JPH0440589U - - Google Patents

Info

Publication number
JPH0440589U
JPH0440589U JP8057690U JP8057690U JPH0440589U JP H0440589 U JPH0440589 U JP H0440589U JP 8057690 U JP8057690 U JP 8057690U JP 8057690 U JP8057690 U JP 8057690U JP H0440589 U JPH0440589 U JP H0440589U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
cooling structure
heat sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8057690U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8057690U priority Critical patent/JPH0440589U/ja
Publication of JPH0440589U publication Critical patent/JPH0440589U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP8057690U 1990-07-31 1990-07-31 Pending JPH0440589U (US20020095090A1-20020718-M00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8057690U JPH0440589U (US20020095090A1-20020718-M00002.png) 1990-07-31 1990-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8057690U JPH0440589U (US20020095090A1-20020718-M00002.png) 1990-07-31 1990-07-31

Publications (1)

Publication Number Publication Date
JPH0440589U true JPH0440589U (US20020095090A1-20020718-M00002.png) 1992-04-07

Family

ID=31625764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8057690U Pending JPH0440589U (US20020095090A1-20020718-M00002.png) 1990-07-31 1990-07-31

Country Status (1)

Country Link
JP (1) JPH0440589U (US20020095090A1-20020718-M00002.png)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284862A (ja) * 2000-03-30 2001-10-12 Tech Res & Dev Inst Of Japan Def Agency 電子機器冷却装置
JP2011000884A (ja) * 2009-06-17 2011-01-06 Laird Technologies Inc 適合型多層熱伝導性中間構体およびそれを具備するメモリモジュール
JP2015211144A (ja) * 2014-04-28 2015-11-24 日立オートモティブシステムズ株式会社 電子回路装置およびその製造方法
JP2016100512A (ja) * 2014-11-25 2016-05-30 日本電気株式会社 冷却装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284862A (ja) * 2000-03-30 2001-10-12 Tech Res & Dev Inst Of Japan Def Agency 電子機器冷却装置
JP2011000884A (ja) * 2009-06-17 2011-01-06 Laird Technologies Inc 適合型多層熱伝導性中間構体およびそれを具備するメモリモジュール
JP2015211144A (ja) * 2014-04-28 2015-11-24 日立オートモティブシステムズ株式会社 電子回路装置およびその製造方法
JP2016100512A (ja) * 2014-11-25 2016-05-30 日本電気株式会社 冷却装置

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