JPH0444706U - - Google Patents

Info

Publication number
JPH0444706U
JPH0444706U JP1990086875U JP8687590U JPH0444706U JP H0444706 U JPH0444706 U JP H0444706U JP 1990086875 U JP1990086875 U JP 1990086875U JP 8687590 U JP8687590 U JP 8687590U JP H0444706 U JPH0444706 U JP H0444706U
Authority
JP
Japan
Prior art keywords
circuit board
semiconductor device
bonding
hybrid
bottom plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990086875U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990086875U priority Critical patent/JPH0444706U/ja
Publication of JPH0444706U publication Critical patent/JPH0444706U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W70/682
    • H10W72/884
    • H10W90/754

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
JP1990086875U 1990-08-20 1990-08-20 Pending JPH0444706U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990086875U JPH0444706U (cg-RX-API-DMAC10.html) 1990-08-20 1990-08-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990086875U JPH0444706U (cg-RX-API-DMAC10.html) 1990-08-20 1990-08-20

Publications (1)

Publication Number Publication Date
JPH0444706U true JPH0444706U (cg-RX-API-DMAC10.html) 1992-04-16

Family

ID=31818781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990086875U Pending JPH0444706U (cg-RX-API-DMAC10.html) 1990-08-20 1990-08-20

Country Status (1)

Country Link
JP (1) JPH0444706U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07305587A (ja) * 1994-05-13 1995-11-21 Sun Tec:Kk 掘削土砂圧密形オーガスクリュー

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07305587A (ja) * 1994-05-13 1995-11-21 Sun Tec:Kk 掘削土砂圧密形オーガスクリュー

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