JPH0443653A - Mold inline system - Google Patents

Abstract

PURPOSE:To obtain a fully automated mold press, attached control, and conveying robot system by connecting the control part of a mold press assembly, the control part of an attached apparatus, and the control part of a conveying robot using the same bus line so that both the mold press and the attached apparatus can operate based on a synchronous signal to be output from the control part of the conveying robot. CONSTITUTION:A system consists of a self-traveling conveying robot 7 that moves along a rail 71, a plurality of transfer mold press units 2 laid along the rail 71, a lead frame setting machine 3 for laying lead frames along a loading frame 11, and a gate break machine 6 for separating a product from a runner, wherein transfering a member between the mold press units 2 and attached apparatuses 3 and 6 is carried out via the conveying robot 7, while at the same time a control part 21 of the mold press 2, control parts 31 and 61 of the attached apparatuses 3 and 6, and a control part 72 of the conveying robot 7 are connected altogether using the same bus line 8 to transmit information between those control parts via the bus line 8, and wherein both the mold press units 2 and the attached apparatuses 3 and 6 are operated based on a synchronous signal to be output from the control part 72 of the conveying robot 7. With this, a system is obtained that can deal with fully automated work.

Description

[Detailed Description of the Invention] [Summary] Regarding manufacturing equipment for plastic packaged semiconductor devices, the work from supplying lead frames to gate breaking can be completely automated, and it is possible to reduce installation space and improve equipment operating rate. The aim is to provide a transfer mold in-line system that uses a transfer robot that runs on its own along rails laid on the floor, multiple transfer mold presses placed along the rails, and multiple transfer mold presses that are shared by multiple transfer mold presses. It consists of a set of auxiliary equipment, namely a lead frame setting machine that arranges lead frames on a loading frame, and a gate break machine that separates the molded product from the runner.1, a mold press and auxiliary equipment. In addition, the control section of the mold press, the control section of the auxiliary equipment, and the control section of the transfer robot are connected to the same bus line, so that information is transmitted between each control section. The mold press and auxiliary equipment are configured to operate based on a synchronization signal that is transmitted via a bus line and output from the control unit of the transfer robot.

[Industrial application field]

The present invention relates to manufacturing equipment for plastic packaged semiconductor devices, and particularly to a mold in-line system that completely automates operations from supplying lead frames to gate breaking.

In the molding process of a plastic package type semiconductor device, if human intervention is required in the lead frame supply process, resin supply process, gate break process, etc., there is a problem that not only a large amount of labor is required, but also the quality varies widely. Therefore, there is a need for a mold inline system that completely automates the process from supplying lead frames to gate breaking.

[Prior Art] FIG. 2 is a diagram for explaining a molding process for a semiconductor device, and FIG. 3 is a plan view showing an example of a conventional resin mold system.

As shown in Figure 2(a), the molding process of a plastic package type semiconductor device includes: ■ Lead frame setting process, ■ Lead frame supply process, ■ Preheating process,
Consisting of ■tablet loading process, ■molding process, and ■gate breaking process, the lead frame setting process consists of a plurality of lead frames 12 each having a semiconductor chip mounted on a loading frame 11, as shown in FIG. 2 (1)). The lead frame supplying process transfers the arranged lead frames 12 to the loading frame 1.
1 and attached to the transfer mold press.

In the preheating step, a predetermined amount of thermosetting resin is preheated with a preheater to form a tablet, and in the tablet loading step, the tablet is loaded into a transfer mold press. In the molding process, the mold is closed, a viscous molten thermosetting resin is injected into the mold, and molding is performed to cover the semiconductor chip 13 with the resin 14 as shown in FIG. 2(C). The molded semiconductor devices are taken out together with the loading frame, but as shown in FIG. 2(d), the semiconductor devices 15 immediately after being molded are connected to the runners 17 via the gates 6, respectively.
In the gate breaking step, the semiconductor device 15 is separated from the runner 17.

Previously, lead frames were set and supplied manually, but as the number of semiconductor devices that are molded with one injection of resin has increased, it has become increasingly difficult to attach lead frames to transfer mold presses. This increases the downtime of the transfer mold press and reduces the operating rate. Furthermore, in the past, the preheating of the resin and the injection of tablets were carried out manually, but the quality of the molded semiconductor devices tends to vary due to fluctuations in the preheating time of the resin and the time J1 is introduced into the transfer mold press.

Furthermore, the gate break to separate the semiconductor device from the runner was conventionally performed manually, but if the semiconductor device is molded with one resin injection and consists of multiple manufacturing lofts, the order of separation and the storage location of the separated semiconductor device may be difficult. may change from time to time, and semiconductor devices from different manufacturing processes may be mixed together, making lot management impossible.

Therefore, recent resin mold systems (i: as shown in Figure 3, a lead frame setting machine 3 that automatically arranges lead frames in a loading frame around the transfer mold press 2, and a pre-set amount of resin using a brake heater) are used. At the same time, a tablet feeder 5 that feeds the tufflets into the mold press and a gate break machine 6 that separates the molded semiconductor bag 1 from the runner are installed to reduce the manpower required for molding and to stabilize quality. We are trying to make this happen.

