JPH0444175U - - Google Patents
Info
- Publication number
- JPH0444175U JPH0444175U JP8621390U JP8621390U JPH0444175U JP H0444175 U JPH0444175 U JP H0444175U JP 8621390 U JP8621390 U JP 8621390U JP 8621390 U JP8621390 U JP 8621390U JP H0444175 U JPH0444175 U JP H0444175U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- wiring board
- large number
- printed wiring
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8621390U JPH0444175U (el) | 1990-08-16 | 1990-08-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8621390U JPH0444175U (el) | 1990-08-16 | 1990-08-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0444175U true JPH0444175U (el) | 1992-04-15 |
Family
ID=31817766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8621390U Pending JPH0444175U (el) | 1990-08-16 | 1990-08-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0444175U (el) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012508374A (ja) * | 2008-11-10 | 2012-04-05 | イートン コーポレーション | 一体化されたシールプレートを有する圧力感知用モジュール及び圧力感知用モジュールを組み立てる方法 |
-
1990
- 1990-08-16 JP JP8621390U patent/JPH0444175U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012508374A (ja) * | 2008-11-10 | 2012-04-05 | イートン コーポレーション | 一体化されたシールプレートを有する圧力感知用モジュール及び圧力感知用モジュールを組み立てる方法 |