JPH044766U - - Google Patents
Info
- Publication number
- JPH044766U JPH044766U JP1990044401U JP4440190U JPH044766U JP H044766 U JPH044766 U JP H044766U JP 1990044401 U JP1990044401 U JP 1990044401U JP 4440190 U JP4440190 U JP 4440190U JP H044766 U JPH044766 U JP H044766U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- semiconductor device
- resin
- die pad
- fitted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990044401U JPH044766U (Direct) | 1990-04-24 | 1990-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990044401U JPH044766U (Direct) | 1990-04-24 | 1990-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH044766U true JPH044766U (Direct) | 1992-01-16 |
Family
ID=31557670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990044401U Pending JPH044766U (Direct) | 1990-04-24 | 1990-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH044766U (Direct) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5197026U (Direct) * | 1975-01-27 | 1976-08-04 | ||
| JP2008124116A (ja) * | 2006-11-09 | 2008-05-29 | Denso Corp | 半導体装置 |
-
1990
- 1990-04-24 JP JP1990044401U patent/JPH044766U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5197026U (Direct) * | 1975-01-27 | 1976-08-04 | ||
| JP2008124116A (ja) * | 2006-11-09 | 2008-05-29 | Denso Corp | 半導体装置 |