JPH0440839B2 - - Google Patents
Info
- Publication number
- JPH0440839B2 JPH0440839B2 JP56055770A JP5577081A JPH0440839B2 JP H0440839 B2 JPH0440839 B2 JP H0440839B2 JP 56055770 A JP56055770 A JP 56055770A JP 5577081 A JP5577081 A JP 5577081A JP H0440839 B2 JPH0440839 B2 JP H0440839B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- molded
- sheet
- surface resistivity
- conductive paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003973 paint Substances 0.000 claims description 14
- 229920001169 thermoplastic Polymers 0.000 claims description 5
- 239000004416 thermosoftening plastic Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000006229 carbon black Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 description 8
- 230000003068 static effect Effects 0.000 description 8
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 239000006230 acetylene black Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
Description
本発明は、導電性・帯電防止性を有する成形容
器に関するものであり、IC等の静電気障害を起
しやすい電子部品等を収納する用途に適したもの
である。
電子機器製品の高度化、精密化、高密度化に伴
ない、IC、LSI、VLSI等が数多く組み込まれる
様になつてきている。しかしこれらは微少の静電
気放電・帯電によつても障害を来し、いわゆる静
電気破壊され機能性を損いやすい。
従来、これらICやチツプ部品デバイス等が保
管、区分け、輸送、取り付け作業など各種工程に
亘つて取り扱われるに際しては、塩化ビニル、ポ
リスチレン、ポリカーボネート、ポリプロピレ
ン、ポリエチレン、ポリアミド、ポリエステル、
ABS樹脂等から成る塑性成形可能な熱可塑性樹
脂シートを内容物に応じた所定の形状に成形し容
器として用いていた。これに前述のIC部品等を
収納していたが、これらは表面固有抵抗が1013Ω
以上であり極めて帯電しやすく、そして帯電した
電荷が逃げにくく、内容物である電子部品に悪影
響を及ぼし、静電破壊を生じやすかつた。そのた
めこの事故を防ぐため、これらを収納し、その後
この容器をアルミ箔等の金属箔で覆い帯電防止を
行なつているのが一般的であつた。
しかしこの事は2重の作業を必要としまた輸送
等での摺動による摩擦帯電が容器底部と接触して
いる内容物部品との間で発生する事もあり万全な
方策ではなかつた。
また容器自体に帯電防止性能をもたせる事も為
されてきている。すなわち前述の各種熱可塑性樹
脂中に帯電防止性を有するカチオン系、アニオン
系、非イオン系、および両性系からなる各種界面
活性剤を混練、溶融成膜ミート化したのち容器と
なすものであるが、この場合この帯電防止剤は熱
分解を起したり、表面から脱落したり、低湿度下
で効果が低減するなどの欠点があつた。更に、こ
れら界面活性剤から成る帯電防止剤は熱可塑性樹
脂の表面固有抵抗を1010Ω程度に減ずるのが限界
であり、電子部品等の容器への適用には性能面で
不満足なものであつた。
また、導電性にすぐれたカーボンブラツク粉末
あるいはカーボン繊維を上記と同様に溶融混練す
る事も行なわれるが、この場合、導電性にすぐれ
たものを得ようとして添加量を増すに従つて加工
性、成形性等の樹脂本来の物性が大巾に低下し、
実用上は種々問題があつた。
本発明は、上記の様な種々の問題を解決すべく
検討の結果得られたものであつて塑性成形可能な
熱可塑性樹脂シートの表面に導電性組成物層を塗
工形成したのち、これを所望の容器形状に成形し
たものでIC等の電子部品の収納用に供するもの
である。
IC等の電子部品の静電気障害を受けやすいも
のに対してはこれらの包装容器の表面抵抗を106
Ω以下にすれば、静電気障害の防止が可能と言わ
れている。
本発明は、第1図に示すようにポリエステル、
ポリアミド、アクリル、酢酸ビニル、環化ゴム等
の樹脂溶液中にアセチレンブラツクを添加した導
電性塗料1を塑性成形可能な熱可塑性シート2の
