JPH0446591U - - Google Patents
Info
- Publication number
- JPH0446591U JPH0446591U JP8937290U JP8937290U JPH0446591U JP H0446591 U JPH0446591 U JP H0446591U JP 8937290 U JP8937290 U JP 8937290U JP 8937290 U JP8937290 U JP 8937290U JP H0446591 U JPH0446591 U JP H0446591U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electronic component
- terminal
- heat dissipation
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8937290U JPH0446591U (fr) | 1990-08-27 | 1990-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8937290U JPH0446591U (fr) | 1990-08-27 | 1990-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446591U true JPH0446591U (fr) | 1992-04-21 |
Family
ID=31823301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8937290U Pending JPH0446591U (fr) | 1990-08-27 | 1990-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446591U (fr) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001095687A1 (fr) * | 2000-06-06 | 2001-12-13 | Mitsubishi Denki Kabushiki Kaisha | Structure de refroidissement d'un dispositif de communication |
| JP2005159346A (ja) * | 2003-11-21 | 2005-06-16 | Lg Electronics Inc | 放熱装置を有する携帯端末機 |
| JP2011512025A (ja) * | 2008-01-18 | 2011-04-14 | ケイエムダブリュ インコーポレーテッド | プリント回路基板の装着方法 |
| JP2011091167A (ja) * | 2009-10-21 | 2011-05-06 | Yazaki Corp | 発熱部品収納体 |
| WO2021131672A1 (fr) * | 2019-12-24 | 2021-07-01 | 住友電装株式会社 | Boîte de connexion électrique |
-
1990
- 1990-08-27 JP JP8937290U patent/JPH0446591U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001095687A1 (fr) * | 2000-06-06 | 2001-12-13 | Mitsubishi Denki Kabushiki Kaisha | Structure de refroidissement d'un dispositif de communication |
| JP2005159346A (ja) * | 2003-11-21 | 2005-06-16 | Lg Electronics Inc | 放熱装置を有する携帯端末機 |
| JP2011512025A (ja) * | 2008-01-18 | 2011-04-14 | ケイエムダブリュ インコーポレーテッド | プリント回路基板の装着方法 |
| JP2011091167A (ja) * | 2009-10-21 | 2011-05-06 | Yazaki Corp | 発熱部品収納体 |
| WO2021131672A1 (fr) * | 2019-12-24 | 2021-07-01 | 住友電装株式会社 | Boîte de connexion électrique |
| JP2021103911A (ja) * | 2019-12-24 | 2021-07-15 | 住友電装株式会社 | 電気接続箱 |
| CN114788110A (zh) * | 2019-12-24 | 2022-07-22 | 住友电装株式会社 | 电接线盒 |