JPH0442732U - - Google Patents
Info
- Publication number
- JPH0442732U JPH0442732U JP1990083644U JP8364490U JPH0442732U JP H0442732 U JPH0442732 U JP H0442732U JP 1990083644 U JP1990083644 U JP 1990083644U JP 8364490 U JP8364490 U JP 8364490U JP H0442732 U JPH0442732 U JP H0442732U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- case
- metal electrode
- adhesive applied
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/877—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990083644U JPH0442732U (enExample) | 1990-08-09 | 1990-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990083644U JPH0442732U (enExample) | 1990-08-09 | 1990-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0442732U true JPH0442732U (enExample) | 1992-04-10 |
Family
ID=31631480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990083644U Pending JPH0442732U (enExample) | 1990-08-09 | 1990-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442732U (enExample) |
-
1990
- 1990-08-09 JP JP1990083644U patent/JPH0442732U/ja active Pending