JPH0446952A - Phenol resin molding material - Google Patents
Phenol resin molding materialInfo
- Publication number
- JPH0446952A JPH0446952A JP15607690A JP15607690A JPH0446952A JP H0446952 A JPH0446952 A JP H0446952A JP 15607690 A JP15607690 A JP 15607690A JP 15607690 A JP15607690 A JP 15607690A JP H0446952 A JPH0446952 A JP H0446952A
- Authority
- JP
- Japan
- Prior art keywords
- phenol resin
- molding material
- resin molding
- phenolic resin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 14
- 239000012778 molding material Substances 0.000 title claims description 12
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims abstract description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 9
- 229920001568 phenolic resin Polymers 0.000 claims description 9
- 239000011134 resol-type phenolic resin Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 3
- 229920003180 amino resin Polymers 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 239000004094 surface-active agent Substances 0.000 abstract description 2
- 229920003986 novolac Polymers 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000000314 lubricant Substances 0.000 abstract 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract 1
- 230000002787 reinforcement Effects 0.000 abstract 1
- 229920003987 resole Polymers 0.000 abstract 1
- 239000003973 paint Substances 0.000 description 8
- -1 methylol group Chemical group 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000010680 novolac-type phenolic resin Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000007592 spray painting technique Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は自動車部品用、電気機械部品用、ＯＡ事務機部
品用、電子部品用、音響機器部品用、熱器具部品用、食
器用等に用いられるフェノール樹脂成形材料に関するも
のである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is applicable to automobile parts, electromechanical parts, OA office machine parts, electronic parts, audio equipment parts, heating appliance parts, tableware, etc. This invention relates to the phenolic resin molding material used.
従来、フェノール樹脂成形材料から得られるフェノール
樹脂成形品を塗料によって塗装し、煮沸処理を施すと塗
膜と成形品素地との界面にフクレ、剥離を発生すること
がある。Conventionally, when a phenolic resin molded article obtained from a phenolic resin molding material is painted with a paint and subjected to a boiling treatment, blistering and peeling may occur at the interface between the paint film and the molded article base.
従来の技術で述べたようにフェノール樹脂成形品の塗料
密着性はあまりよくない。本発明は従来の技術における
上述の問題点に鑑みてなされたもので、その目的とする
ところは塗料密着性のよい成形品が得られるフェノール
樹脂成形材料を提供することにある。As described in the prior art section, the paint adhesion of phenolic resin molded products is not very good. The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a phenolic resin molding material that allows molded products with good paint adhesion to be obtained.
本発明は樹脂全量中２０〜１００重量％（以下単に％と
記す）のレゾール型フェノール樹脂を含有したことを特
徴とするフェノール樹脂成形材料のため、レゾール型フ
ェノール樹脂のメチロール基によって塗料密着性を向上
させることができたもので、以下本発明の詳細な説明す
る。The present invention is a phenolic resin molding material characterized by containing 20 to 100% by weight (hereinafter simply referred to as %) of a resol type phenolic resin based on the total amount of resin, and the methylol group of the resol type phenolic resin improves paint adhesion. The present invention will be described in detail below.
本発明に用いるレゾール型フェノール樹脂は、フェノー
ル、クレゾール等のフェノール系化合物とホルムアルデ
ヒド等のアルデヒド化合物とをアルカリ性下、フェノー
ル系化合物のモル比１に対してアルデヒド化合物のモル
比を１以上にして反応して得られるものであるが、エポ
キシ変性、メラミン変性、ユリア変性等の変性物であっ
てもよく、成形材料中の樹脂全量中２０〜１００％であ
ることが必要である。即ち２０％未満では塗料密着性が
向上しないからである。レゾール型フェノール樹脂以外
の樹脂としてはノボラック型フェノール樹脂、アミノ樹
脂、エポキシ樹脂等を用いられるがノボラック型フェノ
ール樹脂を用いることが好ましいが、ノボラック型フェ
ノール樹脂についてもエポキシ変性、メラミン変性、ユ
リア変性、キシレン変性等の変性物を用いることもでき
る、充填剤又は補強材としては木粉、布チップ、綿粉、
ガラス繊維、炭酸カルシウム、水酸化アルミニウム、ク
レー、タルク、シリカ等のような有機、無機物の繊維、
チップ、粉末を用いることができる。必要に応じて添加
される硬化剤、着色剤、離型剤、界面活性剤等について
は特に限定するものではなく、フェノール樹脂成形材料
に用い得るものをそのまま用いることができる。これら
配合材料を混合、混線、粉砕し、必要に応じて造粒し成
形材料とするものである。The resol-type phenolic resin used in the present invention is produced by reacting a phenol compound such as phenol or cresol with an aldehyde compound such as formaldehyde under alkaline conditions at a molar ratio of 1 or more of the aldehyde compound to 1 molar ratio of the phenol compound. However, it may be a modified product such as epoxy modification, melamine modification, urea modification, etc., and it is necessary that it accounts for 20 to 100% of the total amount of resin in the molding material. That is, if it is less than 20%, paint adhesion will not improve. As resins other than resol-type phenolic resins, novolac-type phenolic resins, amino resins, epoxy resins, etc. can be used, and it is preferable to use novolac-type phenolic resins, but novolac-type phenolic resins can also be epoxy-modified, melamine-modified, urea-modified, Modified substances such as xylene modification can also be used.As fillers or reinforcing materials, wood flour, cloth chips, cotton flour,
Organic and inorganic fibers such as glass fiber, calcium carbonate, aluminum hydroxide, clay, talc, silica, etc.