両面に既知の手法にて塗布し、成形シートを、第
2図に示すように塑性成形してなる導電性、帯電
防止性成形容器である。
本発明の成形容器の表面固有抵抗は106Ω以下
で十分に電子部品等を収納し得るものである。
本発明の熱可塑性シート2は、ポリ塩化ビニ
ル、ポリスチレン、ポリカーボネート、ポリプロ
ピレン、ポリエチレン、ABS樹脂からなり、導
電性塗料2は、熱可塑性シート1との接着性も考
慮して選択される。
導電性塗料は、成形容器の両面に、しかも片面
は、内容物と接する面に施されておらねばならな
い。また塗工面は全面に形成することの他に、意
匠性等を考慮して格子状、網目状等の連続模様と
なる様に形成してもよい。なお連続模様の必要性
は部分的に電位差の生じないためである。
また導電性塗料に添加する導電性材料としてア
セチレンカーボンブラツクが取り扱いの点で有用
であり、添加量が10〜40重量%で表面固有抵抗が
106Ω以下となる。添加量が10重量%未満である
と表面固有抵抗が106Ωを超える恐れがあり、ま
た40重量%を超えると塗料としての塗布適性、塗
布後の成形性に問題があり、好ましくない。
さらに所定の表面抵抗を損なわない範囲で導電
性塗料上に塗料の保護のため熱可塑性樹脂からな
る保護層を設けてもよい。
本発明の容器は、両面に106Ω以下の表面固有
抵抗を有する導電性塗料が連続して設けられたシ
ートを形成した容器であるから、電子部品を収納
する側、および外側にも静電気が帯電することが
なく、輸送、保管時に積み重ねた状態としても静
電気障害が発生しない。
また、シートを成形した後、導電性塗料を設け
る場合は、連続的に設けるのが困難であるが、本
発明は、予じめシートの両面に表面固有抵抗が
106Ω以下の導電性塗料を設け、成形したので、
一定の表面固有抵抗を有する容器が容易に得られ
る。
次に本発明の実施例について説明する。
〔実施例〕
塑性成型可能な硬質塩化ビニル樹脂シート
(0.2〓厚)の両面に下記組成からなる導電性塗料
をグラビア版90μ版深で塗工し、塗布量4.5g/m2
(固形量)の成形シートを成形温度120℃で真空成
形法により第2図のような形状の成形容器を得
た。
(導電性塗料)
アセチレンブラツク
(デンカブラツク50%プレス品) 100重量部
(電気化学工業(株))
不飽和ポリエステル樹脂
(バイロン#200) 400 〃
(東洋紡(株))
ホモゲノールL−18
(界面活性剤、分散剤) 10 〃
(花王アトラス(株))
トルエン (溶剤) 1000 〃
メチルエチルケトン(溶剤) 1000 〃
本発明の成形容器の表面固有抵抗、帯電々位及
び帯電減衰時間等の電気特性は下記表の様であつ
た。
The present invention relates to a molded container having conductive and antistatic properties, and is suitable for storing electronic components such as ICs that are prone to electrostatic damage. As electronic equipment products become more sophisticated, precise, and dense, many ICs, LSIs, VLSIs, etc. are being incorporated into them. However, these materials can be damaged even by minute electrostatic discharges or charges, and are susceptible to so-called static electricity damage, which impairs functionality. Conventionally, when these ICs and chip parts devices are handled through various processes such as storage, sorting, transportation, and installation, they are made of vinyl chloride, polystyrene, polycarbonate, polypropylene, polyethylene, polyamide, polyester,
A plastically moldable thermoplastic resin sheet made of ABS resin or the like was molded into a predetermined shape depending on the contents and used as a container. This housed the aforementioned IC parts, which have a surface resistivity of 10 13 Ω.
