JPH0440849Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a carrier plate used when polishing a round bar with a vertical lapping machine.

[Prior Art] FIGS. 7 and 8 show a conventional vertical lap board. This vertical lap board consists of a lower lap plate 1 rotatably provided on a main body (not shown), an upper lap plate 2 rotatably arranged opposite to the lower lap plate 1, and upper and lower lap plates 1. , 2, the main component is a carrier plate 3 which is rotatably arranged eccentrically with respect to these axes.
has a configuration in which a plurality of long holes 5 are formed in a disc-shaped carrier plate main body 4 with the longitudinal direction oriented in the radial direction. In this vertical lapping machine, a round bar 6 is inserted into the elongated hole 5 with its axis facing the longitudinal direction, and with the lapping plates 1 and 2 in contact with the surface of the round bar 6, The round bar 6 is polished by supplying a polishing liquid to the surfaces of the lap plates 1 and 2 from the center thereof and rotating the lap plates 1 and 2 and the carrier plate 3 relative to each other.

Here, the polishing liquid is sent to the outer circumferential direction of the carrier plate 3 through the gap between the carrier plate 3 and the lap plates 1 and 2 by centrifugal force, and is sent to the wall portion of the elongated hole 5 facing the rotation direction. The material is then scraped up and filled into the elongated hole 5, adheres to the lap plates 1 and 2, and is taken out from the side edge of the elongated hole 5. In this way, the polishing liquid is present in the gap between the carrier plate 3 and the lap plates 1 and 2 without being extremely scattered toward the outer periphery due to centrifugal force.
By being interposed between the surface of the round bar and the lap plates 1 and 2, the surface of the round bar can be polished.

[Problems that the invention attempts to solve] By the way, in the wet lapping board as mentioned above,
The round bar and the lap plate are moved relative to each other, and the round bar is polished using the polishing liquid interposed between the surface of the round bar and the lap plate, so that the polishing liquid is transferred between the lap plate and the carrier plate. It is necessary to intervene uniformly throughout the gap between the

However, in the above-mentioned carrier plate, the polishing liquid scraped up by the walls of the long holes is biased towards the outer periphery of the long holes due to centrifugal force, so it adheres to the lap plate and is taken out from the long holes. The amount of polishing liquid is smaller on the inner circumferential side than on the outer circumferential side. For this reason, the polishing liquid is biased towards the outer circumference of the lap plate.
There was a problem in that the inner end of the round bar was polished less than the other end, making it impossible to obtain the necessary cylindricity.

This invention was made to solve the above problem, and the polishing liquid can be uniformly interposed between the lap plate and the carrier plate, so that the round bar can be uniformly distributed over its entire length. The purpose of the present invention is to provide a carrier plate that can be polished to obtain highly accurate cylindricity.

[Means for solving the problem] This invention was made to achieve the above object, and includes a plurality of holes extending circumferentially from the longitudinal side edge of the elongated hole on at least one end surface of the carrier plate main body. It has grooves formed therein.

[Function] Since the grooves are formed to extend in the radial direction of the carrier plate body from the side edges of the long holes, the polishing liquid filled in the grooves is scraped up by the side walls of the long holes and is subjected to centrifugal force. Because of this, it does not move toward the outer periphery, and it adheres to the lap plate at the tip of the groove in the extending direction and is uniformly taken out.

[Embodiment] FIGS. 1 and 2 are diagrams showing an embodiment of the present invention.

In FIG. 1, reference numeral 7 indicates a carrier plate main body. The carrier plate main body 7 has a disc shape, and a plurality of long holes 8 penetrating from one end surface to the other end surface and having the longitudinal direction oriented in the radial direction are circularly formed in the wall of the carrier plate main body 7. It is formed to equally divide the circumference. Further, a plurality of grooves 9 are formed on both end surfaces of the carrier plate main body 7, extending in the circumferential direction from both longitudinal side edges 8a, 8b of the elongated hole 8.

The groove 9 has an outer circumferential wall formed in an R-curved surface whose center of curvature is the axis of the carrier plate main body 7, and an inner circumferential wall formed in an R-curved surface with a larger radius of curvature than the wall. There is. And these 2
The two walls coincide at their tips, and the tips are needle-shaped with an acute angle in plan view. Further, the groove 9 has a U-shaped axial cross-sectional shape, and has a constant depth in the longitudinal direction. As a result, the axial cross-sectional area of the groove 9 is
It gradually becomes smaller as it goes in the extending direction from the elongated hole 8 side.

