JPH0446568U - - Google Patents
Info
- Publication number
- JPH0446568U JPH0446568U JP1990089383U JP8938390U JPH0446568U JP H0446568 U JPH0446568 U JP H0446568U JP 1990089383 U JP1990089383 U JP 1990089383U JP 8938390 U JP8938390 U JP 8938390U JP H0446568 U JPH0446568 U JP H0446568U
- Authority
- JP
- Japan
- Prior art keywords
- film
- attached
- heat sink
- platinum
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990089383U JP2544761Y2 (ja) | 1990-08-27 | 1990-08-27 | 半導体レーザ用ヒートシンク |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990089383U JP2544761Y2 (ja) | 1990-08-27 | 1990-08-27 | 半導体レーザ用ヒートシンク |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0446568U true JPH0446568U (enFirst) | 1992-04-21 |
| JP2544761Y2 JP2544761Y2 (ja) | 1997-08-20 |
Family
ID=31823319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990089383U Expired - Lifetime JP2544761Y2 (ja) | 1990-08-27 | 1990-08-27 | 半導体レーザ用ヒートシンク |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2544761Y2 (enFirst) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101065076B1 (ko) * | 2005-05-07 | 2011-09-15 | 삼성전자주식회사 | 발광소자 패키지용 서브마운트 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02137389A (ja) * | 1988-11-18 | 1990-05-25 | Nec Corp | サブマウント及び光半導体装置 |
-
1990
- 1990-08-27 JP JP1990089383U patent/JP2544761Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02137389A (ja) * | 1988-11-18 | 1990-05-25 | Nec Corp | サブマウント及び光半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2544761Y2 (ja) | 1997-08-20 |