JPH0441090A - Laser drilling method - Google Patents
Laser drilling methodInfo
- Publication number
- JPH0441090A JPH0441090A JP2146221A JP14622190A JPH0441090A JP H0441090 A JPH0441090 A JP H0441090A JP 2146221 A JP2146221 A JP 2146221A JP 14622190 A JP14622190 A JP 14622190A JP H0441090 A JPH0441090 A JP H0441090A
- Authority
- JP
- Japan
- Prior art keywords
- drilling
- mixture
- laser beam
- hollow body
- turbine blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005553 drilling Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000008187 granular material Substances 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 238000002844 melting Methods 0.000 claims abstract description 11
- 230000008018 melting Effects 0.000 claims abstract description 10
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 239000000126 substance Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 abstract description 3
- 238000000149 argon plasma sintering Methods 0.000 abstract description 2
- 235000013871 bee wax Nutrition 0.000 abstract 1
- 239000012166 beeswax Substances 0.000 abstract 1
- 238000012856 packing Methods 0.000 abstract 1
- 238000003754 machining Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 206010030113 Oedema Diseases 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の目的コ
(産業上の利用分野)
本発明はレーザ穴あけ方法に係り、特に中空体の穴あけ
加工に関する。DETAILED DESCRIPTION OF THE INVENTION [Purpose of the Invention (Industrial Application Field) The present invention relates to a laser drilling method, and particularly to drilling of a hollow body.
(従来の技術)
レーザで中空体の穴あけを行う場合に問題とされるのは
、穴あけ時に発生する加工屑に対する処置である。この
加工屑は加工中に中空体の内面に付着したり、あるいは
すでに対向側に開けられた微小の穴を塞いでしまうこと
がある。このことに対処するため、たとえば特開昭51
−133896号公報に開示されたものか知られている
。すなわち、この開示技術においては、中空体内に棒な
との遮蔽体を挿入し加工屑による不具合を防ぐことを従
来技術として取り上げ、この技術では遮蔽体かレーザて
二次加工されて加工屑か発生し、対処前と同様な不具合
か生じるため、第3図に示すような技術を提案している
。第3図において、(10)はたとえば断面円形をなす
小径パイプの被加工物で、これに所定の距離を隔てて集
光レンズ(I)か配置されている。一方、レーザ発振装
置(図示せず)からレーザ光(12)か照射されており
、このレーザ光(12)は集光レンズ(11)を介(2
て被加工物(10)の加工部に穴あけすべき穴(13)
に応じた大きさで集光して照射される。また、被加工物
(10)の内側には、この被加工物(10)に穴(13
)をあけたレーザ光(12)を通過させる入射口部(1
4a)か形成され、また、この入射口部(14a)を通
過したレザ光を可能な範囲でてきるだけ遠くて受けるよ
うに管状の挿入物(14)が挿入されている。レ−サ穴
あけ加工では、加工屑は挿入物(14)の内面に付着し
、上記不具合はなくなる。しかし、管状のようないわゆ
る成形体か挿入できない場合もある。第4図は特開昭6
]、−199590号公報に開示された他の従来例で
、管体(20)を溶断するにあたり、管体(20)の内
側に、その上部に空間を存在させて耐火性材料の粒状物
(21)を充填し、溶断線に沿ってたとえばレーザ光な
どのビーム(22)を照射して溶断するようにした技術
である。(Prior Art) When drilling holes in a hollow body using a laser, a problem is how to deal with processing waste generated during drilling. This machining debris may adhere to the inner surface of the hollow body during machining, or may close the minute holes that have already been drilled on the opposite side. To deal with this, for example,
The method disclosed in Japanese Patent No. 133896 is known. That is, in this disclosed technology, a shielding body such as a rod is inserted into a hollow body to prevent problems caused by machining debris as a conventional technique, and in this technology, the shielding body is subjected to secondary processing using a laser and machining debris is generated. However, since the same problem as before the countermeasure occurs, we propose the technique shown in Fig. 3. In FIG. 3, the workpiece (10) is, for example, a small-diameter pipe with a circular cross section, and a condenser lens (I) is arranged at a predetermined distance from the workpiece. On the other hand, a laser beam (12) is irradiated from a laser oscillation device (not shown), and this laser beam (12) passes through a condensing lens (11).
