JPH0443486U - - Google Patents
Info
- Publication number
- JPH0443486U JPH0443486U JP1990085919U JP8591990U JPH0443486U JP H0443486 U JPH0443486 U JP H0443486U JP 1990085919 U JP1990085919 U JP 1990085919U JP 8591990 U JP8591990 U JP 8591990U JP H0443486 U JPH0443486 U JP H0443486U
- Authority
- JP
- Japan
- Prior art keywords
- galvanometer
- temperature
- unit
- processing
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000010355 oscillation Effects 0.000 claims description 3
Landscapes
- Mechanical Optical Scanning Systems (AREA)
Description
第１図は本考案の一実施例のレーザ加工装置の
側面図、第２図ａは第１図に示す加工物のガルバ
ノ温度補正前の上面図、第２図ｂは第１図に示す
加工物のガルバノ温度補正後の上面図、第３図は
従来例のレーザ加工装置の側面図である。
１……レーザ発振部、２……レーザビーム、３
ａ……ガルバノメータ（Ｘ軸用）、３ｂ……ガル
バノメータ（Ｙ軸用）、４……ガルバノコントロ
ール部、５……温度トリガー部、６……画像処理
部、７……フラツシユランプ、８……レーザロツ
ド、９……ＴＶカメラ、１０……可視光、１１…
…ダイクロイツクミラー、１２……被加工物、１
３……加工目標点、１４……補正前ビーム加工点
、１５……補正後ビーム加工点、１６……ガルバ
ノ温度ドリフト（Ｘｄ，Ｙｄ）。
Fig. 1 is a side view of a laser processing device according to an embodiment of the present invention, Fig. 2a is a top view of the workpiece shown in Fig. 1 before galvano temperature correction, and Fig. 2b is the processing shown in Fig. 1. A top view of the object after galvano temperature correction, and FIG. 3 is a side view of a conventional laser processing apparatus. 1... Laser oscillation section, 2... Laser beam, 3
a... Galvanometer (for X axis), 3b... Galvanometer (for Y axis), 4... Galvano control section, 5... Temperature trigger section, 6... Image processing section, 7... Flash lamp, 8... ...Laser rod, 9...TV camera, 10...Visible light, 11...
... Dichroic mirror, 12 ... Workpiece, 1
3... Processing target point, 14... Beam processing point before correction, 15... Beam processing point after correction, 16... Galvano temperature drift (Xd, Yd).
Claims (1)
の進行方向を変化させるガルバノメータと、 加工目標点の位置データを記憶し、前記加工目
標点の位置データにより前記ガルバノメータを制
御するガルバノコントロール部と、 前記ガルバノメータの温度を測定し、ある一定
の変動幅を越えたときにトリガー信号を発する温
度トリガー部と、 前記温度トリガー部より発せられた前記トリガ
ー信号を受け、加工点の画像認識を行い、加工目
標とのずれを検出し、前記ガルバノコントロール
部の位置データに補正を与える画像処理部とを有
することを特徴とするガルバノ温度ドリフト自己
補正機能付きレーザ加工装置。[Claims for Utility Model Registration] A laser oscillation unit; a galvanometer that changes the traveling direction of a laser beam emitted from the laser oscillation unit; a galvanometer that stores position data of a processing target point; a galvanometer control unit that controls the galvanometer; a temperature trigger unit that measures the temperature of the galvanometer and issues a trigger signal when the temperature exceeds a certain fluctuation range; and receives the trigger signal issued from the temperature trigger unit; A laser processing apparatus with a galvano temperature drift self-correction function, comprising an image processing section that performs image recognition of a processing point, detects a deviation from a processing target, and provides correction to position data of the galvano control section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990085919U JPH0443486U (en) | 1990-08-15 | 1990-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990085919U JPH0443486U (en) | 1990-08-15 | 1990-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0443486U true JPH0443486U (en) | 1992-04-13 |
Family
ID=31635290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990085919U Pending JPH0443486U (en) | 1990-08-15 | 1990-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0443486U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003290944A (en) * | 2002-04-04 | 2003-10-14 | Mitsubishi Electric Corp | Laser beam machining apparatus |
| JP2007021507A (en) * | 2005-07-12 | 2007-02-01 | Mitsubishi Electric Corp | Laser beam machining apparatus |
| JP2014054671A (en) * | 2007-06-25 | 2014-03-27 | Electro Scientific Industries Inc | System and method for adapting parameter so as to enhance throughput during wafer processing of laser base |
| JP2018161676A (en) * | 2017-03-27 | 2018-10-18 | パナソニックＩｐマネジメント株式会社 | Laser machining device |
-
1990
- 1990-08-15 JP JP1990085919U patent/JPH0443486U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003290944A (en) * | 2002-04-04 | 2003-10-14 | Mitsubishi Electric Corp | Laser beam machining apparatus |
| JP2007021507A (en) * | 2005-07-12 | 2007-02-01 | Mitsubishi Electric Corp | Laser beam machining apparatus |
| JP4664761B2 (en) * | 2005-07-12 | 2011-04-06 | 三菱電機株式会社 | Laser processing equipment |
| JP2014054671A (en) * | 2007-06-25 | 2014-03-27 | Electro Scientific Industries Inc | System and method for adapting parameter so as to enhance throughput during wafer processing of laser base |
| JP2018161676A (en) * | 2017-03-27 | 2018-10-18 | パナソニックＩｐマネジメント株式会社 | Laser machining device |
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