[Problem to be solved by the invention]

However, in the conventional resin molding system shown in FIG. 3, the lead frame supply process and the work of taking out the molded semiconductor device from the transfer mold press together with the loading frame and transferring it to the gate breaking machine are performed manually.

Further, each transfer mold press requires one lead frame setting machine, one preheater, one tablet feeding machine, and one gate breaking machine, and a large space must be prepared in order to arrange them. Moreover, there was a problem in that the lead frame setting machine and the gate breaking machine had to wait for a long time, which hindered the improvement of the overall operating rate of the equipment.

An object of the present invention is to provide a transfer mold in-line system that completely automates the work from supplying lead frames to gate breaking, and also makes it possible to reduce installation space and improve equipment operating efficiency.

[Means for Solving the Problems] FIG. 1 is a plan view showing a mold in-line system according to the present invention. The same objects are represented by the same symbols throughout the plan.

The above-mentioned problem is a transfer robot 7 that runs on its own along a rail 71 laid on the floor, a plurality of transfer mold presses 2 arranged along the rail 71, and a set of incidental objects shared by the plurality of transfer mold presses 2. equipment, i.e.
It is composed of a lead frame setting machine 3 that arranges lead frames on a loading frame 11, and a gate break machine 6 that separates the molded product from the runner, and transfers parts between the mold press 2 and ancillary equipment 3.6. is carried out via the transfer robot 7, and the control unit 21 of the mold press 2 and the control unit 3 of the auxiliary device 3.6
1.61 and the control unit 72 of the transfer robot 7 are connected to the same bus line 8, information is transmitted between each control unit via the bus line 8, and information is output from the control unit 72 of the transfer robot 7. This is achieved by the mold-in-line system of the present invention, in which the mold press 2 and the auxiliary equipment 3.6 operate based on synchronization signals.

[For production]

In Fig. 1, there is a transport robot that runs on its own along a rail laid on the floor, and a plurality of robots arranged along the rail.
A transfer mold press and a set of auxiliary equipment shared by multiple transfer mold presses, namely a lead frame setting machine that arranges lead frames on a loading frame, and a gate break machine that separates a molded product from a runner. 1, the parts are transferred between the mold press and the auxiliary equipment via a transfer robot, and the control unit of the mold press, the control unit of the auxiliary equipment, and the control unit of the transfer robot are connected to the same bus line. With the mold in-line system of the present invention, information is transmitted between each control section via a bus line, and the mold press and ancillary devices operate based on a synchronization signal output from the control section of the transfer robot. It is possible to realize a transfer mold inline system that completely automates the work from lead frame supply to gate breaking, reduces installation space, and improves equipment operating efficiency.

(Example〕 Embodiments of the present invention will be described below with reference to the accompanying drawings.

The mold in-line system according to the present invention is shown in FIG.
), a transfer robot 7, two transfer mold presses 2, and ancillary equipment, namely, a lead frame setting machine 3 that arranges lead frames on a loading frame 11, and a preset amount of resin placed on a brake heater 4.
At the same time, the preheated resin is placed in the mold press 2.
A tablet feeder 5 supplies the molded product to the runner, and a gate breaker 6 separates the molded product from the runner.

The transport robot 7, which is self-propelled along a rail 71 laid on the floor, is controlled by a signal output from a control unit 72 provided at the center of the rail 71.

The robot 7 also has a movable arm 73 that rotates in the horizontal direction and moves forward and backward in response to signals from the control unit 72. The chuck mechanism 74 provided at both ends of the movable arm 73
The loading frame 11 on which the lead frames are arranged is gripped and held by the signal from.

The two transfer mold presses 2 are arranged at both ends of the rail 71, and a dedicated breech heater 4 and a tablet feeder 5 are installed adjacent to each transfer mold press 2. Also, a lead frame setting machine 3 equipped with two stages 32 and 33,
A gate breaking machine 6 with stages 62 and 63 is arranged in the center of the rail 71.

The first stage 32 of the lead frame setting machine 3 corresponds to one transfer mold press 2, the second stage 33 corresponds to the other transfer mold press 2, and the first stage 62 of the gate break IgG corresponds to one transfer mold press 2. The second stage 63 corresponds to the other transfer mold press 2 .

Further, the mold in-line system according to the present invention is as shown in FIG.
, and the control section 72 of the transfer robot 7 are connected to the same bus line 8, and information is transmitted between each control section via the bus line 8, and the synchronization information output from the control section 72 of the transfer robot 7 is connected to the same bus line 8. Based on the signal, the mold brace 2 and the accessory device 3.4.5.6 are configured to operate.

The operation of such a mold in-line system will be explained in detail with reference to FIG.

■Lead frame setting process: The lead frame setting machine 3 arranges a plurality of lead frames on the loading frame 11 based on the synchronization signal output from the control section 72, and transfers them to the first stage 32 or the second stage. 33.

