JPH0440555U - - Google Patents
Info
- Publication number
- JPH0440555U JPH0440555U JP8318190U JP8318190U JPH0440555U JP H0440555 U JPH0440555 U JP H0440555U JP 8318190 U JP8318190 U JP 8318190U JP 8318190 U JP8318190 U JP 8318190U JP H0440555 U JPH0440555 U JP H0440555U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- light
- emitting element
- circuit pattern
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002310 reflectometry Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8318190U JPH0440555U (US06650917-20031118-M00005.png) | 1990-08-06 | 1990-08-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8318190U JPH0440555U (US06650917-20031118-M00005.png) | 1990-08-06 | 1990-08-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0440555U true JPH0440555U (US06650917-20031118-M00005.png) | 1992-04-07 |
Family
ID=31630631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8318190U Pending JPH0440555U (US06650917-20031118-M00005.png) | 1990-08-06 | 1990-08-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440555U (US06650917-20031118-M00005.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008041811A (ja) * | 2006-08-03 | 2008-02-21 | Ngk Spark Plug Co Ltd | 配線基板および多数個取り配線基板ならびにその製造方法 |
| US10615324B2 (en) | 2013-06-14 | 2020-04-07 | Cree Huizhou Solid State Lighting Company Limited | Tiny 6 pin side view surface mount LED |
-
1990
- 1990-08-06 JP JP8318190U patent/JPH0440555U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008041811A (ja) * | 2006-08-03 | 2008-02-21 | Ngk Spark Plug Co Ltd | 配線基板および多数個取り配線基板ならびにその製造方法 |
| US10615324B2 (en) | 2013-06-14 | 2020-04-07 | Cree Huizhou Solid State Lighting Company Limited | Tiny 6 pin side view surface mount LED |