Chips and powder can be used. There are no particular limitations on the curing agent, coloring agent, mold release agent, surfactant, etc. that may be added as needed, and those that can be used in the phenolic resin molding material can be used as they are. These compounded materials are mixed, mixed, pulverized, and, if necessary, granulated to form a molding material.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例１乃至３と比較例１及び２
第１表の配合表にもとづいて配合、混線、粉砕してフェ
ノール樹脂成形材料を得た。Examples 1 to 3 and Comparative Examples 1 and 2 Phenol resin molding materials were obtained by blending, mixing, and pulverizing based on the formulation table in Table 1.
第
表
実施例１乃至３と比較例１及び２の成形材料を成形圧力
２２５ ｋｇ／ｃｄ、金型温度１６０°Ｃで２分間圧縮
成形して皿型成形品を得、次に該成形品表面をシンナー
で表面洗浄後、市販ウレタン塗料を吹付塗装し、１２０
°Ｃで３０分間焼付乾燥後、３日間２５°Ｃの室内に放
置してからゴバン目セロテープ試験として３０分間煮沸
後、１時間２５°Ｃの室内に放置してからゴバン目セロ
テープ試験を行なった。又、別に３日間２５°Ｃの室内
に放置後、２０時間煮沸して外観試験を行なった。その
結果は第２表のようである。The molding materials of Examples 1 to 3 and Comparative Examples 1 and 2 in Table 1 were compression molded for 2 minutes at a molding pressure of 225 kg/cd and a mold temperature of 160°C to obtain a dish-shaped molded product, and then the surface of the molded product was After cleaning the surface with thinner, spray painting with commercially available urethane paint,
After baking and drying at °C for 30 minutes, it was left in a room at 25 °C for 3 days, and then the cellophane tape test was carried out.After boiling for 30 minutes, it was left in a room at 25 °C for 1 hour, and then the cellotape test was carried out. . Separately, after being left in a room at 25°C for 3 days, it was boiled for 20 hours and an appearance test was conducted. The results are shown in Table 2.
第 ２ 表
〔発明の効果〕
本発明は上述した如く構成されている。特許請求の範囲
に記載した構成を有するフェノール樹脂成形材料におい
てはその成形品の塗料密着性が向上する効果がある。Table 2 [Effects of the Invention] The present invention is constructed as described above. The phenolic resin molding material having the structure described in the claims has the effect of improving the paint adhesion of the molded product.
Claims (1)
ノール樹脂を含有したことを特徴とするフェノール樹脂
成形材料。(1) A phenolic resin molding material containing 20 to 100% by weight of resol type phenolic resin based on the total amount of resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15607690A JPH0446952A (en) | 1990-06-14 | 1990-06-14 | Phenol resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15607690A JPH0446952A (en) | 1990-06-14 | 1990-06-14 | Phenol resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446952A true JPH0446952A (en) | 1992-02-17 |
Family
ID=15619783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15607690A Pending JPH0446952A (en) | 1990-06-14 | 1990-06-14 | Phenol resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446952A (en) |
-
1990
- 1990-06-14 JP JP15607690A patent/JPH0446952A/en active Pending
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