JPH044776U - - Google Patents
Info
- Publication number
- JPH044776U JPH044776U JP4498190U JP4498190U JPH044776U JP H044776 U JPH044776 U JP H044776U JP 4498190 U JP4498190 U JP 4498190U JP 4498190 U JP4498190 U JP 4498190U JP H044776 U JPH044776 U JP H044776U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- metal base
- layer
- buried
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4498190U JPH044776U ( ) | 1990-04-26 | 1990-04-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4498190U JPH044776U ( ) | 1990-04-26 | 1990-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH044776U true JPH044776U ( ) | 1992-01-16 |
Family
ID=31558763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4498190U Pending JPH044776U ( ) | 1990-04-26 | 1990-04-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH044776U ( ) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59210689A (ja) * | 1983-05-14 | 1984-11-29 | 松下電工株式会社 | 金属板ベ−スプリント配線板の製造法 |
-
1990
- 1990-04-26 JP JP4498190U patent/JPH044776U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59210689A (ja) * | 1983-05-14 | 1984-11-29 | 松下電工株式会社 | 金属板ベ−スプリント配線板の製造法 |