In the carrier plate having the above structure, when polishing the round bar 10, the polishing liquid moved toward the outer circumference by centrifugal force is transferred to the side edge of the elongated hole 8 facing in the rotational direction (direction of arrow A in the figure). 8a and move toward the inner circumferential side along the wall of the elongated hole 8, and this groove 9 extends from the side edge 8a.
...Since the polishing liquid is filled inside, the polishing liquid does not move to the outer circumferential side. Since the polishing liquid in the groove 9 adheres to the lap plate and is uniformly taken out from the tip of the groove 9, the polishing liquid can be uniformly interposed between the lap plate and the carrier plate. Therefore, the round bar 10 can be polished uniformly over its entire length, and can have highly accurate cylindricity.

Furthermore, in the above embodiment, since the axial cross-sectional area of the groove 9 is configured to gradually decrease from the elongated hole 8 side toward the extending direction, the polishing liquid may adhere to the lap plate and the tip of the groove 9. It is taken out as if pulling a thread without interruption. As a result, the polishing liquid can be evenly distributed between the lap plate and the carrier plate in the circumferential direction, so that a round bar with high accuracy in roundness can be obtained.

Furthermore, in the above embodiment, since the grooves 9 are provided on both sides of the elongated hole 8, the carrier plate can be used in either direction of rotation.

In the above embodiment, the grooves 9 are formed on both end surfaces of the carrier plate main body 7, but the same effect as described above can be obtained even if the grooves 9 are formed only on one end surface. Further, although the axial cross-sectional area of the groove 9 is configured to gradually decrease from the inner circumferential side to the outer circumferential side, the axial cross-sectional area may be made constant by keeping the widthwise dimension of the groove 9 constant.

Further, the axial cross-sectional shape of the groove 9 is not limited to the U-shape, but may be V-shape or U-shape. Further, in the above embodiment, the depth in the longitudinal direction of the groove 9 is constant, but as shown in FIG. 3, the bottom surface of the groove 9 has an upward slope from the long hole 8 side toward the extending direction The polishing liquid taken out from the groove 9 is made into an inclined surface, and by forming the wall surface from the bottom of the groove 9 to the surface of the carrier plate body at the tip of the groove 9 into an R curved surface as shown in FIG. You may adjust the amount. Further, the groove 9 may penetrate from one end surface of the carrier plate main body 7 to the other end surface.

Further, FIGS. 5 and 6 are diagrams showing still other embodiments of the present invention, respectively.

The carrier plate shown in FIG. 5 is used by rotating it in the direction of arrow A, and the carrier plate shown in FIG. 6 is used by rotating it in the direction of arrow B. This provides the same effects as the embodiment.

[Effects of the invention] As explained above, in the carrier plate for round bar polishing according to the invention, a plurality of grooves extending in the circumferential direction from the longitudinal side edge of the elongated hole are formed on at least one end surface of the carrier plate main body. As a result, the polishing liquid can be uniformly interposed between the lap plate and the carrier plate, and therefore the round bar can be polished uniformly over its entire length, achieving high-precision cylindricity. You can get the effect that you can.

[Brief explanation of the drawing]

1 and 2 are views showing an embodiment of this invention, in which FIG. 1 is a plan view showing a carrier plate, FIG. FIG. 4 is a diagram showing an example of application of the cross-sectional shape of the groove, in which FIG. 3 is a sectional view taken along the - line in FIG. 1, and FIG. 4 is a - line sectional view in FIG. 1.
A line sectional view, FIGS. 5 and 6 are views showing still other embodiments of the present invention, respectively, and a plan view showing a carrier plate, and FIGS. 7 and 8 show a conventional carrier plate. Figure 7
The figure is a side sectional view showing the vertical lapping board, and FIG. 8 is a plan view showing the carrier plate. 3... Carrier plate, 4... Carrier plate body, 5... Long hole, 7... Carrier plate main body, 8... Long hole, 9... Groove.

Claims (1)

[Claims for Utility Model Registration] (1) A carrier plate in which a long hole is formed in a disc-shaped carrier plate body, penetrating from one end face to the other end face, and with the longitudinal direction oriented in the radial direction. A carrier plate for polishing round bars, characterized in that a plurality of grooves extending circumferentially from the longitudinal side edge of the elongated hole are formed on at least one end surface of the carrier plate main body. (2) A carrier for polishing a round bar according to claim 1 of the utility model registration claim, wherein the axial cross-sectional area of the groove is set smaller on the extending direction side than on the elongated hole side. plate.