Hole (13) to be drilled in the machining part of the workpiece (10)
The light is focused and irradiated with a size corresponding to the size. Further, a hole (13) is provided inside the workpiece (10).
) through which the laser beam (12) passes.
4a) is formed, and a tubular insert (14) is inserted to receive the laser light passing through the entrance portion (14a) as far away as possible. In the laser drilling process, processing waste adheres to the inner surface of the insert (14), eliminating the above-mentioned problem. However, there are cases where so-called molded bodies such as tubular bodies cannot be inserted. Figure 4 is JP-A No. 6
], In another conventional example disclosed in Japanese Patent No. 199590, when the tube (20) is cut by melting, a space is created inside the tube (20) above the tube body (20), and the particles of the refractory material ( 21) and irradiates a beam (22), such as a laser beam, along the fusing line to fuse it.
(発明が解決しようとする課題)
粒状体を用いているため、中空体の内側形状に制約され
な(なったか、中空体の全体にわたって複数の穴をあけ
る加工では既に開けた穴から粒状体が流れだし、充填し
た粒状体の不足から加工屑か中空体内面に付着してしま
う不具合か生じていた。(Problem to be solved by the invention) Since granules are used, there is no restriction on the inner shape of the hollow body (or rather, in the process of drilling multiple holes throughout the hollow body, the granules are removed from the holes that have already been drilled). There was a problem in which processing debris adhered to the inner surface of the hollow body due to a lack of filled granules.
本発明はこのような不具合を解消するためになされたも
ので、複数の穴を中空体全体にわたり、加工中加工屑が
中空体内面に付着することなく穴あけ加工できるレーザ
穴あけ方法を提供することを目的としたものである。The present invention has been made in order to eliminate such problems, and it is an object of the present invention to provide a laser drilling method that can drill multiple holes throughout the hollow body without causing machining debris to adhere to the inner surface of the hollow body. This is the purpose.
[発明の構成]
(課題を解決するための手段と作用)
中空体の外面にレーザ光を照射し上記中空体に穴明けを
行うレーザ穴あけ方法において、上記中空体の内側に上
記レーザ光を散乱させる粒状体を低融点物質内に分散さ
せた混合物を充填して上記照射を行うようにしたもので
、レーザ光の照射を受けた部分が液状化しレーザ光を散
乱させる。[Structure of the invention] (Means and effects for solving the problem) In a laser drilling method for drilling a hole in the hollow body by irradiating the outer surface of the hollow body with a laser beam, the laser beam is scattered inside the hollow body. The above irradiation is carried out by filling a mixture in which granular materials are dispersed in a low melting point substance, and the portion irradiated with the laser light liquefies and scatters the laser light.
(実施例) 以下、実施例を示す図面に基いて本発明を説明する。(Example) EMBODIMENT OF THE INVENTION Hereinafter, this invention will be explained based on drawing which shows an Example.
第1図は本発明の一実施例で、タービンブレードの穴あ
けに適用した例である。すなわち、(30)は被加工物
である中空体形状のタービンブレードで内部には密層、
水腫あるいはパラフィンなどの低融点物質(31)に光
散乱性の粒状体(32)を混合した混合物が充填されて
いる。混合比は本実施例では低融点物質(3INに対し
て粒状体(32) 3程度の割合としたか、この混合比
は粒状体の比率の大きい方が望ましいものの、レーザ光
が常に粒状体(32)に当るような分散であればよい。FIG. 1 shows an embodiment of the present invention, which is applied to drilling holes in turbine blades. In other words, (30) is a hollow body-shaped turbine blade which is a workpiece and has a dense layer inside.
