JPH0440555U - - Google Patents
Info
- Publication number
- JPH0440555U JPH0440555U JP8318190U JP8318190U JPH0440555U JP H0440555 U JPH0440555 U JP H0440555U JP 8318190 U JP8318190 U JP 8318190U JP 8318190 U JP8318190 U JP 8318190U JP H0440555 U JPH0440555 U JP H0440555U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- light
- emitting element
- circuit pattern
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002310 reflectometry Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Description
第1図は電子機器の縦断面図、第2図は従来の
電子機器の縦断面図、第3図、第4図、第5図、
第6図および第7図は、他の実施例による電子機
器の縦断面図である。 1……発光素子、2……回路基板、21……回
路パターン、22……鏡面仕上げ部、23……乱
反射仕上げ部、24……反射皮膜、25……凹部
。
電子機器の縦断面図、第3図、第4図、第5図、
第6図および第7図は、他の実施例による電子機
器の縦断面図である。 1……発光素子、2……回路基板、21……回
路パターン、22……鏡面仕上げ部、23……乱
反射仕上げ部、24……反射皮膜、25……凹部
。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 少なくとも回路基板と発光素子を有する電
子機器において、前記発光素子を固定するととも
に、前記発光素子を取付けた面に前記発光素子の
平面サイズより大きな寸度の回路パターンを形成
した回路基板を有する電子機器。 (2) 回路パターンに鏡面仕上げを施した請求項
1記載の電子機器。 (3) 回路パターンに乱反射を起こす仕上げを施
した請求項1記載の電子機器。 (4) 回路パターンの上面に、前記発光素子の発
する光線の反射率の高い材料の皮膜を形成した請
求項1記載の電子機器。 (5) 回路基板を凹形状にした請求項1記載の電
子機器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8318190U JPH0440555U (ja) | 1990-08-06 | 1990-08-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8318190U JPH0440555U (ja) | 1990-08-06 | 1990-08-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0440555U true JPH0440555U (ja) | 1992-04-07 |
Family
ID=31630631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8318190U Pending JPH0440555U (ja) | 1990-08-06 | 1990-08-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0440555U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008041811A (ja) * | 2006-08-03 | 2008-02-21 | Ngk Spark Plug Co Ltd | 配線基板および多数個取り配線基板ならびにその製造方法 |
US10615324B2 (en) | 2013-06-14 | 2020-04-07 | Cree Huizhou Solid State Lighting Company Limited | Tiny 6 pin side view surface mount LED |
-
1990
- 1990-08-06 JP JP8318190U patent/JPH0440555U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008041811A (ja) * | 2006-08-03 | 2008-02-21 | Ngk Spark Plug Co Ltd | 配線基板および多数個取り配線基板ならびにその製造方法 |
US10615324B2 (en) | 2013-06-14 | 2020-04-07 | Cree Huizhou Solid State Lighting Company Limited | Tiny 6 pin side view surface mount LED |
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