JPH044770U - - Google Patents

Info

Publication number
JPH044770U
JPH044770U JP4447290U JP4447290U JPH044770U JP H044770 U JPH044770 U JP H044770U JP 4447290 U JP4447290 U JP 4447290U JP 4447290 U JP4447290 U JP 4447290U JP H044770 U JPH044770 U JP H044770U
Authority
JP
Japan
Prior art keywords
shape
led chips
circuit board
printed circuit
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4447290U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4447290U priority Critical patent/JPH044770U/ja
Publication of JPH044770U publication Critical patent/JPH044770U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る発光表示素子の一実施例
を示す側面図、第２図は同正面図、第３図Ａ，Ｂ
，Ｃは同実施例素子の製作過程を示す展開図、斜
視図及び断面図である。 １……フレキシブルプリント基板、２……ＬＥ
Ｄチツプ、３……リード、４……樹脂ケース、５
……モールド樹脂。 FIG. 1 is a side view showing an embodiment of the light emitting display element according to the present invention, FIG. 2 is a front view of the same, and FIGS. 3A and B.
, C are a developed view, a perspective view, and a cross-sectional view showing the manufacturing process of the same example element. 1...Flexible printed circuit board, 2...LE
D chip, 3...Lead, 4...Resin case, 5
...Mold resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 所要形状のフレキシブルプリント基板に多数の
ＬＥＤチツプを実装するとともに、一対のリード
を取付け、これを円錐または角錐状にして透明樹
脂ケースに入れ、モールドしたことを特徴とする
発光表示素子。 A light-emitting display element characterized in that a large number of LED chips are mounted on a flexible printed circuit board having a desired shape, a pair of leads are attached, the shape is shaped into a cone or a pyramid, the shape is placed in a transparent resin case, and the LED chips are molded.
JP4447290U 1990-04-25 1990-04-25 Pending JPH044770U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4447290U JPH044770U (en) 1990-04-25 1990-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4447290U JPH044770U (en) 1990-04-25 1990-04-25

Publications (1)

Publication Number Publication Date
JPH044770U true JPH044770U (en) 1992-01-16

Family

ID=31557808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4447290U Pending JPH044770U (en) 1990-04-25 1990-04-25

Country Status (1)

Country Link
JP (1) JPH044770U (en)

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