A mixture of light-scattering granules (32) mixed with a low-melting substance (31) such as edema or paraffin is filled. In this example, the mixing ratio was set to be about 3 parts of the granules (32) to 3 INs of the low melting point substance.Although it is desirable that the ratio of the particulates be larger, the laser beam always 32) may be used.
(33)は所定の場所に設置されたパルスレーサ発振器
で、出力したパルスレーザ光(34)は折返しミラー(
35)および集光レンズ(36)を介してタービンブレ
ード(30)の外面に集光されるようになっている。タ
ービンプレート(30)はXY子テーブル37)上に設
置された電磁チャック(38)に固定されている。XY
子テーブル37)のX駆動源(38)およびY駆動源(
39)は走査制御部(40)の制御信号でそれぞれ駆動
するようになっている。また、折返しミラー(35)は
角度自在に支持されていて、図示せぬ駆動体によって所
定の角度に設定されるようになっている。なお、上記粒
状体(32)の粒径はタービンブレード(30)の中空
部を密に充填する大きさであればよく、普通は数百〜数
十μmの粒径から選ばれ、その材質はパルスレーザ光(
34)がYAGレーレー場合は、アルミナセラミックス
、石英等から選ばれ、CO21ノーザの場合では塩化力
リュウム、塩化亜鉛等の結晶体から選ばれる。(33) is a pulse laser oscillator installed at a predetermined location, and the output pulse laser beam (34) is reflected by a folding mirror (
35) and a condensing lens (36), the light is focused onto the outer surface of the turbine blade (30). The turbine plate (30) is fixed to an electromagnetic chuck (38) installed on the XY child table 37). XY
X drive source (38) and Y drive source (child table 37)
39) are each driven by a control signal from a scan control section (40). Further, the folding mirror (35) is supported so as to be angular, and is set at a predetermined angle by a driver (not shown). The particle size of the granules (32) need only be large enough to densely fill the hollow part of the turbine blade (30), and is usually selected from a particle size of several hundred to several tens of μm, and the material thereof is Pulsed laser light (
34) is selected from alumina ceramics, quartz, etc. in the case of YAG relay, and in the case of CO21 noser, it is selected from crystals of rhium chloride, zinc chloride, etc.
上記混合物を常温から加熱してタービンブレー)”(3
0)内に流し込んだ後、再度常温に戻して固化した後、
タービンプレート(30)に対する穴あけ角度を所定値
に固定してパルスレーザ光(34)を照射し穴あけ加工
を行う。この照射で穴(41)かあくと同時に、穴(4
1)をあけたパルスレーザ光(34)か充填された混合
物を瞬時的に照射する。混合物に照射されたパルスレー
ザ光(34)は混合物内の粒状体(32)で散乱し、急
速にエネルギ密度か低下してしまう一方、粒状体(32
)自体は光を吸収し、高温状態になる。また、同時に低
融点物質(31)は−気に蒸発し、その蒸気は加工され
た穴(41)から急激に噴出する。穴(41)はXY子
テーブル37)の駆動で所定位置に次々にあけられる。Heat the above mixture from room temperature to
0) After pouring it into the container, returning it to room temperature and solidifying it,
The drilling angle with respect to the turbine plate (30) is fixed at a predetermined value and the pulsed laser beam (34) is irradiated to perform drilling. With this irradiation, the hole (41) is simultaneously opened and the hole (4
1) The filled mixture is instantaneously irradiated with a pulsed laser beam (34) in the opening. The pulsed laser beam (34) irradiated on the mixture is scattered by the granules (32) in the mixture, and the energy density rapidly decreases, while the granules (32)
) itself absorbs light and becomes hot. At the same time, the low melting point substance (31) is evaporated into air, and the vapor is suddenly ejected from the machined hole (41). The holes (41) are successively drilled at predetermined positions by driving the XY child table 37).