As described above, it was extremely easy to be charged, and the charged electric charge was difficult to escape, adversely affecting the electronic components contained therein and easily causing electrostatic damage. Therefore, in order to prevent this accident, it was common to store these items and then cover the container with metal foil such as aluminum foil to prevent static electricity. However, this required double work, and frictional electrification due to sliding during transportation could occur between the bottom of the container and the contents in contact, so it was not a perfect solution. In addition, attempts have been made to provide the container itself with antistatic properties. That is, various types of surfactants consisting of cationic, anionic, nonionic, and amphoteric surfactants having antistatic properties are kneaded into the various thermoplastic resins mentioned above, melted and formed into a film-formed meat, which is then made into a container. In this case, this antistatic agent had drawbacks such as thermal decomposition, falling off the surface, and reduced effectiveness under low humidity conditions. Furthermore, antistatic agents made of these surfactants have a limit of reducing the surface resistivity of thermoplastic resins to about 10 10 Ω, and are unsatisfactory in terms of performance when applied to containers for electronic components. Ta. Carbon black powder or carbon fiber, which has excellent conductivity, is also melt-kneaded in the same manner as above, but in this case, in order to obtain something with excellent conductivity, as the amount added increases, the processability deteriorates. The original physical properties of the resin, such as moldability, deteriorate significantly,
In practice, various problems arose. The present invention was obtained as a result of studies to solve the various problems described above, and is made by coating and forming a conductive composition layer on the surface of a plastically moldable thermoplastic resin sheet. It is molded into a desired container shape and is used for storing electronic components such as ICs. For electronic components such as ICs that are susceptible to static electricity damage, the surface resistance of these packaging containers should be increased to 10 6
It is said that static electricity damage can be prevented if the resistance is set to Ω or less. As shown in FIG. 1, the present invention uses polyester,
A conductive paint 1 containing acetylene black added to a resin solution of polyamide, acrylic, vinyl acetate, cyclized rubber, etc. is applied to both sides of a plastically moldable thermoplastic sheet 2 by a known method. As shown in Fig. 2, it is a conductive and antistatic molded container formed by plastic molding. The surface resistivity of the molded container of the present invention is 10 6 Ω or less, which is sufficient to accommodate electronic components and the like. The thermoplastic sheet 2 of the present invention is made of polyvinyl chloride, polystyrene, polycarbonate, polypropylene, polyethylene, and ABS resin, and the conductive paint 2 is selected taking into account its adhesiveness with the thermoplastic sheet 1. The conductive paint must be applied to both sides of the molded container, and one side must be in contact with the contents. Further, in addition to forming the coated surface on the entire surface, it may be formed in a continuous pattern such as a lattice shape or a mesh shape in consideration of the design and the like. Note that the continuous pattern is necessary partly because no potential difference occurs. In addition, acetylene carbon black is useful as a conductive material added to conductive paint in terms of handling, and when added in an amount of 10 to 40% by weight, the surface resistivity increases.
10 6 Ω or less. If the amount added is less than 10% by weight, the surface resistivity may exceed 10 6 Ω, and if it exceeds 40% by weight, there will be problems in the applicability as a paint and the moldability after application, which is not preferable. Furthermore, a protective layer made of a thermoplastic resin may be provided on the conductive paint to protect the paint within a range that does not impair the predetermined surface resistance. Since the container of the present invention is a container formed of a sheet in which conductive paint having a surface resistivity of 10 6 Ω or less is continuously provided on both sides, static electricity is not generated on the side where electronic components are stored and also on the outside. There is no charge, and static electricity does not occur even when stacked during transportation or storage. In addition, when applying conductive paint after forming a sheet, it is difficult to apply it continuously, but in the present invention, the surface resistivity is applied on both sides of the sheet in advance.
