JPH0444375U - - Google Patents
Info
- Publication number
- JPH0444375U JPH0444375U JP8603390U JP8603390U JPH0444375U JP H0444375 U JPH0444375 U JP H0444375U JP 8603390 U JP8603390 U JP 8603390U JP 8603390 U JP8603390 U JP 8603390U JP H0444375 U JPH0444375 U JP H0444375U
- Authority
- JP
- Japan
- Prior art keywords
- anode
- partition plate
- anode structure
- pitches
- cases
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 7
- 238000005192 partition Methods 0.000 claims description 5
- 239000011295 pitch Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第1図は本考案の一実施例を示す要部の外観斜
視図、第2図は同じくメツキ槽内への本陽極構造
を配設した場合を示す図、第3図は1組の陽極構
造を説明するための図、第4図は第3図に示した
陽極構造をメツキ槽に配設した場合を説明するた
めの図、第5図、第6図は従来例を示す図であつ
て、第5図は溶解性陽極を配設した場合および第
6図は不溶解性陽極を配設した場合を示すもので
ある。
1……メツキ槽、2……仕切板、4……メツキ
対象物、10……溶解性陽極、20……不溶解性
平板電極(陽極)、30……隔膜、100……陽
極構造、101……ケース、102……リブ体、
103……格子、104……スペーサ、108…
…開口部。
Figure 1 is a perspective view of the main parts of an embodiment of the present invention, Figure 2 is a diagram showing the present anode structure installed in a plating tank, and Figure 3 is a set of anode structures. FIG. 4 is a diagram for explaining the case where the anode structure shown in FIG. 3 is arranged in a plating tank, and FIGS. 5 and 6 are diagrams showing conventional examples. , FIG. 5 shows the case where a soluble anode is provided, and FIG. 6 shows the case where an insoluble anode is provided. DESCRIPTION OF SYMBOLS 1... Plating tank, 2... Partition plate, 4... Plating object, 10... Soluble anode, 20... Insoluble flat plate electrode (anode), 30... Diaphragm, 100... Anode structure, 101 ...Case, 102...Rib body,
103... Lattice, 104... Spacer, 108...
…Aperture.
Claims (1)
を有するメツキ装置において、 陽極構造を不溶解性陽極とこれを収容するケー
スとこのケースのメツキ対象物側開口部を塞ぐ隔
膜とから形成し、 仕切板を挟む両側ピツチ内に配設される陽極構
造の両ケースを当該仕切板を共用して形成し、隣
接する陽極構造を一体的に構成したことを特徴と
する不溶解性陽極を用いたメツキ装置。[Scope of Claim for Utility Model Registration] In a plating device having a plating tank in which the inside of the tank is divided into a plurality of pitches by partition plates, the anode structure includes an insoluble anode, a case housing the same, and an opening of the case on the side of the object to be plated. The two cases of the anode structure are formed from a diaphragm that closes the partition plate, and both cases of the anode structure are arranged in pitches on both sides sandwiching the partition plate, and the partition plate is used in common, and the adjacent anode structures are integrally formed. A plating device using an insoluble anode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8603390U JPH08376Y2 (en) | 1990-08-15 | 1990-08-15 | Plating equipment using insoluble anode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8603390U JPH08376Y2 (en) | 1990-08-15 | 1990-08-15 | Plating equipment using insoluble anode |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0444375U true JPH0444375U (en) | 1992-04-15 |
JPH08376Y2 JPH08376Y2 (en) | 1996-01-10 |
Family
ID=31817479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8603390U Expired - Lifetime JPH08376Y2 (en) | 1990-08-15 | 1990-08-15 | Plating equipment using insoluble anode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08376Y2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006511712A (en) * | 2002-12-23 | 2006-04-06 | メタケム ゲゼルシャフト ファー シュヒトヒェミー デル メタル エムベーハー | Anode for electroplating |
JP2009120938A (en) * | 2007-11-14 | 2009-06-04 | Samsung Electro Mech Co Ltd | Plating apparatus |
JP2009120939A (en) * | 2007-11-14 | 2009-06-04 | Samsung Electro Mech Co Ltd | Plating apparatus |
-
1990
- 1990-08-15 JP JP8603390U patent/JPH08376Y2/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006511712A (en) * | 2002-12-23 | 2006-04-06 | メタケム ゲゼルシャフト ファー シュヒトヒェミー デル メタル エムベーハー | Anode for electroplating |
JP2009120938A (en) * | 2007-11-14 | 2009-06-04 | Samsung Electro Mech Co Ltd | Plating apparatus |
JP2009120939A (en) * | 2007-11-14 | 2009-06-04 | Samsung Electro Mech Co Ltd | Plating apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPH08376Y2 (en) | 1996-01-10 |
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