なお、被加工物は上記実施例以外の中空体に適用できる
ことはいうまでもない。It goes without saying that the workpiece may be a hollow body other than the above embodiments.
[発明の効果コ
粒状体の散乱作用でパルスレーザ光(34)のエネルギ
密度が低下するため、中空体内面が損傷することはない
。また、低融点物質(31)の噴出により穴の中から穴
あけ時に発生した加工屑が外部に一気に排除された。こ
のようなことから、集光レンズ(36)を焦点深度の大
きいものににすることができ、パルスレーザ光(34)
の集束距離が長くなり、穴の両端の開口がほぼ同径のい
わゆる平行性か良好で、しかも加工屑の付着のないすっ
きりした穴を形成することができるようになった。さら
に、低融点物質(31)と粒状体(32)の混合物はパ
ルスレザ光(34)が照射されない限り固化しているた
め、既に加工された穴を下側にした場合でも、粒状体(
32)がこの穴から流れだすことがないので、たとえば
第2図に示すようなタービンブレード(30)の側部に
互いに対向している複数の穴(42a)、 (42b)
をレーザ光や加工屑による支障を受けずに安定して加工
を行えるようになった。[Effects of the Invention] Since the energy density of the pulsed laser beam (34) is reduced by the scattering effect of the granules, the inner surface of the hollow body is not damaged. In addition, machining debris generated during drilling was expelled from the hole to the outside at once by the ejection of the low melting point substance (31). For this reason, the condensing lens (36) can be made to have a large depth of focus, and the pulsed laser beam (34)
The focusing distance has become longer, and it has become possible to form holes with good parallelism, where the openings at both ends of the hole have approximately the same diameter, and are clean and free of machining debris. Furthermore, since the mixture of the low melting point substance (31) and the granules (32) is solidified unless it is irradiated with the pulsed laser light (34), even if the already machined hole is placed on the lower side, the granules (32)
32) cannot flow out of this hole, for example, a plurality of mutually opposite holes (42a), (42b) on the side of the turbine blade (30) as shown in FIG.
It is now possible to perform stable processing without being hindered by laser light or processing debris.
第1図は本発明を説明するための概要図、第2図は被加
工物の部分拡大斜視図、第3図および第4図は従来例を
示す断面図である。
(31)・
(32)・
(33)・
(36)・
・低融点物質
・粒状体
ψノぐルスレ
・集光レンズ
サ発振器FIG. 1 is a schematic diagram for explaining the present invention, FIG. 2 is a partially enlarged perspective view of a workpiece, and FIGS. 3 and 4 are sectional views showing a conventional example. (31), (32), (33), (36), low melting point substance, granular body ψ noggle thread, converging lens oscillator
Claims (1)
行うレーザ穴あけ方法において、上記中空体の内側に上
記レーザ光を散乱させる粒状体を低融点物質内に分散さ
せた混合物を充填して上記照射を行うことを特徴とする
レーザ穴あけ方法。In the laser drilling method of drilling a hole in the hollow body by irradiating the outer surface of the hollow body with a laser beam, the inside of the hollow body is filled with a mixture in which granules that scatter the laser beam are dispersed in a low melting point substance. A laser drilling method characterized by performing the above irradiation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2146221A JPH0441090A (en) | 1990-06-06 | 1990-06-06 | Laser drilling method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2146221A JPH0441090A (en) | 1990-06-06 | 1990-06-06 | Laser drilling method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0441090A true JPH0441090A (en) | 1992-02-12 |
Family
ID=15402851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2146221A Pending JPH0441090A (en) | 1990-06-06 | 1990-06-06 | Laser drilling method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0441090A (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5767482A (en) * | 1995-07-14 | 1998-06-16 | Rolls Royce Plc | Laser barrier material and method |
US5773790A (en) * | 1997-01-21 | 1998-06-30 | General Electric Company | Beam blocking material and method for beam drilling and inspecting cooling holes |