Since it was molded with conductive paint of 10 6 Ω or less,
Containers with constant surface resistivity are easily obtained. Next, examples of the present invention will be described. [Example] A conductive paint having the following composition was applied to both sides of a plastically moldable hard vinyl chloride resin sheet (0.2〓thickness) to a gravure plate depth of 90μ, and the coating amount was 4.5g/m 2
A molded container having a shape as shown in FIG. 2 was obtained by vacuum forming a molded sheet of (solid amount) at a molding temperature of 120°C. (Conductive paint) Acetylene black (Denka black 50% pressed product) 100 parts by weight (Denka Kagaku Kogyo Co., Ltd.) Unsaturated polyester resin (Vylon #200) 400〃 (Toyobo Co., Ltd.) Homogenol L-18 (Surface active (Kao Atlas Co., Ltd.) Toluene (solvent) 1000 Methyl ethyl ketone (solvent) 1000 Electrical properties such as surface resistivity, charge level and charge decay time of the molded container of the present invention are shown in the table below. It was like that.
【表】【table】
【表】
本発明の容器は、両面に106Ω以下の表面固有
抵抗を有するので、IC等の電子部品を収納する
側、および外側にも静電気が帯電することがな
く、また導電塗料を連続的に設けた構成なので、
IC等の電子部品を収納し、輸送保管等において
静電気障害による機能性の低下が発生せず、保護
容器として優れたものである。[Table] Since the container of the present invention has a surface resistivity of 10 6 Ω or less on both sides, static electricity does not build up on the side where electronic components such as ICs are stored, and on the outside as well. Because it is a configuration set up specifically for
It is an excellent protective container for storing electronic components such as ICs, and does not suffer from deterioration in functionality due to static electricity during transportation and storage.
第1図は、本発明の成形容器に用いるシートの
断面図、第2図は、本発明の成形容器の一実施例
を示す説明図である。
1…導電性塗料、2…熱可塑性シート。
FIG. 1 is a sectional view of a sheet used in the molded container of the present invention, and FIG. 2 is an explanatory diagram showing one embodiment of the molded container of the present invention. 1... Conductive paint, 2... Thermoplastic sheet.
Claims (1)
チレンカーボンブラツクからなる導電性材料を、
表面固有抵抗が106Ω以下の導電性塗料を連続的
に設けた成形シートを塑性成形してなる導電性、
帯電防止性容器。1. A conductive material made of acetylene carbon black is coated on both sides of a thermoplastic sheet that can be plastically molded.
Conductive material made by plastically molding a molded sheet continuously coated with a conductive paint with a surface resistivity of 10 6 Ω or less,
Antistatic container.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5577081A JPS57170500A (en) | 1981-04-14 | 1981-04-14 | Conductive and static charge eliminating molded container |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5577081A JPS57170500A (en) | 1981-04-14 | 1981-04-14 | Conductive and static charge eliminating molded container |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57170500A JPS57170500A (en) | 1982-10-20 |
JPH0440839B2 true JPH0440839B2 (en) | 1992-07-06 |
Family
ID=13008098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5577081A Granted JPS57170500A (en) | 1981-04-14 | 1981-04-14 | Conductive and static charge eliminating molded container |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57170500A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59192842U (en) * | 1983-06-10 | 1984-12-21 | 共同印刷株式会社 | IC card case |
JPS61148702A (en) * | 1984-12-21 | 1986-07-07 | セイコ−化成株式会社 | Conductive material |
JPS6233199U (en) * | 1985-08-13 | 1987-02-27 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS558606A (en) * | 1978-06-30 | 1980-01-22 | Nippon Form Service Kk | Storage unit of magnetic record and so on |
-
1981
- 1981-04-14 JP JP5577081A patent/JPS57170500A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS558606A (en) * | 1978-06-30 | 1980-01-22 | Nippon Form Service Kk | Storage unit of magnetic record and so on |
Also Published As
Publication number | Publication date |
---|---|
JPS57170500A (en) | 1982-10-20 |
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