JPH0446542U - - Google Patents

Info

Publication number
JPH0446542U
JPH0446542U JP1990087943U JP8794390U JPH0446542U JP H0446542 U JPH0446542 U JP H0446542U JP 1990087943 U JP1990087943 U JP 1990087943U JP 8794390 U JP8794390 U JP 8794390U JP H0446542 U JPH0446542 U JP H0446542U
Authority
JP
Japan
Prior art keywords
bump
height
semiconductor device
insulating pillow
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990087943U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990087943U priority Critical patent/JPH0446542U/ja
Publication of JPH0446542U publication Critical patent/JPH0446542U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/012
    • H10W72/932
    • H10W72/934

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP1990087943U 1990-08-24 1990-08-24 Pending JPH0446542U (index.php)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990087943U JPH0446542U (index.php) 1990-08-24 1990-08-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990087943U JPH0446542U (index.php) 1990-08-24 1990-08-24

Publications (1)

Publication Number Publication Date
JPH0446542U true JPH0446542U (index.php) 1992-04-21

Family

ID=31820742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990087943U Pending JPH0446542U (index.php) 1990-08-24 1990-08-24

Country Status (1)

Country Link
JP (1) JPH0446542U (index.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005303314A (ja) * 2004-04-14 2005-10-27 Samsung Electronics Co Ltd バンプ構造を含む半導体素子及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005303314A (ja) * 2004-04-14 2005-10-27 Samsung Electronics Co Ltd バンプ構造を含む半導体素子及びその製造方法

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