JPH0444374U - - Google Patents
Info
- Publication number
- JPH0444374U JPH0444374U JP8603190U JP8603190U JPH0444374U JP H0444374 U JPH0444374 U JP H0444374U JP 8603190 U JP8603190 U JP 8603190U JP 8603190 U JP8603190 U JP 8603190U JP H0444374 U JPH0444374 U JP H0444374U
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- plated
- main body
- storage space
- body case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第１図は本考案の一実施例を示す外観斜視図、
第２図、第３図は従来のメツキ装置を示す図であ
つて、第２図は溶解性電極を採用した場合および
第３図は不溶解性電極を採用した場合である。
１……メツキ槽、５……メツキ対象物、１０…
…陽極構造、１１……本体ケース、１５……スペ
ーサ、１７……ボルト、２１……不溶解性電極、
３１……隔膜、４０……リブ体。
FIG. 1 is an external perspective view showing an embodiment of the present invention;
FIGS. 2 and 3 are diagrams showing conventional plating apparatuses, in which FIG. 2 shows a case in which a soluble electrode is employed, and FIG. 3 shows a case in which an insoluble electrode is employed. 1... plating tank, 5... plating object, 10...
... Anode structure, 11 ... Main body case, 15 ... Spacer, 17 ... Bolt, 21 ... Insoluble electrode,
31...diaphragm, 40...rib body.
Claims (1)
容空間を形成する本体ケースと、該収容空間内に
着脱可能に形成された不溶解性平板電極とから隔
膜電極を形成し、隔膜面を整数に仕切るとともに
前記メツキ対象物に向かつて突出するリブ体を隔
膜の外側から前記本体ケースに一体的に設けたこ
とを特徴とするメツキ装置の陽極構造。 A diaphragm electrode is formed from a main body case forming a storage space whose surface facing the object to be plated is closed with a diaphragm, and an insoluble flat plate electrode removably formed in the storage space. 1. An anode structure for a plating device, characterized in that a rib body partitioned into an integral number and projecting toward the object to be plated is integrally provided on the main body case from the outside of the diaphragm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8603190U JPH08375Y2 (en) | 1990-08-15 | 1990-08-15 | Anode structure of plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8603190U JPH08375Y2 (en) | 1990-08-15 | 1990-08-15 | Anode structure of plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0444374U true JPH0444374U (en) | 1992-04-15 |
| JPH08375Y2 JPH08375Y2 (en) | 1996-01-10 |
Family
ID=31817476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8603190U Expired - Lifetime JPH08375Y2 (en) | 1990-08-15 | 1990-08-15 | Anode structure of plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08375Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002521572A (en) * | 1998-07-30 | 2002-07-16 | ヴァルター ヒレブラント ゲーエムベーハー ウント コー． ガルヴァノテヒニーク | Alkaline plating bath for zinc-nickel bath |
| JP2014129591A (en) * | 2012-12-28 | 2014-07-10 | Samsung Electro-Mechanics Co Ltd | Electrolytic plating device |
-
1990
- 1990-08-15 JP JP8603190U patent/JPH08375Y2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002521572A (en) * | 1998-07-30 | 2002-07-16 | ヴァルター ヒレブラント ゲーエムベーハー ウント コー． ガルヴァノテヒニーク | Alkaline plating bath for zinc-nickel bath |
| JP4716568B2 (en) * | 1998-07-30 | 2011-07-06 | ヴァルター ヒレブラント ゲーエムベーハー ウント コー． ガルヴァノテヒニーク | Alkaline plating bath for zinc-nickel bath |
| JP2014129591A (en) * | 2012-12-28 | 2014-07-10 | Samsung Electro-Mechanics Co Ltd | Electrolytic plating device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08375Y2 (en) | 1996-01-10 |