP8941490U 1990-08-29 1990-08-29 Pending JPH0447880U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8941490U JPH0447880U (en) 1990-08-29 1990-08-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8941490U JPH0447880U (en) 1990-08-29 1990-08-29

Publications (1)

Publication Number Publication Date
JPH0447880U true JPH0447880U (en) 1992-04-23

Family

ID=31823373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8941490U Pending JPH0447880U (en) 1990-08-29 1990-08-29

Country Status (1)

Country Link
JP (1) JPH0447880U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07124761A (en) * 1993-11-08 1995-05-16 Kikuchi Press Kogyo Kk Ultrasonic welding method for aluminum sheet and the like
JPH07124762A (en) * 1993-11-08 1995-05-16 Kikuchi Press Kogyo Kk Method for welding parts to plate of aluminum and the like
WO2018062727A1 (en) * 2016-09-28 2018-04-05 주식회사 크레셈 Ultrasonic bonding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07124761A (en) * 1993-11-08 1995-05-16 Kikuchi Press Kogyo Kk Ultrasonic welding method for aluminum sheet and the like
JPH07124762A (en) * 1993-11-08 1995-05-16 Kikuchi Press Kogyo Kk Method for welding parts to plate of aluminum and the like
WO2018062727A1 (en) * 2016-09-28 2018-04-05 주식회사 크레셈 Ultrasonic bonding device

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