US5914060A (en) * | 1998-09-29 | 1999-06-22 | United Technologies Corporation | Method of laser drilling an airfoil |
US5928534A (en) * | 1998-09-29 | 1999-07-27 | United Technologies Corporation | Method for reducing void volumes in cavities for laser drilling |
US6139303A (en) * | 1998-11-20 | 2000-10-31 | United Technologies Corporation | Fixture for disposing a laser blocking material in an airfoil |
US6177038B1 (en) | 1998-11-20 | 2001-01-23 | United Technologies Corporation | Method for orienting an airfoil for processing and for forming a mask for the airfoil |
US6224361B1 (en) | 1998-11-20 | 2001-05-01 | United Technologies Corportion | Tool for disposing laser blocking material in an airfoil |
US6251315B1 (en) * | 1998-11-20 | 2001-06-26 | United Technologies Corporation | Method for disposing a laser blocking material on the interior of an airfoil |
US6329633B1 (en) * | 1998-11-20 | 2001-12-11 | United Technologies Corporation | Method and material for processing a component for laser machining |
KR100804614B1 (en) * | 2007-03-26 | 2008-02-20 | 위니아만도 주식회사 | Controller assembling device of air conditioner used both clooer and heater |
WO2013004475A1 (en) * | 2011-07-05 | 2013-01-10 | Robert Bosch Gmbh | Method for generating at least one through-hole and device for carrying out such a method |
DE102014200114A1 (en) * | 2014-01-08 | 2015-07-09 | Siemens Aktiengesellschaft | Method for protecting a component, method for laser drilling and component |
CN106392342A (en) * | 2016-12-05 | 2017-02-15 | 清华大学 | Laser drilling device and method for gas turbine blade |
-
1990
- 1990-06-06 JP JP2146221A patent/JPH0441090A/en active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5767482A (en) * | 1995-07-14 | 1998-06-16 | Rolls Royce Plc | Laser barrier material and method |
US5773790A (en) * | 1997-01-21 | 1998-06-30 | General Electric Company | Beam blocking material and method for beam drilling and inspecting cooling holes |
US5914060A (en) * | 1998-09-29 | 1999-06-22 | United Technologies Corporation | Method of laser drilling an airfoil |
US5928534A (en) * | 1998-09-29 | 1999-07-27 | United Technologies Corporation | Method for reducing void volumes in cavities for laser drilling |
US6139303A (en) * | 1998-11-20 | 2000-10-31 | United Technologies Corporation | Fixture for disposing a laser blocking material in an airfoil |
US6177038B1 (en) | 1998-11-20 | 2001-01-23 | United Technologies Corporation | Method for orienting an airfoil for processing and for forming a mask for the airfoil |
US6224361B1 (en) | 1998-11-20 | 2001-05-01 | United Technologies Corportion | Tool for disposing laser blocking material in an airfoil |
US6251315B1 (en) * | 1998-11-20 | 2001-06-26 | United Technologies Corporation | Method for disposing a laser blocking material on the interior of an airfoil |
US6329633B1 (en) * | 1998-11-20 | 2001-12-11 | United Technologies Corporation | Method and material for processing a component for laser machining |
KR100804614B1 (en) * | 2007-03-26 | 2008-02-20 | 위니아만도 주식회사 | Controller assembling device of air conditioner used both clooer and heater |
WO2013004475A1 (en) * | 2011-07-05 | 2013-01-10 | Robert Bosch Gmbh | Method for generating at least one through-hole and device for carrying out such a method |
DE102014200114A1 (en) * | 2014-01-08 | 2015-07-09 | Siemens Aktiengesellschaft | Method for protecting a component, method for laser drilling and component |
CN106392342A (en) * | 2016-12-05 | 2017-02-15 | 清华大学 | Laser drilling device and method for gas turbine blade |
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