JPH0440555U - - Google Patents

Info

Publication number
JPH0440555U
JPH0440555U JP8318190U JP8318190U JPH0440555U JP H0440555 U JPH0440555 U JP H0440555U JP 8318190 U JP8318190 U JP 8318190U JP 8318190 U JP8318190 U JP 8318190U JP H0440555 U JPH0440555 U JP H0440555U
Authority
JP
Japan
Prior art keywords
electronic device
light
emitting element
circuit pattern
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8318190U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8318190U priority Critical patent/JPH0440555U/ja
Publication of JPH0440555U publication Critical patent/JPH0440555U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Description

【図面の簡単な説明】
第１図は電子機器の縦断面図、第２図は従来の
電子機器の縦断面図、第３図、第４図、第５図、
第６図および第７図は、他の実施例による電子機
器の縦断面図である。 １……発光素子、２……回路基板、２１……回
路パターン、２２……鏡面仕上げ部、２３……乱
反射仕上げ部、２４……反射皮膜、２５……凹部
。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 少なくとも回路基板と発光素子を有する電
    子機器において、前記発光素子を固定するととも
    に、前記発光素子を取付けた面に前記発光素子の
    平面サイズより大きな寸度の回路パターンを形成
    した回路基板を有する電子機器。 (2) 回路パターンに鏡面仕上げを施した請求項
    １記載の電子機器。 (3) 回路パターンに乱反射を起こす仕上げを施
    した請求項１記載の電子機器。 (4) 回路パターンの上面に、前記発光素子の発
    する光線の反射率の高い材料の皮膜を形成した請
    求項１記載の電子機器。 (5) 回路基板を凹形状にした請求項１記載の電
    子機器。
JP8318190U 1990-08-06 1990-08-06 Pending JPH0440555U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8318190U JPH0440555U (ja) 1990-08-06 1990-08-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8318190U JPH0440555U (ja) 1990-08-06 1990-08-06

Publications (1)

Publication Number Publication Date
JPH0440555U true JPH0440555U (ja) 1992-04-07

Family

ID=31630631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8318190U Pending JPH0440555U (ja) 1990-08-06 1990-08-06

Country Status (1)

Country Link
JP (1) JPH0440555U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008041811A (ja) * 2006-08-03 2008-02-21 Ngk Spark Plug Co Ltd 配線基板および多数個取り配線基板ならびにその製造方法
US10615324B2 (en) 2013-06-14 2020-04-07 Cree Huizhou Solid State Lighting Company Limited Tiny 6 pin side view surface mount LED

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008041811A (ja) * 2006-08-03 2008-02-21 Ngk Spark Plug Co Ltd 配線基板および多数個取り配線基板ならびにその製造方法
US10615324B2 (en) 2013-06-14 2020-04-07 Cree Huizhou Solid State Lighting Company Limited Tiny 6 pin side view surface mount LED

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