■Lead frame supply process: The wt feeding robot 7 moves by itself to the front of the lead frame setting machine 3, and when it reaches the front of the lead frame setting machine 3, the movable arm 73 moves forward and the chuck mechanism 74 arranges the lead frames. The loaded frame 11 is grasped and held. When the chuck mechanism 74 grips the loading frame 11, the movable arm 73 retreats,
The transfer robot 7 travels toward the transfer mold press 2.

When the transfer robot 7 arrives in front of the transfer mold bus 1/2, the movable arm 73 rotates and advances simultaneously, the empty chuck mechanism 74 grips the loading frame 11, and transfers the molded semiconductor device to the transfer mold. Take it out from bracelet 2.

After that, the movable arm 73 rotates 180 degrees and moves forward at the same time to transfer the loading frame 1 on which the lead frames before molding are arranged to the transfer mold brace 2.
Set to 1. When the loading frame 11 is set, the transfer mold press 2 closes the mold die 22 based on the synchronization signal output from the control section 72.

■Tablet feeding process: Tablen j/feeding machine 5 feeds a predetermined amount of resin into break heater 4 and preheats it for a predetermined time according to the synchronization signal output from control unit 72, and mold die 22 closes. The tablet 18 formed by preheating the resin is taken out from the break heater 4 and placed into the transfer mold press 2. When the tough left 18 is inserted, the transfer mold press 2 starts molding and injects the thermosetting resin melted into a sticky liquid into the mold die 22.

■K+-y□Lake T culm: Loading Freno, 1
1 to transfer mold breath 2]・Then,
The transfer robot 7 self-propels toward the gate break machine 6, and when it arrives in front of the gate break machine 6, the movable arm 73 moves forward and the chuck mechanism 74 opens, and the molded semiconductor device and the loading frame 11 are transferred to the stage 62. Or place it on the 63rd table.

The gate breaking machine 6 takes out the molded semiconductor devices according to a predetermined order, cuts the gates, and arranges them in a predetermined container. Return to

In this way, a transfer robot that moves by itself along the rails laid on the floor, multiple transfer mold presses and auxiliary equipment, namely a lead frame setting machine that arranges lead frames on a loading frame, and a preset amount of It consists of a tablet feeder that feeds the resin into the breaker heater and supplies preheated resin to the mold press, and a gate break machine that separates the molded product from the runner. The mold in-line system of the present invention, in which the transfer of lead frames is carried out via a transfer robot, can completely automate the work from supplying lead frames to gate breaking.

In addition, each lead frame setting machine and gate breaking machine can be shared by multiple transfer mold presses, reducing equipment installation space and improving equipment operating efficiency. In other words, it is possible to realize a transfer mold in-line system that completely automates the work from supplying lead frames to gate breaking, reduces installation space, and improves equipment operating efficiency.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to provide a transfer mold in-line system that completely automates the work from supplying lead frames to gate breaking, and also makes it possible to reduce installation space and improve equipment operating efficiency. .

[Brief explanation of the drawing]

Fig. 1 is a plan view showing a mold in-line system according to the present invention, Fig. 2 is a view for explaining the molding process of a semiconductor device, and Fig. 3 is a plan view showing an example of a conventional resin mold system. be. In the figure, 2 is a transfer mold press, 3 is a lead frame 1, a center machine, 4 is a preheater, 5 is a tablet supply machine, 6 is a gate break machine, 7 is a transfer robot, 8 is a bus line, 18 is a tablet, 11 is a loading frame; 21.31.41.51.61.72 is a control unit; 32.
33, 62, and 63 represent a stage, 22 a mold, 71 a rail, 73 a movable arm, and 74 a chuck mechanism, respectively. Fumen Yumachi Goro Mall Toy Line System Begging Mi 1-
〒Fig. 4 rows of the conventional wood-rut system''& ,T = pressure surface same number 3 Fig. Semi-conductor I ink over! mold HJ Sugi-ko] presentation
V) Figure 2

Claims (1)

[Claims] 1) A transport robot (7) that runs on its own along a rail (71) laid on the floor, and a plurality of transfer mold presses (2) arranged along the rail (71). , and a set of auxiliary devices (3, 6) shared by the plurality of transfer mold presses (2), and is configured to transfer members between the mold press (2) and the auxiliary devices (3, 6). , a mold in-line system characterized in that the molding is carried out via the transfer robot (7). 2) The auxiliary equipment includes a lead frame setting machine (3) for arranging lead frames on a loading frame (11), and a gate breaking machine (6) for separating a molded product from a runner. Mold inline system. 3) The control unit (21) of the mold press (2), the control unit (31, 61) of the auxiliary equipment (3, 6), and the control unit (72) of the transfer robot (7) are on the same bus line. (8), and information transmission between each control unit is performed via the bus line (8), and based on a synchronization signal output from the control unit (72) of the transfer robot (7). , the mold press (2) and the ancillary equipment (3, 6) operate.